quality Newly Shipped RF PCB & Rogers PCB Board factory

Rogers RO4000 series materials are high-performance materials commonly used in high frequency and microwave fields.   So what are the advantages of Rogers RO4000 series materials and what fields are they suitable for application in?   Rogers RO4000 hydrocarbon ceramic laminates and prepregs are low-loss materials that are easier to use in high-frequency microwave PCB manufacturing and offer better stability than traditional PTFE materials. Advantages of Rogers RO4000 series materials   1.Compatible with FR-4 process 2. With UL 94 V-0 flame retardant grade 3. High heat conductivity (.6-.8 W/m.K) 4. Stable Dielectric Constant (Dk) 2.55-6.15 5. The glass transition temperature (Tg) exceeds 280°C 6. Compatible with lead-free soldering technology 7. Low Z-axis CTE, ensuring high reliability plated through holes 8. Comply with RoHS and REACH environmental protection regulations and does not contain harmful substances 9. High cost performance Rogers RO4000 series materials are used in base stations, satellite communications, wireless networks, radars, automotive electronics and other equipment. High frequency, low dielectric constant and low dielectric loss as well as signal transmission stability make Rogers 4000 series materials become the best choice   Rogers RO4000Product RO 4000 LoPro®: Standard RO4000® with reversed copper foil, low Dk and low loss in high frequency circuit designs, reducing passive intermodulation (PIM) performance. RO4003C™: For cost-sensitive microwave/RF designs; Dk 3.38 (+/- 0.05); lowest loss characteristic of RO4000® products; Df 0.0027 @ 10 GHz. RO4350B™: UL 94 V-0 flame retardant rating; Dk 3.48 (+/- 0.05); Df 0.0037 @ 10 GHz. RO4360G2™: RoHS compliant; low Z-axis CTE; Dk 6.15 (+/- 0.015); Df 0.0038 @ 10GHz. RO4400™/RO4400T™ Series Bonding Sheets: Based on RO4000 Series prepreg materials; supports multiple sequential laminations; lead-free soldering; offers thinner thickness options; increases multi-layer design flexibility. RO4500™: Commercial high-capacity antenna-grade series of materials; excellent mechanical properties; can be paired with LoPro™ copper foil; improves passive intermodulation. RO4700™: Low Dk antenna grade material; Dk includes: 2.55 (+/- 0.05) and 3.0 (+/- 0.05); Df is: 0.0022 @ 2.5GHz and 0.0023 @ 2.5GHz respectively. RO4830™: Low cost; suitable for mmWave patch antenna designs; insertion loss similar to RO3003™ laminate using standard electrolytic copper at 77 GHz; fiberglass laid; minimizes Dk variation. RO4835™: 10 times more resistant to oxidation than traditional thermosets; Dk 3.48 (+/-0.05); Df 0.0037 @ 10 GHz. RO4835T™: Thinner RO4835™; glass cloth: reduces Dk change. CU4000™ and CU4000 LoPro® Copper Foil: IPC-4562A Class 3 copper foil; highly ductile; makes multi-layer PCB alignment easier.   Compared with traditional PTFE materials, Rogers 4000 series is easier to use in high-frequency microwave PCB manufacturing and has better stability. It is very suitable for use in base stations, satellite communications, wireless networks, radar, automotive electronics and other equipment.   We can provide you with prototype, small batches and mass production service. If you are interested in high frequency PCB made on Rogers, please feel free to send us back with your requirement. We are happy to share our price with you.    

