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Bicheng Newly shipped PCB

6-Layer multi Hybrid PCB with RO4350B and High Tg FR-4 (S1000-2M) bulit on 10mil Laminate core with 0.035 copper weight

F4BTMS450 high frequency laminate built for hybridpcb, Multi Layer PCB Using in RF microwave application

TLY-3 double-side laminate with Gold over silver finish using in Automotive radar

Rogers TMM10i double sided material make for multilayer PCB with Immersion Tin using in RF and microwave applications

Taconic's TLX-9 2-layer High-frequency PCB design for RF and microwave applications

TLX-0 Double-sided copper clad laminates are used to manufacture microwave hybrid | multilayer PCBs

Rogers PCB Board

Rogers RO3035 High Frequency PCB 2-Layer Rogers 3035 10mil Cirucit Board DK3.5 DF 0.0015 Microwave PCB

Rogers RO3003 High Frequency Printed Circuit Board 2-Layer Rogers 3003 30mil 0.762mm PCB with DK3.0 DF 0.001

Rogers RO3010 High Frequency PCB 2-Layer Rogers 3010 10mil 0.254mm Printed Circuit Board DK10.2 DF 0.0022 Microwave PCB

Rogers RO3006 RF Printed Circuit Board 2-Layer Rogers 3006 50mil 1.27mm Microwave PCB with Immersion Gold

Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB

Taconic PCB Board

CER-10 RF Printed Circuit Board 2-Layer CER-10 62mil 1.58mm PCB with Immersion Gold

TLX-7 Taconic High Frequency PCB Made on 62mil 1.575mm With Immersion Silver

PTFE PCB Board

Flexible Printed Circuit

FPC PCBA Fabrication Impedance Flexible PCB Cable With FR4 Stiffener and Immersion Nickel

FPC PCBA Fabrication Flex PCB Board With 3M Tape and Stainless Steel Stiffener For Antenna

FPC Circuit Board Made On PET Material FPC PCBA Fabrication Flexible PCB for Patch Antenna

FPC Circuit Board Made On PET Material with Immersion Gold FPC PCBA Fabrication

FPC Assembly for Mobile Device and Computer Equipment

Multilayer PCB Board

6 Layer High Frequency PCB Built On 3 Cores of 20mil RO4003C and 4mil RO4450F for Radar Altimeter

High Temperature PCB

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

HDI PCB Board

Stacked via Staggered via HDI | PCB 1+N+1 HDI PCB | 2+N+2 HDI PCB| How to Distinguish the Step (Stack-up) of HDI PCB?

Hybrid 10-Layer PCB Rogers RO4350 6.6mil+FR4 Hybrid PCB With Red Solder Mask and Immersion Gold

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

Hybrid PCB | Mixed Material 4-layer PCB Made On 20 mil RO4350B + FR4 With Blind Via

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via

Impedance Controlled PCB

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Printed Circuit Board with 90 Ohm Impedance Controlled | Single End Impedance Differential Impedance PCB Board

598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.

PCB Prototypes

Microwave PCB Boards Built On RO4350B 10 mil With Immersion Gold

High Frequency PCB Bare Board | 10 mil RO4350B Printed Circuit Board | Immersion Gold HF PWB

High Frequency PCB Bare Board | 10 mil RO4350B Printed Circuit Board | Immersion Gold HF PWB

Blog

IT-180A high frequency PCB Tg (175℃ by DSC) 4-Layer 1.6mm thick with immersion Gold and white solder mask

Metal Core PCB Built On Aluminum Base With Composite Structure and Flying Probe Test

1.4 Meter Long MCPCB Built on 1.0mm Aluminum Core With HASL Lead Free for power LED lighting

Rogers RO4003C LoPro Substrate - 32.7mil (0.831mm) 2-Layer PCB with Immersion Silver apply for power amplifiers

Rogers RTduroid 6006 PCB 2-layer 10mil thickness with Immesion Gold designed for electronic and microwave circuit applications

Rogers RO4730G3 PCB 2-layer 60mil 1.6mm thickness Dk of 3.0 with Electroless Nickel Electroless Palladium and Immersion Gold

Arlon PCB Board

Microwave PCB Boards Built On RO4350B 10 mil With Immersion Gold

High Frequency PCB Boards Built On RO4350B 10 mil With Immersion Gold

High Speed PCB Boards Built On RO4350B 10 mil With Immersion Gold

Hybrid PCB Board

FR-4 PCB Board

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

Single Sided Aluminum PCB 1W / MK 6061 Aluminum Matal Core HASL Pb Free

9oz Heavy Copper Aluminum PCB for High Current Application

High Frequency PCB

Rogers 5880LZ High Frequency PCB RT/duroid 5880LZ 50mil 1.27mm 2-Layer Circuit Board with Immersion Gold

RO4003C LoPro RF PCB Rogers 60.7mil Circuit Board With Immersion Gold for Power Amplifiers

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

RO4003C LoPro PCB Rogers 12.7mil Reverse Treated Foil (RTF) Circuit Board for High Speed Back Planes.

Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold

RO4350B LoPro High Frequency PCB 10.7mil Rogers Reverse Treated Foil Circuit Board With Immersion Gold

F4B SERIES PCBS

F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

RF PCB

Rogers’ RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass

Rogers RO4730G3 DK 3.0 antenna laminates PCB with high temperature lead-free solder processing

TLX-8 Single Sided, Double Sided PCB bulit on 5mil, 10mil, 20mil, 30mil, 60mil, 110mil

RT/duroid 6006 customized PCB with big size including Single Sided, Double Sided, Multi-layer, Hybrid Configuration

RF-35TC PCB built on 5mil, 10mil, 20mil, 30mil, 60mil with ENEPIG, Pure gold, OSP is suited for high power applications

RO3006 DK of 6.15 PCB circuit materials base on 5mil, 10mil, 20mil, 30mil, 60mil

Copper Clad Laminates

RT/duroid® 5880 Copper-Clad Laminate 0.127mm 0.252mm 0.508mm 0.787mm 1.575mm thickness substrate for multilayer hybrid PCB

DK 2.2 RT/duroid 5880LZ substrate 0.508mm double sided copper clad laminate with 35µm for multy-layer and hybrid PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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