quality Newly Shipped RF PCB & Rogers PCB Board factory

The production process of high-speed and high-frequency PCB boards is basically the same as that of ordinary PCB boards. The key point to achieve high frequency and high speed lies in the properties of raw materials, that is, the characteristic parameters of raw materials. The main material of high-speed and high-frequency PCB boards is high-frequency and high-speed copper-clad boards. The core requirement is to have low dielectric constant (Dk) and low dielectric loss factor (Df). In addition to ensuring low Dk and Df, the consistency of Dk parameters is also one of the important factors to measure the quality of high-speed and high-frequency PCB boards. In addition, another important parameter is the impedance characteristics of the PCB board and some other physical properties.     The dielectric constant (Dk) of the high-frequency and high-speed PDB board substrate must be small and stable. Generally speaking, the smaller the better. The signal transmission rate is inversely proportional to the square root of the material dielectric constant. High dielectric constants are prone to cause signal transmission delays.     The dielectric loss (Df) of the substrate material of high-frequency and high-speed PCB boards must be small, which mainly affects the quality of signal transmission. The smaller the dielectric loss, the smaller the signal loss.     The impedance of high-frequency and high-speed PCB boards actually refers to the parameters of resistance and reactance. Impedance control is the most basic principle for our high-speed design, because PCB circuits must consider the installation of electronic components, and after the installation, the conductivity and signal transmission performance must be considered. Therefore, the lower the impedance, the better. Generally, major board manufacturers will ensure a certain degree of impedance error during PCB processing.     =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

In antenna design, the commonly used PCB boards are as follows:   FR-4: low cost, good mechanical strength and insulation performance, relative dielectric constant is generally between 4.0 - 4.5. Suitable for general wireless communication equipment antennas, such as Bluetooth, Wi-Fi and other short-distance communication antennas. It is more suitable for cost-sensitive applications with not particularly high performance requirements.   Rogers: has a low dielectric constant and loss tangent, which can effectively reduce signal transmission loss. Different models of Rogers board dielectric constants can be selected between 2.2 - 10 to meet different design requirements. Commonly used in high-frequency antenna design, such as millimeter wave antennas, satellite communication antennas and other wireless communication systems with high signal quality requirements. Common ones include Rogers 5880, Rogers 3003, Rogers 4350B, etc., and there is also Rogers 5880LZ low dielectric constant series.   Taconic: Taconic sheets have a lower dielectric constant, which can reduce the delay and distortion of signal propagation and facilitate the transmission of high-frequency signals. The dielectric constants of different models vary. Some common models have a dielectric constant between 2 and 5, which are suitable for applications in high-frequency bands such as millimeter waves. Among them, TLY-5 is made of very light cloth-textured glass fiber, which has the advantages of dimensional stability, low dissipation factor, low moisture absorption rate, high copper peel strength, and uniform dielectric constant. It can be used in automotive radar, satellite/cellular communications, power amplifiers, LNB, LNA, LNC, and Ka, E and W bands. RF-35™ is also a common model on the market and is suitable for various high-frequency applications.   Polytetrafluoroethylene (PTFE) sheet: The dielectric constant is stable, usually between 2.0 and 3.0. The loss is very low, suitable for high-frequency signal transmission. It is often used in high-precision, high-performance antenna design, such as radar antennas, antennas in the aerospace field, and high-frequency RF circuits.   Ceramic-filled sheet: The dielectric constant can be adjusted according to different ceramic filling ratios. It has high mechanical strength and heat resistance. It can reduce costs to a certain extent while maintaining good performance. It is suitable for medium and high frequency antenna design, such as 5G communication antennas, and miniaturized antennas with specific requirements for size and performance.   Wangling sheet: Domestic sheet, commonly used types such as polytetrafluoroethylene glass fiber cloth copper clad laminate series F4BM, F4BME, polytetrafluoroethylene glass fiber cloth ceramic filled copper clad laminate series F4BTM, F4BTME. In addition, the dielectric constant of the composite dielectric substrate series TP and TF can be controlled at 3.0~25, and has the characteristics of low tangent loss and low temperature drift. It should be noted that when PCB board factories use Wangling boards for processing, certain process problems may occur because they have never processed similar boards before.       =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