1. What is Rogers PCB? Rogers PCB board is a high-frequency PCB material model produced by Rogers Company, which has the following characteristics:   ① Material advantages: Rogers PCB uses ceramic or special polymer composite materials and does not contain epoxy resin, so it has lower dielectric constant (DK) and dielectric loss, as well as excellent temperature stability. These characteristics make Rogers PCB perform especially well in high-frequency environments.   ② High precision and stability: The board thickness control has high precision, the copper sheet has strong adhesion, good heat dissipation performance, and no delamination or blistering, ensuring the long-term stability and reliability of the PCB.   ③ Wide range of applications: Suitable for areas with high reliability requirements such as high-speed PCB design, commercial microwave antennas, radio frequency products, and aerospace.   2. What is the difference between Rogers PCB board and traditional PCB (such as FR-4)? ①Material composition Rogers PCB uses ceramic or special polymer materials, while FR-4 is mainly composed of epoxy resin and glass fiber. Rogers materials have superior dielectric properties and are suitable for high-frequency applications. ②Performance difference: Dielectric constant (DK): The DK value of Rogers PCB is lower and stable with frequency, which helps to reduce reflection and loss in signal transmission; the DK value of FR-4 is higher and changes greatly with frequency. . Temperature stability: Rogers PCB has excellent temperature stability and is suitable for working in a wide temperature range; FR-4 performance may decrease in high temperature environments. Water absorption: Rogers PCB has extremely low water absorption and is suitable for high humidity environments; FR-4 is relatively easy to absorb water, which may affect electrical performance. ③Cost and application: Although Rogers PCB has high material cost, due to its excellent performance, it is especially suitable for fields with extremely high performance requirements; while FR-4 is widely used in the manufacturing of general electronic products because of its lower cost. . ④ Processing compatibility: Although the materials are different, the processing technology of Rogers PCB is compatible with FR-4 to a certain extent, which provides manufacturers with more choices.   3. What are the classic products of Rogers PCB boards? 3000 series (PTFE + ceramic/PTFE + ceramic glass fiber, DK = 3.0-10.2): RO3003, RO3003G2, RO3035, RO3006, RO3010, RO3203, RO3206, RO3210 4000 series (hydrocarbon + PTFE, DK = 3.38-6.15): RO4350B, RO4003C, RO4835, R O4360G2, RO4533, RO4534, RO4535, RO4725JXR, RO4730JXR, RO4730G3   5000 series (glass fiber + polytetrafluoroethylene, DK=1.96-2.33): RT/tungsten carbide 5880, RT/tungsten carbide 5880LZ, RT/tungsten carbide 5870   6000 series, suitable for electronic circuits and microwave circuits requiring high dielectric constant. (PTFE + ceramic, DK = 2.94-10.2): RT / carbide 6002, RT / hard material 6202PR   TMM series (hydrocarbon + ceramic, DK = 3.27-12.85): TMM3, TMM4, TMM10, TMM10i, TMM13i   Others: Kappa 438   Prepreg: RO4450B, RO4450F   Adhesive film: 2929, 3001, ULTRALAM3908, RO3003, RO3006, RO3010, RT / carbide 6002   We can provide you with prototype, small batches and mass production service. If you are interested in high frequency PCB made on Rogers, please feel free to send us back with your requirement. We are happy to share our price with you.

To prevent PCB board cracking, the following measures can be taken:   1. Reasonably select the plate material and thickness: Select the appropriate plate material and appropriate thickness according to the application needs and mechanical strength requirements. Thicker sheets generally have better strength and bending resistance.   2. Good layout design: In PCB layout design, pay attention to avoid concentrating components with excessive weight or mechanical stress to reduce the concentration of mechanical stress on the board. Reasonably distribute components and balance the layout to reduce the impact of mechanical stress.   3. Control the thermal expansion of the board: The PCB board will thermally expand when the temperature changes, and different materials have different thermal expansion coefficients. In the layout design, the thermal expansion coefficients of different materials are taken into consideration and the difference in thermal expansion between different materials is minimized to reduce the stress on the board.   4. Strengthen connection methods: Strengthen the design of connection points, such as using pins, sockets, locking screws and other fixed connection methods to improve the reliability and tensile strength of the connection.   5. Control the manufacturing process: During the PCB manufacturing process, strictly control the temperature and humidity conditions to avoid excessive soldering temperatures and excessive hot and humid environments. Follow the manufacturer's recommendations and best practices to ensure the manufacturing process meets process requirements.   6. Pressure distribution: Pay attention to the pressure distribution of the PCB board during installation and use. Avoid excessive bending, excessive squeezing or excessive twisting of the PCB board to reduce stress concentration.   7. Testing and quality control: Carry out necessary testing and quality control during the PCB manufacturing process to ensure the quality and reliability of the PCB board. Identify potential cracking issues through quality control measures such as X-ray inspection, AOI (automated optical inspection) and mechanical strength testing.       ============================================================================================================ Note: This article is forwarded from the Internet "CCTV Finance". The above copyright belongs to the original author. This account remains neutral on the content of the article. If there is any infringement or omission, please contact us in the background for correction or deletion!

The PCB industry is gradually picking up steam, and the sector continues to be active. Wind data shows that the share prices of leading companies such as Shanghai Electric Co., Ltd., Shennan Circuit (002916.SZ), Pengding Holdings, Shengyi Electronics (688183.SH), and Shenghong Technology (300476.SZ) have all increased by more than 50% since the beginning of the year ... Among them, the cumulative increase of Shenghong Technology reached 110%.   Automotive electronics is one of the recovery forces. Automotive electronics is a downstream application field that has seen rapid growth in recent years.   From 2022 to 2027, the global average annual compound growth rate of PCB output value is approximately 2%, of which the server/data transmission sector has a growth rate of 6.5% and the automotive sector has a growth rate of 4.8%.   PCB is the core component of automotive electronic control systems. The continuous increase in the penetration rate of autonomous driving and new energy vehicles will bring about structural demand for automotive PCBs.   Self-driving taxis require a large number of sensors, lidar and other electronic equipment to achieve intelligent control, which will increase the amount of PCB used. If self-driving cars are fully rolled out in the future, it will be a large incremental market for PCBs.   When a self-driving vehicle encounters a risky situation, the lidar must transmit the signal to the "main brain" of the vehicle at a very fast speed and take braking measures. When the signal is transmitted on the PCB, the signal layer must be insulated from the outside. There will be inductance and impedance between layers, as well as between lines, which will cause signal distortion. The solution is to use PTFE materials with better performance to replace the traditional epoxy resin plus glass cloth materials to achieve superior transmission performance. ... The company's automotive electronic PCB products are indirectly used in electronic equipment such as radars, sensors, antennas, and vehicle-mounted satellite positioning and navigation systems in the vehicle-road-cloud collaborative system; Shenzhen South Circuit also regards automotive electronics as one of the key areas of expansion of its PCB business. It is reported that the company focuses on new energy and ADAS, and mainly produces high-frequency, HDI, rigid-flex, thick copper and other products. Among them, the proportion of products in the ADAS field is relatively high, which is used in cameras, radars and other equipment.   It is understood that the amount of PCB used in new energy vehicles is approximately 4-5 times that of traditional fuel vehicles. Automotive electronic PCBs have extremely high requirements for reliability and require rigorous testing and verification for up to 1-3 years before they can be certified as qualified suppliers by auto parts manufacturers.   Under the trend of electrification, networking and intelligence in the automotive industry, more and more automotive chips are used, and the requirements for circuit board integration and design accuracy have also increased significantly. For example, the manufacturing process of PCB boards for autonomous driving is generally relatively complex, and the market The price and profit margin are relatively high, which can help Chinese PCB companies achieve transformation and upgrading.

