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Bicheng Newly shipped PCB

Rogers laminates fabricate RO3006 2-layer RF PCB with Pure gold wire bonding for Microwave PCB design

Rogers RO3003 laminates High-frequency 2-layer RF PCB using in Automotive radar design, Patch antennas

RF-10 2-layer High-frequency PCB with Low dissipation factor and High dielectric constant for RF and microwav

F4BTMS255 2-Layer PCB built on 60mil Thick substrates with Immersion Gold Finish using in Radar, military radar

Copper Coin Embedded 6-Layer Hybrid PCB: M6 and IT180 for High-Performance Applications

TP600 2-layer rigid PCB laminate thick 5.08mm (200mil) and a finished thickness of 5.1mm using in miniaturized antenna

Rogers PCB Board

Rogers RO3035 High Frequency PCB 2-Layer Rogers 3035 10mil Cirucit Board DK3.5 DF 0.0015 Microwave PCB

Rogers RO3003 High Frequency Printed Circuit Board 2-Layer Rogers 3003 30mil 0.762mm PCB with DK3.0 DF 0.001

Rogers RO3010 High Frequency PCB 2-Layer Rogers 3010 10mil 0.254mm Printed Circuit Board DK10.2 DF 0.0022 Microwave PCB

Rogers RO3006 RF Printed Circuit Board 2-Layer Rogers 3006 50mil 1.27mm Microwave PCB with Immersion Gold

Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB

Taconic PCB Board

CER-10 RF Printed Circuit Board 2-Layer CER-10 62mil 1.58mm PCB with Immersion Gold

TLX-7 Taconic High Frequency PCB Made on 62mil 1.575mm With Immersion Silver

PTFE PCB Board

Flexible Printed Circuit

FPC PCBA Fabrication Impedance Flexible PCB Cable With FR4 Stiffener and Immersion Nickel

FPC PCBA Fabrication Flex PCB Board With 3M Tape and Stainless Steel Stiffener For Antenna

FPC Circuit Board Made On PET Material FPC PCBA Fabrication Flexible PCB for Patch Antenna

FPC Circuit Board Made On PET Material with Immersion Gold FPC PCBA Fabrication

FPC Assembly for Mobile Device and Computer Equipment

Multilayer PCB Board

6 Layer High Frequency PCB Built On 3 Cores of 20mil RO4003C and 4mil RO4450F for Radar Altimeter

High Temperature PCB

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

HDI PCB Board

Stacked via Staggered via HDI | PCB 1+N+1 HDI PCB | 2+N+2 HDI PCB| How to Distinguish the Step (Stack-up) of HDI PCB?

Hybrid 10-Layer PCB Rogers RO4350 6.6mil+FR4 Hybrid PCB With Red Solder Mask and Immersion Gold

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

Hybrid PCB | Mixed Material 4-layer PCB Made On 20 mil RO4350B + FR4 With Blind Via

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via

Impedance Controlled PCB

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Printed Circuit Board with 90 Ohm Impedance Controlled | Single End Impedance Differential Impedance PCB Board

598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.

PCB Prototypes

Microwave PCB Boards Built On RO4350B 10 mil With Immersion Gold

High Frequency PCB Bare Board | 10 mil RO4350B Printed Circuit Board | Immersion Gold HF PWB

High Frequency PCB Bare Board | 10 mil RO4350B Printed Circuit Board | Immersion Gold HF PWB

Blog

RO3010 high frequency PCB 2-layer Rogers RO3010 Substrate - 50mil (1.27mm) with 1oz copper and Immersion Gold

RF-10 2-layer PCB Substrate with Immersion Tin and 1oz coated plating for RF Design

RO4835 High-Frequency PCBs with white silk screen,no soldermask, ENIG for Automotive Radar and Sensors

RTduroid 6010.2LM PCB 50mil thick double sided 1oz copper weight and Immersion Gold

TC600 High-Performance Thermal Composite PCB 2-layer 30mil thick with ENIG

Taconic's TLY-5Z PCB 2-layer 10mil thick laminates are glass-filled, PTFE composites with woven fiberglass reinforcement

Arlon PCB Board

Microwave PCB Boards Built On RO4350B 10 mil With Immersion Gold

High Frequency PCB Boards Built On RO4350B 10 mil With Immersion Gold

High Speed PCB Boards Built On RO4350B 10 mil With Immersion Gold

Hybrid PCB Board

FR-4 PCB Board

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

Single Sided Aluminum PCB 1W / MK 6061 Aluminum Matal Core HASL Pb Free

9oz Heavy Copper Aluminum PCB for High Current Application

High Frequency PCB

Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers

RO4535 High Frequency PCB Rogers 4535 30mil 0.762mm Antenna Circuit Board 2-Layer with Immersion Gold

Rogers RT/Duroid 5870 31mil 0.787mm High Frequency PCB for Radar Systems

Rogers TMM4 PCB Microwave With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers

Rogers DiClad 880 High Frequency PCB Double Layer 20mil 0.508mm With Immersion Gold

F4B SERIES PCBS

F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

RF PCB

RT/duroid 5870 High Frequency PCB with 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm)

Rogers RT/duroid 6010.2LM High frequency PCB single-layer, double layer, multilayer, hybrid PCB

Rogers TC350 Dk 3.5 allows for the production of single -sided, double-sided, multi-layer boards, and hybrid PCBs

Rogers RO4350B DK 3.48 the laminates are a proprietary blend of woven glass reinforced hydrocarbon/ceramics

RO3035 (Dk) of 3.50 High Frequency PCB Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB

RTduroid 6035HTC DK 3.5 High Frequency PCB built on 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) substrates

Copper Clad Laminates

RT/duroid® 5880 Copper-Clad Laminate 0.127mm 0.252mm 0.508mm 0.787mm 1.575mm thickness substrate for multilayer hybrid PCB

DK 2.2 RT/duroid 5880LZ substrate 0.508mm double sided copper clad laminate with 35µm for multy-layer and hybrid PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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