quality Newly Shipped RF PCB & Rogers PCB Board factory

The PCB industry is a basic industry for the manufacture of electronic information products and is greatly affected by cyclical fluctuations in the macro-economy. At present, global printed circuit board manufacturing companies are mainly distributed in mainland China, Taiwan, Japan, South Korea, the United States, Europe and Southeast Asia. my country's PCB industry has become the world's largest production base, and the impact of changes in the international political and economic environment on the domestic printed circuit board industry is becoming increasingly obvious.   The global PCB industry has recovered significantly and maintained a growth trend in the medium and long term 2023 is a challenging year for the global PCB industry. The impact of weak demand, severe backlog of inventory, oversupply and price erosion runs through the entire industry. Global PCB production fell to only US$69.5 billion in 2023, a year-on-year decrease of 15.0%. In the first half of 2024, due to improved inventory and gradual recovery of demand, the PCB industry began to show signs of recovery. Observing the current destocking speed and rhythm, it is expected to continue to improve by the end of the year. In the second half of 2024, the inventory of most subdivided application areas will be fully normalized. 2024 is a year of recovery. According to Prismark's estimates, the PCB market as a whole will achieve positive growth, with output value expected to increase by about 5.0% year-on-year and area expected to increase by about 7.2% year-on-year. The higher growth in area relative to output value reflects the expected impact of continued price erosion.   It is normal for the PCB industry to experience a cycle from strong growth to weak growth or even contraction. In the medium and long term, artificial intelligence, HPC, communication infrastructure, automotive electronics, portable smart consumer electronic devices with advanced artificial intelligence capabilities, etc. are expected to generate incremental demand.   Based on the low base in 2023, Prismark predicts that the PCB market will grow from US$69.5 billion in 2023 to US$90.4 billion in 2028, with a five-year CAGR of about 5.4%. Southeast Asia is expected to achieve the highest growth rate in the next five years. China will continue to maintain its position as the industry's leading manufacturing center, but due to the product structure of China's PCB industry and some production transfers to Southeast Asia, Prismark predicts that China's PCB output value will grow at a compound annual growth rate of about 4.2% from 2023 to 2028, slightly lower than the global level. It is expected that China's PCB output value will reach about US$46.5 billion by 2028.   Prismark predicts that all segments of the multilayer PCB market will grow, and it is expected to grow from US$26.5 billion in 2023 to US$32.5 billion in 2028, with a five-year average annual compound growth rate of about 4.4%, among which the server/data storage field will grow the strongest, followed by military, wired infrastructure and automobiles.   Multilayer boards occupy a major market position, and high-performance products will grow faster in the future With the innovative development of industries such as AI, data centers, VR/AR, new energy vehicles and intelligent driving, downstream application fields have put forward higher requirements for the performance of PCBs, such as high frequency, high speed, high voltage, heat resistance, and low loss. According to Prismark's forecast, the global PCB output value will grow at a compound annual growth rate of 5.4% from 2023 to 2028, reaching US$90.413 billion in 2028. Among them, 18+ multilayer boards, HDI, and package substrates will grow rapidly, with compound annual growth rates of 10%, 7.1%, and 8.8% respectively from 2023 to 2028. In terms of output value, multilayer boards are the main product category, with an output value of US$26.535 billion in 2023, accounting for 38.2% of the total output value, and a output value of US$32.483 billion in 2028, accounting for 35.9% of the total output value.       =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

The PCB industry plays a key role in the entire electronics industry chain. The main raw materials required for the production of PCB include copper clad laminate, prepreg, copper foil, potassium gold cyanide, copper balls and ink. Among them, copper clad laminate is the most important raw material. Copper clad laminate accounts for about 30%-40% of the entire PCB manufacturing cost. Copper foil is the main raw material for manufacturing copper clad laminate. The cost accounts for 30% (thin plate) and 50% (thick plate) of copper clad laminate. The manufacturing process of copper-clad laminates is to impregnate reinforcing materials with organic resin and dry them to form a prepreg. A plate-like material made by laminating several prepregs together, covered with copper foil on one or both sides, and hot-pressed. The reason why various types of copper-clad laminates differ in performance is mainly due to the differences in fiber reinforcement materials and resins used.   According to Prismark data, in the global copper-clad laminate market share in 2023, Kingboard accounts for 14.6%, Shengyi Technology accounts for 14%, Taiwan Optoelectronics accounts for 10.3%, Nanya Plastics accounts for 9.1%, Panasonic accounts for 6.7%, and Lianmao Electronics Accounting for 6.3%, Taiyao Technology accounts for 4%, South Korea's Doosan accounts for 3.6%, Jinan Guoji accounts for 3.3%, and Nanya New Materials accounts for 3.2%. Major copper foil manufacturers include Kingboard, Nanya Copper Foil, Copper Crown Copper Foil, Jiayuan Technology, Nord Co., Ltd., Longdianhuaxin, Changchun Chemical, Chaohua Technology, Jiangxi Copper Foil, etc. Among downstream applications, the four major fields of communications, automotive electronics, consumer electronics, and servers account for a high proportion.     =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

