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IsoClad 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs

IsoClad 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
IsoClad 933
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

IsoClad® 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs

 

We are pleased to introduce the IsoClad® 933, a premium high-frequency laminate engineered to deliver an exceptional balance of mechanical flexibility, electrical performance, and isotropic stability. Part of Rogers Corporation's renowned IsoClad series, this material utilizes a unique nonwoven fiberglass reinforcement within a PTFE matrix, setting it apart from traditional woven glass substrates and making it an ideal solution for advanced, conformal RF applications.

 

IsoClad 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs 0

 

Engineered for Flexibility and Isotropic Consistency
The core innovation of IsoClad 933 lies in its nonwoven fiberglass structure. This design yields a material that is significantly less rigid than standard woven fiberglass laminates, providing the flexibility required for conformal antennas and curved electronic assemblies. Crucially, the random orientation of the fibers results in highly isotropic properties in the X, Y, and Z directions. This means the material behaves uniformly regardless of direction, leading to more predictable electrical performance, reduced risk of warpage, and simplified modeling for complex circuit designs—a critical advantage for stripline and microstrip circuits.

 

Typical Properties: IsoClad
Property Test Method Condition IsoClad 917 IsoClad 933
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20 2.33
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0013 0.0016
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -157 -132
c IPC TM-650 2.4.8 After Thermal 10 10
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.5 x 10 10 3.5 x 10 8
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.0 x 10 9 1.0 x 10 8
Arc Resistance (seconds) ASTM D-495 D48/50 >180 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 133, 120 173, 147
Tensile Strength (kpsi) ASTM D-882 A, 23°C 4.3, 3.8 6.8, 5.3
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 182 197
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 213 239
Dielectric Breakdown (kv) ASTM D-149 D48/50 >45 >45
Density (g/cm3) ASTM D-792 Method A A, 23°C 2.23 2.27
Water Absorption (%) MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 E1/105 + D24/23 0.04 0.05
Coefficient of Thermal IPC TM-650 2.4.24 Mettler 3000 0°C to 100°C    
Expansion (ppm/°C) Thermomechanical Analyzer    
X Axis   46 31
Y Axis   47 35
Z Axis   236 203
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.263 0.263
Outgassing        
Total Mass Loss (%) Maximum 1.00% 125°C, ≤10-6 torr 0.02 0.03
Collected Volatile Maximum 0.10%   0 0
Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)     0.02 0.02
      NO NO
Flammability UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets Meets
requirements of UL94-V0 requirements of UL94-V0

 

Reliable Electrical Performance for Demanding Systems
IsoClad 933 offers dependable electrical characteristics tailored for high-frequency operation. It features a stable dielectric constant (Dk) of 2.33 at 10 GHz and a low dissipation factor (Df) of 0.0016. This combination ensures controlled impedance and minimal signal loss, making it suitable for a wide range of RF applications. The laminate demonstrates a low thermal coefficient of Dk (-132 ppm/°C), promoting stable electrical behavior across operational temperature extremes. With high volume and surface resistivity, along with a dielectric breakdown strength exceeding 45 kV, IsoClad 933 is built for reliability in challenging environments.

 

 

Robust Mechanical and Environmental Properties
Despite its flexibility, IsoClad 933 is a robust material. It uses a higher fiberglass-to-PTFE ratio than other IsoClad variants, providing enhanced dimensional stability and increased mechanical strength. It exhibits strong tensile, compressive, and flexural modulus values, ensuring it can withstand the rigors of PCB fabrication and assembly. The material boasts a low moisture absorption rate of 0.05% and meets NASA outgassing requirements (with very low TML and CVCM), making it a trusted choice for aerospace and space-grade applications. It also carries a UL 94 V-0 flammability rating.

 

 

Standard Thicknesses:

IsoClad 917: 0.031" (0.79mm) and 0.062" (1.57mm), both with a tolerance of ±0.0030".

IsoClad 933: 0.015" (0.38mm), 0.031" (0.79mm), and 0.062" (1.57mm), all with a tolerance of ±0.0030"

Additional non-standard thicknesses are available from 0.005" to 0.125" in increments of 0.005".

 

 

Standard Panel Sizes: 12" x 18" (305mm x 457mm), 24" x 18" (610mm x 457mm)

Additional panel sizes are available upon request.

 

 

Standard Claddings: Electrodeposited Copper Foil

½ oz. (18µm) – Designation: HH/HH

1 oz. (35µm) – Designation: *H1/H1*

 

Additional cladding options are available, including:

Heavy metal cladding

Resistive foil

Unclad (bare dielectric) material

 

 

Ideal for Mission-Critical Applications

Conformal and Phased Array Antennas for aerospace and defense platforms

Missile Guidance Systems

Radar and Electronic Warfare (EW) Systems

High-Frequency Stripline and Microstrip Circuits

 

For engineers designing next-generation RF systems that must conform to non-planar surfaces or require exceptional dimensional predictability, IsoClad 933 provides a proven, high-performance substrate solution. Its isotropic nature and tailored reinforcement offer a unique value proposition that bridges the gap between electrical performance and mechanical versatility.

 

Contact our team today to discuss how IsoClad 933 can meet the specific demands of your project, request detailed specifications, or obtain samples for evaluation. We are here to provide the material expertise and support to ensure the success of your most advanced RF designs.