  1. PCB manufacturing industry gradually moves to mainland China The PCB industry is widely distributed around the world and was dominated by developed countries in the United States, Europe, and Japan in the early days. Before 2000, the United States, Europe and Japan accounted for more than 70% of global PCB output value. However, in the past two decades, Asia, especially China, has attracted the transfer of global electronics manufacturing due to its advantages in labor, raw materials, policies and industrial clusters. Mainland China, Taiwan, South Korea and other places are gradually becoming new manufacturing centers. Since 2006, mainland China has surpassed Japan and become the world's largest PCB production base, marking a change in the industrial competition landscape. The proportion of PCB output value in mainland China to the total global PCB output value has increased from 8.1% in 2000 to 54.6% in 2021.   In 2023, the total revenue of the top ten domestic PCB listed companies will reach 140.046 billion yuan. Among them, Dongshan Precision has the largest revenue volume, with revenue reaching 33.651 billion yuan in 2023. The second largest company is Pengding Holdings, with revenue in 2023 reaching 32.066 billion yuan.   2. The market will enter a new growth cycle, and China’s PCB industry will continue to develop healthily. The size of the global PCB market will shrink in 2023 due to destocking pressure and interest rate hikes to curb inflation. According to Prismark data, global PCB output value will drop 15% year-on-year to US$69.517 billion in 2023. However, as market inventory adjustments, weak consumer electronics demand and other issues enter the final stage, as well as the accelerated evolution of AI applications, PCB will enter a new growth cycle. It is expected to increase by about 5% year-on-year in 2024, and the utilization rate of PCB manufacturers is expected to rebound. . In the medium to long term, the global PCB industry will usher in a revival. It is expected that global PCB output value will reach US$90.413 billion in 2028, with a compound growth rate of 5.4% from 2023 to 2028. China's PCB industry continues to develop healthily. In 2023, mainland China's PCB output value will be US$37.794 billion, accounting for more than 50% of the global market share.   PCB inventories are gradually being digested and the industry is recovering moderately. Taiwan's PCB sector revenue reached NT$23.7 billion in January 2024, with month-on-month growth picking up at 10%, showing that the PCB industry is currently in a moderate recovery stage.   From an inventory perspective, PCB manufacturers' inventories have gradually decreased since 2022Q1, and destocking has basically ended. The industry may have entered the replenishment stage starting from 2023Q3.   3. According to product structure, multi-layer boards account for the mainstream From the perspective of product structure, the top three products in the global PCB market in 2022 are multilayer boards, packaging substrates, and flexible plates, accounting for 36.5%, 21.3%, and 16.9% respectively. The Chinese market is dominated by multilayer boards, accounting for 49%, but they are mainly mid- to low-end products with less than 8 layers. The proportion of high-value products such as high-multilayer boards, high-end HDI boards, packaging substrates, etc. is still relatively low. . In recent years, domestically owned factories have actively developed their efforts in the high-end field, related products have gradually been launched, and production capacity has been further expanded. The proportion of high-end products is expected to increase in the future.   3. According to product structure, multilayer boards dominate From the perspective of product structure, the Top 3 products in the global PCB market in 2022 are multilayer boards, packaging substrates, and flexible plates, accounting for 36.5%, 21.3%, and 16.9% respectively. The Chinese market is dominated by multilayer boards, accounting for 49%, but they are mainly mid-to-low-end products with less than 8 layers. The proportion of high-value products such as high-end multilayer boards, high-end HDI boards, packaging substrates, etc. is still low. ... In recent years, domestically-owned factories have been actively developing high-end products. Related products have been gradually launched and production capacity has been further expanded. The proportion of high-end products is expected to increase in the future.