quality Newly Shipped RF PCB & Rogers PCB Board factory

1. What is Rogers PCB? Rogers PCB board is a high-frequency PCB material model produced by Rogers Company, which has the following characteristics:   ① Material advantages: Rogers PCB uses ceramic or special polymer composite materials and does not contain epoxy resin, so it has lower dielectric constant (DK) and dielectric loss, as well as excellent temperature stability. These characteristics make Rogers PCB perform especially well in high-frequency environments.   ② High precision and stability: The board thickness control has high precision, the copper sheet has strong adhesion, good heat dissipation performance, and no delamination or blistering, ensuring the long-term stability and reliability of the PCB.   ③ Wide range of applications: Suitable for areas with high reliability requirements such as high-speed PCB design, commercial microwave antennas, radio frequency products, and aerospace.   2. What is the difference between Rogers PCB board and traditional PCB (such as FR-4)? ①Material composition Rogers PCB uses ceramic or special polymer materials, while FR-4 is mainly composed of epoxy resin and glass fiber. Rogers materials have superior dielectric properties and are suitable for high-frequency applications. ②Performance difference: Dielectric constant (DK): The DK value of Rogers PCB is lower and stable with frequency, which helps to reduce reflection and loss in signal transmission; the DK value of FR-4 is higher and changes greatly with frequency. . Temperature stability: Rogers PCB has excellent temperature stability and is suitable for working in a wide temperature range; FR-4 performance may decrease in high temperature environments. Water absorption: Rogers PCB has extremely low water absorption and is suitable for high humidity environments; FR-4 is relatively easy to absorb water, which may affect electrical performance. ③Cost and application: Although Rogers PCB has high material cost, due to its excellent performance, it is especially suitable for fields with extremely high performance requirements; while FR-4 is widely used in the manufacturing of general electronic products because of its lower cost. . ④ Processing compatibility: Although the materials are different, the processing technology of Rogers PCB is compatible with FR-4 to a certain extent, which provides manufacturers with more choices.   3. What are the classic products of Rogers PCB boards? 3000 series (PTFE + ceramic/PTFE + ceramic glass fiber, DK = 3.0-10.2): RO3003, RO3003G2, RO3035, RO3006, RO3010, RO3203, RO3206, RO3210 4000 series (hydrocarbon + PTFE, DK = 3.38-6.15): RO4350B, RO4003C, RO4835, R O4360G2, RO4533, RO4534, RO4535, RO4725JXR, RO4730JXR, RO4730G3   5000 series (glass fiber + polytetrafluoroethylene, DK=1.96-2.33): RT/tungsten carbide 5880, RT/tungsten carbide 5880LZ, RT/tungsten carbide 5870   6000 series, suitable for electronic circuits and microwave circuits requiring high dielectric constant. (PTFE + ceramic, DK = 2.94-10.2): RT / carbide 6002, RT / hard material 6202PR   TMM series (hydrocarbon + ceramic, DK = 3.27-12.85): TMM3, TMM4, TMM10, TMM10i, TMM13i   Others: Kappa 438   Prepreg: RO4450B, RO4450F   Adhesive film: 2929, 3001, ULTRALAM3908, RO3003, RO3006, RO3010, RT / carbide 6002   We can provide you with prototype, small batches and mass production service. If you are interested in high frequency PCB made on Rogers, please feel free to send us back with your requirement. We are happy to share our price with you.

To prevent PCB board cracking, the following measures can be taken:   1. Reasonably select the plate material and thickness: Select the appropriate plate material and appropriate thickness according to the application needs and mechanical strength requirements. Thicker sheets generally have better strength and bending resistance.   2. Good layout design: In PCB layout design, pay attention to avoid concentrating components with excessive weight or mechanical stress to reduce the concentration of mechanical stress on the board. Reasonably distribute components and balance the layout to reduce the impact of mechanical stress.   3. Control the thermal expansion of the board: The PCB board will thermally expand when the temperature changes, and different materials have different thermal expansion coefficients. In the layout design, the thermal expansion coefficients of different materials are taken into consideration and the difference in thermal expansion between different materials is minimized to reduce the stress on the board.   4. Strengthen connection methods: Strengthen the design of connection points, such as using pins, sockets, locking screws and other fixed connection methods to improve the reliability and tensile strength of the connection.   5. Control the manufacturing process: During the PCB manufacturing process, strictly control the temperature and humidity conditions to avoid excessive soldering temperatures and excessive hot and humid environments. Follow the manufacturer's recommendations and best practices to ensure the manufacturing process meets process requirements.   6. Pressure distribution: Pay attention to the pressure distribution of the PCB board during installation and use. Avoid excessive bending, excessive squeezing or excessive twisting of the PCB board to reduce stress concentration.   7. Testing and quality control: Carry out necessary testing and quality control during the PCB manufacturing process to ensure the quality and reliability of the PCB board. Identify potential cracking issues through quality control measures such as X-ray inspection, AOI (automated optical inspection) and mechanical strength testing.       ============================================================================================================ Note: This article is forwarded from the Internet "CCTV Finance". The above copyright belongs to the original author. This account remains neutral on the content of the article. If there is any infringement or omission, please contact us in the background for correction or deletion!

