TP2500 ultra High DK25 High-Frequency Laminate ceramic and PPO resin and Custom 0.8 mm double layer PCB with Pure gold plating (Nickel free) for Beidou navigation systems

Product Description

For RF designers seeking the highest available dielectric constant in a machinable, non-ceramic substrate, Wangling's TP2500 high-frequency laminate offers a unique solution. The TP series is a distinctive high-frequency thermoplastic material in the industry, with a dielectric layer composed of ceramics and polyphenylene oxide (PPO) resin—containing no glass fabric reinforcement. By adjusting the ratio between ceramic and PPO resin, the dielectric constant can be precisely controlled. Manufactured with a special process, the material offers excellent dielectric performance and high reliability.

The TP series spans an exceptionally wide dielectric constant range from 3 to 25, with common values including 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. TP2500 sits at the top of this range with a dielectric constant of 25.0—enabling dramatic miniaturization of RF circuits where space is at an absolute premium. The material is available in three configurations: TP (unclad, smooth surface), TP-1 (single-sided copper clad), and TP-2 (double-sided copper clad).

Standard panel sizes include 150×150mm, 160×160mm, 200×200mm, and 170×240mm, with custom sizes available. Standard thicknesses range from 0.5mm to 12.0mm, with custom thicknesses available. For Dk ≤ 10.2, the minimum thickness is 0.5mm; for Dk > 10.2 (including TP2500), the minimum thickness is 0.8mm.

Key Properties at a Glance:

Applications

TP2500 laminates are well suited to a broad range of high-frequency applications, including:

1. -Beidou navigation systems
2. -Missile-borne equipment
3. -Fuzes
4. -Miniaturized antennas
5. -RF and Microwave Circuitry 

Custom PCB Manufacturing on TP2500

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Wangling TP2500 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

Material Advantages

Extremely High Dielectric Constant:
TP2500 offers a dielectric constant of 25.0 ± 1.0 at 5 GHz, the highest in the TP series. This exceptionally high Dk enables dramatic miniaturization of RF circuits—patch antennas, filters, and matching networks can be reduced to a fraction of the size required with conventional materials. For space-constrained applications such as missile-borne systems and miniaturized antennas, this size reduction is transformative.

Low Dielectric Loss:
With a dissipation factor of 0.0020 to 0.0025 at 5 GHz, TP2500 maintains low loss despite its high dielectric constant. While loss increases with frequency, the change remains modest within the 10 GHz range, ensuring consistent performance across common wireless bands.

No Fiberglass Reinforcement:
The TP series contains no glass fabric reinforcement. The dielectric layer consists of ceramics and PPO resin, eliminating the fiberglass effect that can cause variations in dielectric constant and providing more homogeneous electrical performance.

Excellent Low-Temperature Performance:

TP2500 can be used continuously from -100°C to +150°C, with particularly excellent low-temperature characteristics. This makes it suitable for applications subject to extreme cold, including high-altitude and space environments. Note that when temperature exceeds 180°C, the material may deform, the copper foil may peel off, and electrical performance may change significantly.

Radiation Resistance and Low Outgassing:
The material is resistant to radiation and exhibits low outgassing properties, critical for space and defense applications where material degradation and contamination must be minimized.

Ultra-Low Moisture Absorption:
With moisture absorption of ≤0.01%, TP2500 maintains stable electrical properties even in humid environments—an essential attribute for outdoor and harsh-environment applications.

Superior Adhesion and Machinability:
The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum coating. The material is easy to machine—drilling, turning, grinding, shearing, and etching are all possible, unlike ceramic substrates. This dramatically reduces processing costs and increases yield.

Processing Notes:
TP2500 is a thermoplastic material and should be processed accordingly. Multilayer lamination is generally not recommended; if required, low-temperature bonding sheets should be selected with careful consideration of feasibility. The material is not suitable for 260°C thermal shock testing or wave soldering. Soldering is recommended using a constant-temperature soldering iron for manual work. Reflow soldering is generally not recommended; if performed, the maximum set temperature should not exceed 200°C, with full consideration of feasibility and stability.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative copper foils, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.