Rogers PCBs are commonly used in high-frequency electronic equipment, such as wireless communication systems, satellite communication equipment, radar systems, microwave antennas, etc. It has the characteristics of low loss, low dielectric constant, low dielectric loss factor and good dimensional stability, making it perform well in high-frequency environments.     During the PCB assembly process, using Rogers' PCB materials can provide the following advantages: 1. Low loss: Rogers' PCB materials have low dielectric loss characteristics, which means less energy loss during signal transmission. This is very important for high-frequency applications and can improve signal reliability and transmission distance.   2. Thermal stability: Rogers’ PCB materials are resistant to deformation and degradation in high temperature environments. This makes them ideal for use in high-temperature applications, such as aerospace and automotive electronics.   3. Dimensional stability: Rogers' PCB materials have excellent dimensional stability, that is, maintaining their shape and size under different temperature and humidity conditions. This is very important for applications that require high accuracy and reliability.   4. Multi-layer stacking: Rogers' PCB materials can be used in multi-layer stacking, which can achieve higher integration and performance by combining different layers of materials and circuit boards together.   The above is the relevant content of Rogers PCB. However, because the material cost of Rogers PCB is relatively high and the manufacturing process is relatively complicated, it is usually used in applications that require higher performance. When designing and manufacturing Rogers PCBs, factors such as material selection, laminate construction, wire layout, impedance control, etc. need to be considered to ensure the reliability and performance of the circuit.   Generally speaking, Rogers PCB is a special printed circuit board designed for high-frequency applications, which meets the performance requirements of high-frequency electronic equipment by using Rogers materials.     =================================================================================== Copyright statement: The copyright of the information in this article belongs to the original author and does not represent the views of this platform. It is for sharing only. If there are copyright and information errors involved, please contact us to correct or delete it. Thanks!

PCB circuit boards are an important part of electronic products, and the PCB circuit boards used in different application scenarios also have different characteristics. High-frequency boards and high-speed boards are two special boards that are more important in the field of printed circuit board (PCB) manufacturing. They have different characteristics and application scenarios compared with ordinary PCB circuit boards. Below, we compare and analyze the high-frequency board and the high-speed board.     I. The definition and characteristics of high frequency board and high speed board High-frequency PCB materials and high-speed PCB materials are used in the electronics industry to process high-speed and high-frequency signals and have different characteristics and application scenarios. Here are their definitions and characteristics:   High-frequency PCB Definition: used to make high-frequency analog circuit boards, usually used in data transmission, microwave, RF and millimeter wave bands. Features: Low dielectric constant, small loss tangent, and low dielectric loss coefficient. Low moisture absorption, good radiation tolerance and stability. Suitable for circuit applications that require high reliability and precision.     High-speed PCB   definition: Designed for high-speed circuits and high-throughput applications, usually used for high-speed digital and low-frequency analog circuit boards. Features: Low dielectric constant, small signal transmission delay, and small signal distortion. Small thermal expansion coefficient, good overall stability, and can provide high-frequency noise removal. Achieve larger bandwidth and reduce crosstalk and reflections.     