Rogers RO4000 series materials are high-performance materials commonly used in high frequency and microwave fields.   So what are the advantages of Rogers RO4000 series materials and what fields are they suitable for application in?   Rogers RO4000 hydrocarbon ceramic laminates and prepregs are low-loss materials that are easier to use in high-frequency microwave PCB manufacturing and offer better stability than traditional PTFE materials. Advantages of Rogers RO4000 series materials   1.Compatible with FR-4 process 2. With UL 94 V-0 flame retardant grade 3. High heat conductivity (.6-.8 W/m.K) 4. Stable Dielectric Constant (Dk) 2.55-6.15 5. The glass transition temperature (Tg) exceeds 280°C 6. Compatible with lead-free soldering technology 7. Low Z-axis CTE, ensuring high reliability plated through holes 8. Comply with RoHS and REACH environmental protection regulations and does not contain harmful substances 9. High cost performance Rogers RO4000 series materials are used in base stations, satellite communications, wireless networks, radars, automotive electronics and other equipment. High frequency, low dielectric constant and low dielectric loss as well as signal transmission stability make Rogers 4000 series materials become the best choice   Rogers RO4000Product RO 4000 LoPro®: Standard RO4000® with reversed copper foil, low Dk and low loss in high frequency circuit designs, reducing passive intermodulation (PIM) performance. RO4003C™: For cost-sensitive microwave/RF designs; Dk 3.38 (+/- 0.05); lowest loss characteristic of RO4000® products; Df 0.0027 @ 10 GHz. RO4350B™: UL 94 V-0 flame retardant rating; Dk 3.48 (+/- 0.05); Df 0.0037 @ 10 GHz. RO4360G2™: RoHS compliant; low Z-axis CTE; Dk 6.15 (+/- 0.015); Df 0.0038 @ 10GHz. RO4400™/RO4400T™ Series Bonding Sheets: Based on RO4000 Series prepreg materials; supports multiple sequential laminations; lead-free soldering; offers thinner thickness options; increases multi-layer design flexibility. RO4500™: Commercial high-capacity antenna-grade series of materials; excellent mechanical properties; can be paired with LoPro™ copper foil; improves passive intermodulation. RO4700™: Low Dk antenna grade material; Dk includes: 2.55 (+/- 0.05) and 3.0 (+/- 0.05); Df is: 0.0022 @ 2.5GHz and 0.0023 @ 2.5GHz respectively. RO4830™: Low cost; suitable for mmWave patch antenna designs; insertion loss similar to RO3003™ laminate using standard electrolytic copper at 77 GHz; fiberglass laid; minimizes Dk variation. RO4835™: 10 times more resistant to oxidation than traditional thermosets; Dk 3.48 (+/-0.05); Df 0.0037 @ 10 GHz. RO4835T™: Thinner RO4835™; glass cloth: reduces Dk change. CU4000™ and CU4000 LoPro® Copper Foil: IPC-4562A Class 3 copper foil; highly ductile; makes multi-layer PCB alignment easier.   Compared with traditional PTFE materials, Rogers 4000 series is easier to use in high-frequency microwave PCB manufacturing and has better stability. It is very suitable for use in base stations, satellite communications, wireless networks, radar, automotive electronics and other equipment.   We can provide you with prototype, small batches and mass production service. If you are interested in high frequency PCB made on Rogers, please feel free to send us back with your requirement. We are happy to share our price with you.    

