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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds

RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds

  • RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds
  • RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds
RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0317-V3.17
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: RO4725JXR Board Thickness: 0.78mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This 2-layer rigid PCB features a stackup with copper_layer_1 of 35 μm, a Rogers RO4725JXR Core of 30.7mil (0.780 mm), and copper_layer_2 of 35 μm. It has a finished board thickness of 0.9mm and a finished Cu weight of 1oz (1.4 mils) on the outer layers. The construction details include board dimensions of 146.15mm x 60.8mm, minimum trace/space of 5/6 mils, and a minimum hole size of 0.5mm. It does not have blind vias and has a via plating thickness of 20 μm.

 

The PCB utilizes immersion gold as the surface finish, with green top solder mask and no bottom solder mask. It does not have top or bottom silkscreen. Prior to shipment, a 100% electrical test is performed to ensure quality. The supplied artwork is in the form of Gerber RS-274-X files, and the PCB conforms to IPC-Class-2 quality standard. It is available worldwide.

 

With a total of 54 components and 67 pads, this PCB has 67 top SMT pads, no bottom SMT pads, 249 vias, and 3 nets. It is commonly used in applications such as Cellular Base Station Antennas and Power Amplifiers.

 

Parameters Values
PCB Type 2-layer rigid PCB
Copper_layer_1 35 μm
Rogers RO4725JXR Core 30.7mil (0.780 mm)
Copper_layer_2 35 μm
Board Dimensions 146.15mm x 60.8mm = 20PCS, +/- 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.5mm
Blind vias No
Finished Board Thickness 0.9mm
Finished Cu Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
Electrical Test 100% prior to shipment
Components 54
Total Pads 67
Thru Hole Pads 0
Top SMT Pads 67
Bottom SMT Pads 0
Vias 249
Nets 3
Type of Artwork Supplied Gerber RS-274-X
Quality Standard IPC-Class-2
Availability Worldwide
Typical Applications Cellular Base Station Antennas and Power Amplifiers

 

Features/Benefits:

RO4725JXR RF PCBs offer a range of advantages due to their unique properties:

 

Reduced PIM: These PCBs exhibit reduced passive inter-modulation, resulting in improved signal quality and reduced interference.

 

Low insertion loss: With low loss dielectric and low profile foil, these PCBs minimize signal loss during transmission.

 

RO4725JXR Dk 2.55: The dielectric constant of 2.55 ensures consistent electrical performance and compatibility with standard PTFE-based materials.

 

 

The PCBs also feature unique filler and closed microspheres, providing additional benefits:

 

Low density: With a density of only 1.27 gm/cm3, these PCBs are approximately 30% lighter than PTFE/Glass boards, offering weight savings in applications.

 

Low Z-axis CTE (Coefficient of Thermal Expansion) of 25.6ppm/°C: This property ensures dimensional stability and reliable performance across temperature variations.

 

Other notable features include:

High Tg (>280°C): The high glass transition temperature allows for design flexibility and compatibility with automated assembly processes.

 

Low TCDk (+34 ppm/°C): The low thermal coefficient of dielectric constant ensures consistent circuit performance, minimizing variations due to temperature changes.

 

Specially formulated thermoset resin system/filler: This formulation offers ease of fabrication and compatibility with plated through-hole (PTH) processes.

 

In addition, RO4725JXR laminates are environmentally friendly:

 

Lead-free process compatibility: These PCBs are suitable for lead-free soldering processes.

 

RoHS compliant: They meet the requirements of the Restriction of Hazardous Substances (RoHS) directive.

 

Typical applications for RO4725JXR PCBs include Cellular Base Station Antennas etc.

 

RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion Golds 0

 

Factory Process Capability (2023)
Substrate Types and Brands Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115
Rogers Corp: RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917
Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z;
F4B PTFE Composites: (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2)
Maximum Delivery Size 1200mm x 572 mm
Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness 10.0 mm
Blind Buried Holes (Non-crossing) 0.1mm
Maximum Hole Aspect Ratio 15:01
Minimum Mechanical Drill Hole Diameter 0.1 mm
Through-hole Tolerance +/- 0.0762 mm
Press-fit Hole Tolerance +/- 0.05mm
Non-plated Copper Hole Tolerance +/- 0.05mm
Maximum Number of Layers 32
Internal and External Layer Maximum Copper Thickness 12Oz
Minimum Drill Hole Tolerance +/- 2mil
Minimum Layer-to-Layer Tolerance +/- 3mil
Minimum Line Width/Spacing 3mil/3mil
Minimum BGA Diameter 8mil
Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Carbon Ink, Peelable Mask, Gold Finger, etc.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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