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TMM4 2-Layer PCB built on 15mil substrate with Immersion Gold Finish both side 35um copper weight in RF and Microwave Circuitry

TMM4 2-Layer PCB built on 15mil substrate with Immersion Gold Finish both side 35um copper weight in RF and Microwave Circuitry

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
TMM4
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

15mil TMM4 2-Layer PCB with Immersion Gold Finish

 

 

The 15mil TMM4 2-Layer PCB is a premium-quality circuit board designed for high-frequency and microwave applications. Built with Rogers TMM4 laminate, this custom-designed PCB offers exceptional reliability, low signal loss, and unmatched mechanical stability. Its compact size, robust construction, and high-performance material make it an ideal choice for RF and microwave circuitry, satellite communication systems, GPS antennas, and more.

 

 

Engineered for precision and durability, this PCB features Immersion Gold surface finish for superior solderability and conductivity. It adheres to the IPC-Class-2 standard, ensuring consistent quality and reliability for demanding applications. The 15mil TMM4 core provides low dissipation and excellent dielectric properties, making it suitable for high-frequency designs where signal integrity is critical.

 

TMM4 2-Layer PCB built on 15mil substrate with Immersion Gold Finish both side 35um copper weight in RF and Microwave Circuitry 0

 

 

Key Construction Details

Parameter Specification
Base Material Rogers TMM4
Layer Count 2 layers
Board Dimensions 102mm x 85mm, tolerance: +/- 0.15mm
Finished Board Thickness 0.5mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.4mm
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Solder Mask None (top and bottom)
Silkscreen None (top and bottom)
Electrical Testing 100% tested prior to shipment

 

The PCB is designed without solder masks or silkscreens, prioritizing performance and simplicity. This ensures a cleaner, more direct layout for high-frequency applications.

 

 

 

PCB Stackup

Copper Layer 1: 35 μm (1oz)

Rogers TMM4 Core: 0.381mm (15mil)

Copper Layer 2: 35 μm (1oz)

 

 

 

What is Rogers TMM4 Laminate?

The TMM4 laminate is a high-performance, thermoset microwave material specifically designed for RF and microwave applications. It combines the benefits of ceramic and PTFE laminates without requiring specialized processing techniques. The TMM4 material is composed of a ceramic-filled hydrocarbon polymer that offers exceptional mechanical and electrical properties.

 

 

Key Features of TMM4 Material:

Property Value
Dielectric Constant (Dk) 4.50 ± 0.045
Dissipation Factor 0.0020 at 10GHz
Thermal Coefficient of Dk 15 ppm/°K
Thermal Conductivity 0.7 W/mK
Moisture Absorption 0.07%-0.18%
Decomposition Temperature 425°C (TGA)
CTE (Coefficient of Thermal Expansion) x: 16 ppm/°K, y: 16 ppm/°K, z: 21 ppm/°K

 

 

 

Benefits of the 15mil TMM4 PCB

  • Low Signal Loss: The low dissipation factor (0.0020 at 10GHz) ensures minimal signal attenuation, making it ideal for RF and microwave circuitry.
  • High Thermal Stability: With a decomposition temperature of 425°C, the PCB performs exceptionally well in high-heat environments.
  • Reliable Wire-Bonding: The thermoset resin-based TMM4 material prevents pad lifting and substrate deformation during wire-bonding.
  • Durable Via Plating: The 20 μm via plating thickness ensures high reliability for plated-through holes.
  • Ease of Processing: TMM4 laminates can be processed using standard PWB techniques, reducing manufacturing complexity compared to PTFE materials.

 

 

Applications

RF and Microwave Circuitry

Satellite Communication Systems

Power Amplifiers and Combiners

GPS and Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

 

 

Conclusion

The 15mil TMM4 2-Layer PCB with Immersion Gold finish is a superior choice for engineers and manufacturers seeking high reliability, low signal loss, and excellent thermal stability in RF and microwave designs. Its compact design, advanced TMM4 laminate, and precise construction make it suitable for a wide range of demanding applications, from satellite communications to GPS antennas and power amplifiers.

 

 

With worldwide availability and compliance with IPC-Class-2 standards, this PCB is ready to meet the needs of advanced high-frequency systems.