II. The difference between high-frequency boards and high-speed boards Although both high-frequency boards and high-speed boards are circuit boards used to transmit signals, there are several differences between the two in practical applications.   1. Different frequency ranges. High-frequency boards are used in frequency bands exceeding 500MHz, while high-speed boards are mainly used to transmit digital signals, with modulation and demodulation frequencies ranging from tens of MHz to GHz. 2. Different line widths and board thicknesses. Because high-frequency boards require fine lines, their line widths and line spacings are finer than those of high-speed boards, and the board thickness is relatively thin. The line isometry of high-speed boards is better, so the line width and line spacing can be appropriately increased, and the board thickness can also be slightly thickened. 3. Different materials. The dielectric constant of materials commonly used in high-frequency boards is smaller than that of high-speed boards to reduce signal transmission losses. The main material of high-frequency boards is PTFE (polytetrafluoroethylene), which is a low dielectric constant and low loss material; while the materials commonly used in high-speed boards are usually better than general PCB circuit boards, such as FR4 high TG material, FR-4 (glass fiber copper), which is a material between ceramics and plastics, and is usually used in ordinary PCBs. This material requires good dielectric properties, high anti-interference ability and low signal propagation delay to accurately transmit data to the target device. 4. Different manufacturing processes The manufacturing process requirements for high-frequency boards are very high. The outer layer of the high-frequency board should be flat enough to accommodate fine-tuning conductive materials. The inner layer copperization process of the high-frequency board is very special, requiring the copper layer to be very thin, usually only a few microns thick. In the PCB production process, special processes and procedures are required to ensure the manufacturing accuracy and quality of high-frequency circuit boards. Compared with high-frequency boards, the process of manufacturing high-speed boards is relatively simple. High-speed boards can be produced by using basic equipment such as drill bits of different sizes and cutting machines. On the final form of the board, the outer metal can be cut off with a rotary engraving tool to change the shape and size of the board and remove unnecessary parts. These cuts must be precise and ensure that they will not cause damage to the circuit or signal interference and other adverse effects. 5. Different design requirements In terms of PCB design, high-frequency boards and high-speed boards have different design requirements. For high-frequency boards, important design parameters are the structure and physical properties of the board, such as impedance, smoothness, adhesion and conductivity. The design of high-speed boards focuses on the transmission speed of signals, which requires accurate measurement of parameters such as delay time (TDR) and peak-to-peak value of differential signals. In actual material selection and application, it is necessary to select the appropriate PCB type based on specific needs and scenarios to ensure stable product performance and accurate signal transmission.     III. Application scenarios of high-frequency boards and high-speed boards High-frequency boards are widely used in wireless communications (such as mobile phones, satellite communications), radar systems, and antennas. Its main function is to help the transmission and transmission accuracy of high-frequency signals. Due to the use of fine lines, it can reduce signal attenuation and crosstalk, enhance the output power of circuit signals, improve transmission rate and receiving sensitivity, and have good transmission and reception characteristics. High-speed boards are used in data transmission, such as networks, computer motherboards, industrial computers, measurement and control instruments, and high-speed memory.   Focusing on data transmission, its main requirement is to maintain signal integrity, stability, and high accuracy. High-speed boards are generally used in high-speed differential signals, coaxial cables, and serial communications. Because of the good equilength of its lines, it can ensure better signal integrity and anti-interference capabilities when transmitting high-speed digital signals.

