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15mil TMM10i Double-Sided PCB with pure gold plating surface finish (without nickel) for Power Amplifiers and Combiners

15mil TMM10i Double-Sided PCB with pure gold plating surface finish (without nickel) for Power Amplifiers and Combiners

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
TMM10i
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

15mil TMM10i Double-Sided PCB with Pure Gold Plating

 

 

The 15mil TMM10i Double-Sided PCB is a high-performance circuit board designed to meet the rigorous demands of RF and microwave applications. Featuring Rogers TMM10i laminate, this PCB combines excellent electrical performance, mechanical stability, and versatility. The pure gold plating surface finish (without nickel) ensures superior conductivity and solderability, making it an exceptional choice for high-frequency designs where signal integrity and reliability are critical.

 

15mil TMM10i Double-Sided PCB with pure gold plating surface finish (without nickel) for Power Amplifiers and Combiners 0

 

Built for engineers requiring precision and durability, this PCB adheres to IPC-Class-2 standards and undergoes a 100% electrical test prior to shipment, ensuring consistent quality and performance. Its compact size and optimized construction make it ideal for applications such as satellite communication systems, GPS antennas, and power amplifiers.

 

 

Key Construction Details

Parameter Specification
Base Material Rogers TMM10i
Layer Count Double-sided
Board Dimensions 102.8mm x 59mm, tolerance: +/- 0.15mm
Finished Board Thickness 0.5mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Via Plating Thickness 20 μm
Surface Finish Pure Gold Plating (No Nickel)
Solder Mask None (top and bottom)
Silkscreen None (top and bottom)
Electrical Testing 100% tested prior to shipment

This PCB is designed without solder masks or silkscreens, focusing entirely on performance optimization for high-frequency and microwave designs.

 

 

PCB Stackup

The 2-layer rigid PCB stackup leverages the capabilities of TMM10i material for enhanced performance. The stackup includes:

Copper Layer 1: 35 μm (1oz), providing reliable conductivity.

Rogers TMM10i Core: 0.381mm (15mil), offering stable and isotropic dielectric properties.

Copper Layer 2: 35 μm (1oz), ensuring low-loss signal transmission.

 

 

 

What is Rogers TMM10i Laminate?

The TMM10i laminate is a ceramic-filled thermoset polymer composite designed for high-frequency and microwave applications. It features an isotropic dielectric constant (Dk), making it ideal for stripline and microstrip designs where uniform performance is essential. TMM10i offers the benefits of ceramic and PTFE laminates while maintaining the ease of processing associated with soft substrates.

 

 

Key Features of TMM10i Material:

Property Value
Dielectric Constant (Dk) 9.80 ± 0.245
Dissipation Factor 0.0020 at 10GHz
Thermal Coefficient of Dk -43 ppm/°K
Thermal Conductivity 0.76 W/mK
Decomposition Temperature 425°C (TGA)
CTE (Coefficient of Thermal Expansion) x: 19 ppm/°K, y: 19 ppm/°K, z: 20 ppm/°K

 

 

 

Benefits of the 15mil TMM10i PCB

  • Pure Gold Plating: The pure gold plating surface finish ensures excellent conductivity and oxidation resistance, making it ideal for high-frequency applications. Without a nickel layer, this finish avoids potential signal distortion from skin effect issues.
  • Low Signal Loss: The low dissipation factor (0.0020 at 10GHz) minimizes signal attenuation, ensuring high fidelity in RF and microwave designs.
  • High Thermal Stability: With a decomposition temperature of 425°C, the PCB performs reliably under extreme conditions.
  • Isotropic Dielectric Constant: The consistent Dk of 9.80 ± 0.245 ensures stable performance across all directions, making it ideal for precision RF designs.
  • Reliable Wire-Bonding: The thermoset resin construction allows for dependable wire-bonding without substrate deformation or pad lifting.

 

 

Applications

RF and Microwave Circuitry

Satellite Communication Systems

Power Amplifiers and Combiners

GPS and Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

 

 

Conclusion

The 15mil TMM10i Double-Sided PCB with Pure Gold Plating is a cutting-edge solution for engineers and manufacturers seeking premium performance, reliability, and precision. Its advanced TMM10i laminate, combined with pure gold plating and meticulous construction, ensures superior performance in RF and microwave applications. With worldwide availability and compliance with IPC-Class-2 standards, this PCB is ready to deliver exceptional results for your most demanding high-frequency designs.

