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Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil

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Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil

MOQ:	1 PIECE
Price:	USD2 .99-7.99 per piece
Standard Packaging:	VACUUM
Delivery Period:	8-9 WORKING DAY
Payment Method:	T/T,Paypal
Supply Capacity:	50000 PIECE PER MONTH

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng Enterprise Limited

Certification

Model Number

BIC-0295-V2.95

Board Material:

PET 25µm

Board Thickness:

0.20 Mm

Surface/Inner Layer Cu Thickness:

35 µm

Surface Finish:

Immersion Gold

Coverlay Colour:

Black

Color Of Silkscreen:

White

Function:

100% Pass Electrical Test

Number Of Layers:

Minimum Order Quantity:

1 PIECE

Price:

USD2 .99-7.99 per piece

Packaging Details:

VACUUM

Delivery Time:

8-9 WORKING DAY

Payment Terms:

T/T,Paypal

Supply Ability:

50000 PIECE PER MONTH

Product Description

Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.

The resin systems used in RO4725JXR dielectric materials offer the essential properties required for optimal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processes. Unlike traditional PTFE-based laminates, these materials do not require special treatment for plated through-hole preparation. By choosing RO4725JXR laminates, designers can achieve cost-effective solutions without compromising performance.

Features:

1.Dielectric constant of 2.55+/- 0.05

2. Low Z-axis coefficient of thermal expansion at 25.6 ppm/°C

3. Low TCDk (Thermal Coefficient of Dielectric Constant) of +34 ppm/°C

4. Dissipation factors ranging from .0022 to .0026

5. High glass transition temperature (Tg) exceeding 280°C

Benefits:

Low insertion loss, ensuring minimal signal loss during transmission
Dk (Dielectric Constant) matched to standard PTFE-based antenna offerings, facilitating seamless integration with existing designs
Reduced passive inter-modulation (PIM), leading to improved signal quality and less interference
Consistent circuit performance, providing reliable and predictable results.

Our PCB Capability( RO4725JXR)

PCB Capability (TMM10)
PCB material:	Hydrocarbon / Ceramic / Woven Glass
Designation:	RO4725JXR
Dielectric constant:	2.55
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:	30.7mil(0.780mm), 60.7mil (1.542mm)
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow, White etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..

Typical Applications

Cellular Base Station Antennas

Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil 0

RO4725JXR Typical Properties

Property	RO4725JXR	Direction	Units	Condition	Test Method
Dielectric Constant, εr Process	2.55 ± 0.05	Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design	2.64	Z		1.7 GHz - 5 GHz	Differential Phase Length Method
Dissipation Factor	0.0026	Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
Dissipation Factor	0.0022	Z		2.5GHz	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+34	Z	ppm/°C	-50°C to 150°C	IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030")	2.16 X 10^8		MΩ•cm	COND A	IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030")	4.8 X 10^7		MΩ	COND A	IPC-TM-650, 2.5.17.1
PIM	-166		dBc	50 ohm 0.060”	43dBm 1900MHz
Electrical Strength (0.030”)	630	Z	V/mil		IPC-TM-650, 2.5.6.2
Flexural Strength MD	121 (17.5)		MPa (kpsi)	RT	ASTM D790
CMD	92 (13.3)		MPa (kpsi)	RT	ASTM D790
Dimensional Stability	<0.4	X,Y	mm/m	after etch +E2/150°C	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	13.9	X	ppm/°C	-55 TO 288°C	IPC-TM-650, 2.1.24
	19.0	Y
	25.6	Z
Thermal Conductivity	0.38	Z	W/mK°	50°C	ASTM D5470
Moisture Absorption	0.24%		%	48/50	IPC-TM-650 2.6.2.1 ASTM D570
Tg	>280		°C		IPC-TM-650 2.4.24
Td	439		°C		ASTM D3850
Density	1.27		gm/cm3		ASTM D792
Copper Peel Strength	8.5		pli	1 oz LoPro EDC	IPC-TM-650 2.4.8
Flammability	N/A				UL94
Lead-Free Process Compatible	YES

Tags:

pcb circuit board,

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