The PCB industry is gradually picking up steam, and the sector continues to be active. Wind data shows that the share prices of leading companies such as Shanghai Electric Co., Ltd., Shennan Circuit (002916.SZ), Pengding Holdings, Shengyi Electronics (688183.SH), and Shenghong Technology (300476.SZ) have all increased by more than 50% since the beginning of the year ... Among them, the cumulative increase of Shenghong Technology reached 110%.   Automotive electronics is one of the recovery forces. Automotive electronics is a downstream application field that has seen rapid growth in recent years.   From 2022 to 2027, the global average annual compound growth rate of PCB output value is approximately 2%, of which the server/data transmission sector has a growth rate of 6.5% and the automotive sector has a growth rate of 4.8%.   PCB is the core component of automotive electronic control systems. The continuous increase in the penetration rate of autonomous driving and new energy vehicles will bring about structural demand for automotive PCBs.   Self-driving taxis require a large number of sensors, lidar and other electronic equipment to achieve intelligent control, which will increase the amount of PCB used. If self-driving cars are fully rolled out in the future, it will be a large incremental market for PCBs.   When a self-driving vehicle encounters a risky situation, the lidar must transmit the signal to the "main brain" of the vehicle at a very fast speed and take braking measures. When the signal is transmitted on the PCB, the signal layer must be insulated from the outside. There will be inductance and impedance between layers, as well as between lines, which will cause signal distortion. The solution is to use PTFE materials with better performance to replace the traditional epoxy resin plus glass cloth materials to achieve superior transmission performance. ... The company's automotive electronic PCB products are indirectly used in electronic equipment such as radars, sensors, antennas, and vehicle-mounted satellite positioning and navigation systems in the vehicle-road-cloud collaborative system; Shenzhen South Circuit also regards automotive electronics as one of the key areas of expansion of its PCB business. It is reported that the company focuses on new energy and ADAS, and mainly produces high-frequency, HDI, rigid-flex, thick copper and other products. Among them, the proportion of products in the ADAS field is relatively high, which is used in cameras, radars and other equipment.   It is understood that the amount of PCB used in new energy vehicles is approximately 4-5 times that of traditional fuel vehicles. Automotive electronic PCBs have extremely high requirements for reliability and require rigorous testing and verification for up to 1-3 years before they can be certified as qualified suppliers by auto parts manufacturers.   Under the trend of electrification, networking and intelligence in the automotive industry, more and more automotive chips are used, and the requirements for circuit board integration and design accuracy have also increased significantly. For example, the manufacturing process of PCB boards for autonomous driving is generally relatively complex, and the market The price and profit margin are relatively high, which can help Chinese PCB companies achieve transformation and upgrading.

  1. PCB manufacturing industry gradually moves to mainland China The PCB industry is widely distributed around the world and was dominated by developed countries in the United States, Europe, and Japan in the early days. Before 2000, the United States, Europe and Japan accounted for more than 70% of global PCB output value. However, in the past two decades, Asia, especially China, has attracted the transfer of global electronics manufacturing due to its advantages in labor, raw materials, policies and industrial clusters. Mainland China, Taiwan, South Korea and other places are gradually becoming new manufacturing centers. Since 2006, mainland China has surpassed Japan and become the world's largest PCB production base, marking a change in the industrial competition landscape. The proportion of PCB output value in mainland China to the total global PCB output value has increased from 8.1% in 2000 to 54.6% in 2021.   In 2023, the total revenue of the top ten domestic PCB listed companies will reach 140.046 billion yuan. Among them, Dongshan Precision has the largest revenue volume, with revenue reaching 33.651 billion yuan in 2023. The second largest company is Pengding Holdings, with revenue in 2023 reaching 32.066 billion yuan.   2. The market will enter a new growth cycle, and China’s PCB industry will continue to develop healthily. The size of the global PCB market will shrink in 2023 due to destocking pressure and interest rate hikes to curb inflation. According to Prismark data, global PCB output value will drop 15% year-on-year to US$69.517 billion in 2023. However, as market inventory adjustments, weak consumer electronics demand and other issues enter the final stage, as well as the accelerated evolution of AI applications, PCB will enter a new growth cycle. It is expected to increase by about 5% year-on-year in 2024, and the utilization rate of PCB manufacturers is expected to rebound. . In the medium to long term, the global PCB industry will usher in a revival. It is expected that global PCB output value will reach US$90.413 billion in 2028, with a compound growth rate of 5.4% from 2023 to 2028. China's PCB industry continues to develop healthily. In 2023, mainland China's PCB output value will be US$37.794 billion, accounting for more than 50% of the global market share.   PCB inventories are gradually being digested and the industry is recovering moderately. Taiwan's PCB sector revenue reached NT$23.7 billion in January 2024, with month-on-month growth picking up at 10%, showing that the PCB industry is currently in a moderate recovery stage.   From an inventory perspective, PCB manufacturers' inventories have gradually decreased since 2022Q1, and destocking has basically ended. The industry may have entered the replenishment stage starting from 2023Q3.   3. According to product structure, multi-layer boards account for the mainstream From the perspective of product structure, the top three products in the global PCB market in 2022 are multilayer boards, packaging substrates, and flexible plates, accounting for 36.5%, 21.3%, and 16.9% respectively. The Chinese market is dominated by multilayer boards, accounting for 49%, but they are mainly mid- to low-end products with less than 8 layers. The proportion of high-value products such as high-multilayer boards, high-end HDI boards, packaging substrates, etc. is still relatively low. . In recent years, domestically owned factories have actively developed their efforts in the high-end field, related products have gradually been launched, and production capacity has been further expanded. The proportion of high-end products is expected to increase in the future.   3. According to product structure, multilayer boards dominate From the perspective of product structure, the Top 3 products in the global PCB market in 2022 are multilayer boards, packaging substrates, and flexible plates, accounting for 36.5%, 21.3%, and 16.9% respectively. The Chinese market is dominated by multilayer boards, accounting for 49%, but they are mainly mid-to-low-end products with less than 8 layers. The proportion of high-value products such as high-end multilayer boards, high-end HDI boards, packaging substrates, etc. is still low. ... In recent years, domestically-owned factories have been actively developing high-end products. Related products have been gradually launched and production capacity has been further expanded. The proportion of high-end products is expected to increase in the future.