 

products
PRODUCTS DETAILS
TMM4 2-Layer PCB built on 15mil substrate with Immersion Gold Finish both side 35um copper weight in RF and Microwave Circuitry
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
TMM4
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

15mil TMM4 2-Layer PCB with Immersion Gold Finish

 

 

The 15mil TMM4 2-Layer PCB is a premium-quality circuit board designed for high-frequency and microwave applications. Built with Rogers TMM4 laminate, this custom-designed PCB offers exceptional reliability, low signal loss, and unmatched mechanical stability. Its compact size, robust construction, and high-performance material make it an ideal choice for RF and microwave circuitry, satellite communication systems, GPS antennas, and more.

 

 

Engineered for precision and durability, this PCB features Immersion Gold surface finish for superior solderability and conductivity. It adheres to the IPC-Class-2 standard, ensuring consistent quality and reliability for demanding applications. The 15mil TMM4 core provides low dissipation and excellent dielectric properties, making it suitable for high-frequency designs where signal integrity is critical.

 

TMM4 2-Layer PCB built on 15mil substrate with Immersion Gold Finish both side 35um copper weight in RF and Microwave Circuitry 0

 

 

Key Construction Details

Parameter Specification
Base Material Rogers TMM4
Layer Count 2 layers
Board Dimensions 102mm x 85mm, tolerance: +/- 0.15mm
Finished Board Thickness 0.5mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.4mm
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Solder Mask None (top and bottom)
Silkscreen None (top and bottom)
Electrical Testing 100% tested prior to shipment

 

The PCB is designed without solder masks or silkscreens, prioritizing performance and simplicity. This ensures a cleaner, more direct layout for high-frequency applications.

 

 

 

PCB Stackup

Copper Layer 1: 35 μm (1oz)

Rogers TMM4 Core: 0.381mm (15mil)

Copper Layer 2: 35 μm (1oz)

 

 

 

What is Rogers TMM4 Laminate?

The TMM4 laminate is a high-performance, thermoset microwave material specifically designed for RF and microwave applications. It combines the benefits of ceramic and PTFE laminates without requiring specialized processing techniques. The TMM4 material is composed of a ceramic-filled hydrocarbon polymer that offers exceptional mechanical and electrical properties.

 

 

Key Features of TMM4 Material:

Property Value
Dielectric Constant (Dk) 4.50 ± 0.045
Dissipation Factor 0.0020 at 10GHz
Thermal Coefficient of Dk 15 ppm/°K
Thermal Conductivity 0.7 W/mK
Moisture Absorption 0.07%-0.18%
Decomposition Temperature 425°C (TGA)
CTE (Coefficient of Thermal Expansion) x: 16 ppm/°K, y: 16 ppm/°K, z: 21 ppm/°K

 

 

 

Benefits of the 15mil TMM4 PCB

  • Low Signal Loss: The low dissipation factor (0.0020 at 10GHz) ensures minimal signal attenuation, making it ideal for RF and microwave circuitry.
  • High Thermal Stability: With a decomposition temperature of 425°C, the PCB performs exceptionally well in high-heat environments.
  • Reliable Wire-Bonding: The thermoset resin-based TMM4 material prevents pad lifting and substrate deformation during wire-bonding.
  • Durable Via Plating: The 20 μm via plating thickness ensures high reliability for plated-through holes.
  • Ease of Processing: TMM4 laminates can be processed using standard PWB techniques, reducing manufacturing complexity compared to PTFE materials.

 

 

Applications

RF and Microwave Circuitry

Satellite Communication Systems

Power Amplifiers and Combiners

GPS and Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

 

 

Conclusion

The 15mil TMM4 2-Layer PCB with Immersion Gold finish is a superior choice for engineers and manufacturers seeking high reliability, low signal loss, and excellent thermal stability in RF and microwave designs. Its compact design, advanced TMM4 laminate, and precise construction make it suitable for a wide range of demanding applications, from satellite communications to GPS antennas and power amplifiers.

 

 

With worldwide availability and compliance with IPC-Class-2 standards, this PCB is ready to meet the needs of advanced high-frequency systems.

 

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