 

 

products
PRODUCTS DETAILS
15mil TMM10i Double-Sided PCB with pure gold plating surface finish (without nickel) for Power Amplifiers and Combiners
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
TMM10i
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

15mil TMM10i Double-Sided PCB with Pure Gold Plating

 

 

The 15mil TMM10i Double-Sided PCB is a high-performance circuit board designed to meet the rigorous demands of RF and microwave applications. Featuring Rogers TMM10i laminate, this PCB combines excellent electrical performance, mechanical stability, and versatility. The pure gold plating surface finish (without nickel) ensures superior conductivity and solderability, making it an exceptional choice for high-frequency designs where signal integrity and reliability are critical.

 

15mil TMM10i Double-Sided PCB with pure gold plating surface finish (without nickel) for Power Amplifiers and Combiners 0

 

Built for engineers requiring precision and durability, this PCB adheres to IPC-Class-2 standards and undergoes a 100% electrical test prior to shipment, ensuring consistent quality and performance. Its compact size and optimized construction make it ideal for applications such as satellite communication systems, GPS antennas, and power amplifiers.

 

 

Key Construction Details

Parameter Specification
Base Material Rogers TMM10i
Layer Count Double-sided
Board Dimensions 102.8mm x 59mm, tolerance: +/- 0.15mm
Finished Board Thickness 0.5mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Via Plating Thickness 20 μm
Surface Finish Pure Gold Plating (No Nickel)
Solder Mask None (top and bottom)
Silkscreen None (top and bottom)
Electrical Testing 100% tested prior to shipment

This PCB is designed without solder masks or silkscreens, focusing entirely on performance optimization for high-frequency and microwave designs.

 

 

PCB Stackup

The 2-layer rigid PCB stackup leverages the capabilities of TMM10i material for enhanced performance. The stackup includes:

Copper Layer 1: 35 μm (1oz), providing reliable conductivity.

Rogers TMM10i Core: 0.381mm (15mil), offering stable and isotropic dielectric properties.

Copper Layer 2: 35 μm (1oz), ensuring low-loss signal transmission.

 

 

 

What is Rogers TMM10i Laminate?

The TMM10i laminate is a ceramic-filled thermoset polymer composite designed for high-frequency and microwave applications. It features an isotropic dielectric constant (Dk), making it ideal for stripline and microstrip designs where uniform performance is essential. TMM10i offers the benefits of ceramic and PTFE laminates while maintaining the ease of processing associated with soft substrates.

 

 

Key Features of TMM10i Material:

Property Value
Dielectric Constant (Dk) 9.80 ± 0.245
Dissipation Factor 0.0020 at 10GHz
Thermal Coefficient of Dk -43 ppm/°K
Thermal Conductivity 0.76 W/mK
Decomposition Temperature 425°C (TGA)
CTE (Coefficient of Thermal Expansion) x: 19 ppm/°K, y: 19 ppm/°K, z: 20 ppm/°K

 

 

 

Benefits of the 15mil TMM10i PCB

  • Pure Gold Plating: The pure gold plating surface finish ensures excellent conductivity and oxidation resistance, making it ideal for high-frequency applications. Without a nickel layer, this finish avoids potential signal distortion from skin effect issues.
  • Low Signal Loss: The low dissipation factor (0.0020 at 10GHz) minimizes signal attenuation, ensuring high fidelity in RF and microwave designs.
  • High Thermal Stability: With a decomposition temperature of 425°C, the PCB performs reliably under extreme conditions.
  • Isotropic Dielectric Constant: The consistent Dk of 9.80 ± 0.245 ensures stable performance across all directions, making it ideal for precision RF designs.
  • Reliable Wire-Bonding: The thermoset resin construction allows for dependable wire-bonding without substrate deformation or pad lifting.

 

 

Applications

RF and Microwave Circuitry

Satellite Communication Systems

Power Amplifiers and Combiners

GPS and Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

 

 

Conclusion

The 15mil TMM10i Double-Sided PCB with Pure Gold Plating is a cutting-edge solution for engineers and manufacturers seeking premium performance, reliability, and precision. Its advanced TMM10i laminate, combined with pure gold plating and meticulous construction, ensures superior performance in RF and microwave applications. With worldwide availability and compliance with IPC-Class-2 standards, this PCB is ready to deliver exceptional results for your most demanding high-frequency designs.

 

 

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