What’s PCB? PCB (Printed Circuit Board), also known as printed circuit board, is the support of electronic components. PCB is an important electronic component and is called "electronic aircraft carrier". Its downstream applications are extensive, including consumer electronics, communications, computers, automotive electronics, industrial control, medical equipment, national defense, aerospace and other fields. As a key component of electronic interconnection, PCB is a bridge that carries electronic components and connects circuits. It is widely used in almost all electronic products and is the cornerstone of the electronics industry.   PCB classification PCB products can be classified into two technical classification methods: classification by circuit layer and classification by product structure.   (1) PCB classification by circuit layer PCB can be classified into single-sided board, double-sided board and multi-layer board according to circuit layer. Single-sided board is the most basic PCB and is used in basic electronic products such as ordinary household appliances and electronic remote controls; double-sided board has wiring on both sides, such as consumer electronics, computers, automotive electronics, industrial control, etc. Multilayer boards can be further divided into mid-bottom boards and high-layer boards, which can be mainly divided into 4-6 layers, 8-16 layers, 18 layers and above circuit boards, which can be used for more complex circuits, among which high-layer boards are mainly used in communication equipment, high-end servers, military and other fields.   2) PCB classification by product structure PCB can be classified into rigid boards (hard boards), flexible boards (soft boards), rigid-flex boards, semi-flexible boards, HDI boards, and package substrates according to product structure. Rigid boards are made of rigid substrates and can provide mechanical support for electronic components, with a wide range of applications. Flexible boards are flexible printed circuit boards made of bendable materials, which can save the required space, so they are mostly used in various consumer electronic devices. HDI boards adopt high-density interconnection technology, which improves the wiring density of boards and supports the use of advanced packaging technology applications. The package substrate is the IC package carrier, which is directly used to carry chips and provides electrical connection, protection, support, heat dissipation, assembly and other functions.   The development history of PCB PCB has a long history, dating back to more than a hundred years ago, and has continued to develop to this day. In 1903, German inventor Albert Hanson invented the predecessor of PCB through his research on early breadboards. Albert Hanson proposed the concept of a through-hole structure using double-sided conductivity, similar to modern through-hole board technology. He also innovatively built prototype circuits covering wires on insulating boards, and these works provided the basic framework for the subsequent development of PCB technology.   In 1927, French inventor Charles Ducas applied for a patent for a circuit board variant. He used a template printing technology to print wires on an insulating surface using a template and conductive ink to effectively create circuits. This printed wiring technology is an early version of the evolution of today's circuit board electroplating process.   Austrian engineer Paul Eisler created the first functional PCB in 1941, taking an important step in the development of PCB. Eisler's innovation was the application of a copper foil layer adhered to an insulating substrate to provide a conductive path for electronic components. By 1943, he further launched a radio with a PCB inside, a design that played a key role in subsequent military operations in World War II.   In the late 20th century, the advancement of etching and welding technology in PCB manufacturing process led to the complexity and miniaturization of PCB. The space arms race between major powers promoted the development of PCB technology due to the pursuit of lightweight and energy efficiency. Later, the advent of the digital age triggered an explosive growth of electronic devices, such as game consoles, video recorders, computers, and CD players. As the size of electronic products decreased, it became increasingly difficult to manufacture PCBs by hand, leading to a surge in demand for industrialized PCB manufacturing. At the same time, as components become smaller and wiring becomes more complex, the design of PCBs becomes more and more critical.   Nowadays, driven by technologies such as 5G, IOT, and AI, PCBs are becoming more and more complex. PCBs have developed from the most basic through-hole boards to high-layer boards, rigid-flex boards, soft boards, HDI boards using IC substrate technology, etc.