1. What is Rogers PCB? Rogers PCB board is a high-frequency PCB material model produced by Rogers Company, which has the following characteristics:   ① Material advantages: Rogers PCB uses ceramic or special polymer composite materials and does not contain epoxy resin, so it has lower dielectric constant (DK) and dielectric loss, as well as excellent temperature stability. These characteristics make Rogers PCB perform especially well in high-frequency environments.   ② High precision and stability: The board thickness control has high precision, the copper sheet has strong adhesion, good heat dissipation performance, and no delamination or blistering, ensuring the long-term stability and reliability of the PCB.   ③ Wide range of applications: Suitable for areas with high reliability requirements such as high-speed PCB design, commercial microwave antennas, radio frequency products, and aerospace.   2. What is the difference between Rogers PCB board and traditional PCB (such as FR-4)? ①Material composition Rogers PCB uses ceramic or special polymer materials, while FR-4 is mainly composed of epoxy resin and glass fiber. Rogers materials have superior dielectric properties and are suitable for high-frequency applications. ②Performance difference: Dielectric constant (DK): The DK value of Rogers PCB is lower and stable with frequency, which helps to reduce reflection and loss in signal transmission; the DK value of FR-4 is higher and changes greatly with frequency. . Temperature stability: Rogers PCB has excellent temperature stability and is suitable for working in a wide temperature range; FR-4 performance may decrease in high temperature environments. Water absorption: Rogers PCB has extremely low water absorption and is suitable for high humidity environments; FR-4 is relatively easy to absorb water, which may affect electrical performance. ③Cost and application: Although Rogers PCB has high material cost, due to its excellent performance, it is especially suitable for fields with extremely high performance requirements; while FR-4 is widely used in the manufacturing of general electronic products because of its lower cost. . ④ Processing compatibility: Although the materials are different, the processing technology of Rogers PCB is compatible with FR-4 to a certain extent, which provides manufacturers with more choices.   3. What are the classic products of Rogers PCB boards? 3000 series (PTFE + ceramic/PTFE + ceramic glass fiber, DK = 3.0-10.2): RO3003, RO3003G2, RO3035, RO3006, RO3010, RO3203, RO3206, RO3210 4000 series (hydrocarbon + PTFE, DK = 3.38-6.15): RO4350B, RO4003C, RO4835, R O4360G2, RO4533, RO4534, RO4535, RO4725JXR, RO4730JXR, RO4730G3   5000 series (glass fiber + polytetrafluoroethylene, DK=1.96-2.33): RT/tungsten carbide 5880, RT/tungsten carbide 5880LZ, RT/tungsten carbide 5870   6000 series, suitable for electronic circuits and microwave circuits requiring high dielectric constant. (PTFE + ceramic, DK = 2.94-10.2): RT / carbide 6002, RT / hard material 6202PR   TMM series (hydrocarbon + ceramic, DK = 3.27-12.85): TMM3, TMM4, TMM10, TMM10i, TMM13i   Others: Kappa 438   Prepreg: RO4450B, RO4450F   Adhesive film: 2929, 3001, ULTRALAM3908, RO3003, RO3006, RO3010, RT / carbide 6002   We can provide you with prototype, small batches and mass production service. If you are interested in high frequency PCB made on Rogers, please feel free to send us back with your requirement. We are happy to share our price with you.

To prevent PCB board cracking, the following measures can be taken:   1. Reasonably select the plate material and thickness: Select the appropriate plate material and appropriate thickness according to the application needs and mechanical strength requirements. Thicker sheets generally have better strength and bending resistance.   2. Good layout design: In PCB layout design, pay attention to avoid concentrating components with excessive weight or mechanical stress to reduce the concentration of mechanical stress on the board. Reasonably distribute components and balance the layout to reduce the impact of mechanical stress.   3. Control the thermal expansion of the board: The PCB board will thermally expand when the temperature changes, and different materials have different thermal expansion coefficients. In the layout design, the thermal expansion coefficients of different materials are taken into consideration and the difference in thermal expansion between different materials is minimized to reduce the stress on the board.   4. Strengthen connection methods: Strengthen the design of connection points, such as using pins, sockets, locking screws and other fixed connection methods to improve the reliability and tensile strength of the connection.   5. Control the manufacturing process: During the PCB manufacturing process, strictly control the temperature and humidity conditions to avoid excessive soldering temperatures and excessive hot and humid environments. Follow the manufacturer's recommendations and best practices to ensure the manufacturing process meets process requirements.   6. Pressure distribution: Pay attention to the pressure distribution of the PCB board during installation and use. Avoid excessive bending, excessive squeezing or excessive twisting of the PCB board to reduce stress concentration.   7. Testing and quality control: Carry out necessary testing and quality control during the PCB manufacturing process to ensure the quality and reliability of the PCB board. Identify potential cracking issues through quality control measures such as X-ray inspection, AOI (automated optical inspection) and mechanical strength testing.       ============================================================================================================ Note: This article is forwarded from the Internet "CCTV Finance". The above copyright belongs to the original author. This account remains neutral on the content of the article. If there is any infringement or omission, please contact us in the background for correction or deletion!