With the rapid development of electronic technology, PCB aluminum substrate, as a plate with excellent heat dissipation properties, has been widely used in the electronics industry. PCB aluminum substrate is a metal-based material plate with good thermal conductivity, electrical insulation and mechanical processing performance. Due to its unique structure and excellent performance, aluminum substrates have excellent performance in many fields. This article will introduce the types of PCB aluminum substrates in detail to help everyone better understand and choose suitable aluminum substrates.     I. Classification according to substrate   1. Pure aluminum base plate Pure aluminum substrate is the most common type of aluminum substrate, which is composed of pure aluminum plate and insulation layer. Pure aluminum plates have good thermal conductivity and mechanical strength, while the insulation layer ensures the safety and stability of the circuit. Pure aluminum substrates are suitable for most electronic products, especially when higher thermal dissipation performance is required.   2. Copper and aluminum composite substrates Copper-aluminum composite substrate is a substrate made of copper and aluminum. Copper has good electrical and thermal conductivity, while aluminum is lightweight and resistant to corrosion. Copper-aluminum composite substrate combines the advantages of two metals, has excellent heat dissipation performance and electrical performance, and is suitable for high-performance electronic products.   3. Stainless steel aluminum base board The stainless steel aluminum substrate uses stainless steel as the base material and is covered with an aluminum plate on the surface. The two are closely combined through a special process. The stainless steel aluminum substrate has high mechanical strength and corrosion resistance, while maintaining good heat dissipation properties of the aluminum substrate. This kind of substrate is suitable for electronic equipment in harsh environments.     II. Classified according to production technology   1. Copper-plated aluminum base plate Copper-plated aluminum substrate is a copper film covered on the surface of the aluminum plate by electroplating or electroless plating. The copper film has good electrical and thermal conductivity and can improve the electrical and heat dissipation properties of the aluminum substrate. Copper-plated aluminum substrates are suitable for high-frequency circuits and high-precision circuits.   2. Spray-coating aluminum substrate Sprayed aluminum substrate is a substrate formed by spraying a layer of insulating material on the surface of the aluminum plate. The spraying process can make the substrate surface flatter and improve the stability and reliability of the circuit. Sprayed aluminum substrates are suitable for electronic products with general requirements.   3. Pressed aluminum substrate Laminated aluminum substrate is a substrate formed by laminating aluminum plates and insulating materials together through high temperature and high pressure. The laminating process can improve the structural strength and electrical performance of aluminum substrates. Press-laminated aluminum substrates are suitable for electronic products that require high mechanical strength and electrical performance.       III. Classified according to usage   1. Power aluminum base board Power aluminum substrates are mainly designed for high-power electronic devices, such as power supplies, motor drivers, etc. This type of substrate needs to withstand large currents and temperatures, so thicker aluminum plates and high-quality insulating materials are usually used. The power aluminum substrate has good heat dissipation performance and electrical performance, ensuring stable operation of the equipment under high load.   2. High frequency aluminum base plate High-frequency aluminum substrate is mainly used in high-frequency circuits, such as wireless communications, radar and other equipment. Such substrates need to have good electrical and thermal conductivity to reduce signal loss and improve heat dissipation. High-frequency aluminum substrates are usually made of high-conductivity metal materials and high-performance insulating materials.   3. Precision aluminum base plate Precision aluminum substrates are mainly used for high-precision electronic equipment, such as instruments, sensors, etc. This type of substrate has higher requirements on dimensional accuracy, flatness and stability. Precision aluminum substrates usually use high-precision manufacturing processes and high-quality raw materials to ensure equipment performance and reliability.   4. Special aluminum base plate Special aluminum substrates are mainly designed for special environments and application needs, such as aerospace, military and other fields. Such substrates need to have extremely high reliability, durability and environmental adaptability. Special aluminum substrates usually use special materials and unique manufacturing processes to meet the use requirements in extreme environments.      IV. Classified by structure   1. Single layer aluminum base plate The single-layer aluminum substrate is composed of a layer of aluminum plate and a layer of insulating material, with a simple structure and low cost. It is suitable for occasions where there are certain requirements on cost and low requirements on electrical performance.   2. Double-layer aluminum base plate The double-layer aluminum substrate is composed of two layers of aluminum plates and a layer of insulating material, which has good heat dissipation performance and mechanical strength. The double-layer structure can reduce electromagnetic interference and improve signal transmission stability. Double-layer aluminum substrates are suitable for electronic equipment with high requirements on electrical performance and heat dissipation.   3. Multilayer Aluminum Substrate Multi-layer aluminum substrates are composed of multiple layers of aluminum plates and insulating materials alternately superimposed. The structure is complex and the cost is high. Multi-layer construction further improves thermal and electrical performance while reducing electromagnetic interference. Multilayer aluminum substrates are suitable for high-performance, high-precision electronic devices.