 

 

Products
PRODUCTS DETAILS
IsoClad 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
IsoClad 933
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

IsoClad® 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs

 

We are pleased to introduce the IsoClad® 933, a premium high-frequency laminate engineered to deliver an exceptional balance of mechanical flexibility, electrical performance, and isotropic stability. Part of Rogers Corporation's renowned IsoClad series, this material utilizes a unique nonwoven fiberglass reinforcement within a PTFE matrix, setting it apart from traditional woven glass substrates and making it an ideal solution for advanced, conformal RF applications.

 

IsoClad 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs 0

 

Engineered for Flexibility and Isotropic Consistency
The core innovation of IsoClad 933 lies in its nonwoven fiberglass structure. This design yields a material that is significantly less rigid than standard woven fiberglass laminates, providing the flexibility required for conformal antennas and curved electronic assemblies. Crucially, the random orientation of the fibers results in highly isotropic properties in the X, Y, and Z directions. This means the material behaves uniformly regardless of direction, leading to more predictable electrical performance, reduced risk of warpage, and simplified modeling for complex circuit designs—a critical advantage for stripline and microstrip circuits.

 

Typical Properties: IsoClad
Property Test Method Condition IsoClad 917 IsoClad 933
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20 2.33
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0013 0.0016
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -157 -132
c IPC TM-650 2.4.8 After Thermal 10 10
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.5 x 10 10 3.5 x 10 8
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.0 x 10 9 1.0 x 10 8
Arc Resistance (seconds) ASTM D-495 D48/50 >180 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 133, 120 173, 147
Tensile Strength (kpsi) ASTM D-882 A, 23°C 4.3, 3.8 6.8, 5.3
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 182 197
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 213 239
Dielectric Breakdown (kv) ASTM D-149 D48/50 >45 >45
Density (g/cm3) ASTM D-792 Method A A, 23°C 2.23 2.27
Water Absorption (%) MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 E1/105 + D24/23 0.04 0.05
Coefficient of Thermal IPC TM-650 2.4.24 Mettler 3000 0°C to 100°C    
Expansion (ppm/°C) Thermomechanical Analyzer    
X Axis   46 31
Y Axis   47 35
Z Axis   236 203
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.263 0.263
Outgassing        
Total Mass Loss (%) Maximum 1.00% 125°C, ≤10-6 torr 0.02 0.03
Collected Volatile Maximum 0.10%   0 0
Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)     0.02 0.02
      NO NO
Flammability UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets Meets
requirements of UL94-V0 requirements of UL94-V0

 

Reliable Electrical Performance for Demanding Systems
IsoClad 933 offers dependable electrical characteristics tailored for high-frequency operation. It features a stable dielectric constant (Dk) of 2.33 at 10 GHz and a low dissipation factor (Df) of 0.0016. This combination ensures controlled impedance and minimal signal loss, making it suitable for a wide range of RF applications. The laminate demonstrates a low thermal coefficient of Dk (-132 ppm/°C), promoting stable electrical behavior across operational temperature extremes. With high volume and surface resistivity, along with a dielectric breakdown strength exceeding 45 kV, IsoClad 933 is built for reliability in challenging environments.

 

 

Robust Mechanical and Environmental Properties
Despite its flexibility, IsoClad 933 is a robust material. It uses a higher fiberglass-to-PTFE ratio than other IsoClad variants, providing enhanced dimensional stability and increased mechanical strength. It exhibits strong tensile, compressive, and flexural modulus values, ensuring it can withstand the rigors of PCB fabrication and assembly. The material boasts a low moisture absorption rate of 0.05% and meets NASA outgassing requirements (with very low TML and CVCM), making it a trusted choice for aerospace and space-grade applications. It also carries a UL 94 V-0 flammability rating.

 

 

Standard Thicknesses:

IsoClad 917: 0.031" (0.79mm) and 0.062" (1.57mm), both with a tolerance of ±0.0030".

IsoClad 933: 0.015" (0.38mm), 0.031" (0.79mm), and 0.062" (1.57mm), all with a tolerance of ±0.0030"

Additional non-standard thicknesses are available from 0.005" to 0.125" in increments of 0.005".

 

 

Standard Panel Sizes: 12" x 18" (305mm x 457mm), 24" x 18" (610mm x 457mm)

Additional panel sizes are available upon request.

 

 

Standard Claddings: Electrodeposited Copper Foil

½ oz. (18µm) – Designation: HH/HH

1 oz. (35µm) – Designation: *H1/H1*

 

Additional cladding options are available, including:

Heavy metal cladding

Resistive foil

Unclad (bare dielectric) material

 

 

Ideal for Mission-Critical Applications

Conformal and Phased Array Antennas for aerospace and defense platforms

Missile Guidance Systems

Radar and Electronic Warfare (EW) Systems

High-Frequency Stripline and Microstrip Circuits

 

For engineers designing next-generation RF systems that must conform to non-planar surfaces or require exceptional dimensional predictability, IsoClad 933 provides a proven, high-performance substrate solution. Its isotropic nature and tailored reinforcement offer a unique value proposition that bridges the gap between electrical performance and mechanical versatility.

 

Contact our team today to discuss how IsoClad 933 can meet the specific demands of your project, request detailed specifications, or obtain samples for evaluation. We are here to provide the material expertise and support to ensure the success of your most advanced RF designs.

 

 

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