Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm

Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm

  • Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm
  • Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm
Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0323-V3.23
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: PI, PET Board Thickness: 0.03mm-3.0mm
Surface/Inner Layer Cu Thickness: 0.5oz, 1oz, 2oz Surface Finish: Immersion Gold, Immersion Sliver, Immersion Tin
Coverlay Colour: Yellow, White, Black, Green Color Of Silkscreen: Yellow, White, Black, Green
Function: 100% Pass Electrical Test Number Of Layers: Single Layer, Doulbe Layer, Multilayer, Rigid-Flex

Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)



RO3206 high frequency circuit materials are laminates that contain ceramic fillers and are reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while maintaining competitive pricing. They are an extension of the RO3000 series high frequency circuit materials, with the notable improvement of enhanced mechanical stability.


With a dielectric constant of 6.15 and a low dissipation factor of 0.0027, RO3206 high frequency circuit materials offer an extended useful frequency range beyond 40 GHz. This makes them suitable for applications requiring high-frequency performance.


The RO3206 laminates combine the advantages of a non-woven PTFE laminate, such as surface smoothness for finer line etching tolerances, with the rigidity provided by a woven-glass PTFE laminate. These materials can be easily fabricated into printed circuit boards using standard PTFE circuit board processing techniques.


To ensure consistent quality, RO3206 laminates are manufactured under an ISO 9002 certified quality system. This certification guarantees that the materials meet stringent quality standards and adhere to established manufacturing practices.


Features and Benefits:

RO3206 offers the following features and benefits:


Woven glass reinforcement:

Enhances rigidity, facilitating easier handling during fabrication and assembly processes.


Uniform electrical and mechanical performance:

Ideal for complex multi-layer high frequency structures, ensuring consistent performance throughout the design.


Low dielectric loss:

Enables excellent high frequency performance by minimizing signal loss and distortion.


Low in-plane expansion coefficient (matched to copper):

Compatible with epoxy multi-layer board hybrid designs, ensuring reliable surface mounted assemblies.


Excellent dimensional stability:

Maintains consistent dimensions and shape during manufacturing processes, leading to high production yields.


Cost-effective pricing:

Provides economical solutions for volume manufacturing, making it a cost-efficient option for large-scale production.


Surface smoothness:

Features a smooth surface that allows for finer line etching tolerances, enabling precise circuit design and fabrication.


Our PCB Capability (RO3206)

PCB Capability (RO3206)
PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3206
Dielectric constant: 6.15
Dissipation factor 0.0027
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..



Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil 0.635mm 1.27mm 0


Typical Applications


RO3206 PCBs find application in various industries, including:

  • Automotive collision avoidance systems
  • Automotive global position satellite antennas
  • Base station infrastructure
  • Direct broadcast satellites
  • Datalink on cable systems
  • LMDS (Local Multipoint Distribution Service) and wireless broadband
  • Microstrip patch antennas for wireless communications
  • Remote meter readers
  • Power backplanes
  • Wireless telecommunications systems


RO3206 Data Sheet

Typical Values
Property RO3206 Direction Unit Condtion Test Method
Dielectric Constant, εr Process 6.15± 0.15 Z - 10 GHz 23°C IPC-TM-650 Clamped Stripline
Dielectric Constant, εr Design 6.6 Z - 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan δ 0.0027 Z - 10 GHz 23°C IPC-TM-650
Thermal Coefficient of εr -212 Z ppm/°C 10 GHz 0-100°C IPC-TM-650
Dimensional Stability 0.8 X,Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ•cm COND A IPC
Surface Resistivity 103   MΩ COND A IPC
Tensile Modulus 462
kpsi 23°C ASTM D638
Water Absorption <0.1 - % D24/23 IPC-TM-650
Specific Heat 0.85   J/g/K   Calculated
Thermal Conductivity 0.67 - W/m/K 80°C ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C) 13
ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
Td 500   °C TGA ASTM D3850
Color Tan        
Density 2.7   gm/cm3    
Copper Peel Strength 10.7   pli 1 oz. EDC After Solder Float IPC-TM-2.4.8
Flammability V-0       UL 94
Lead Free Process

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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