TP960 DK9.6 High-Frequency Laminate consists of ceramics and polyphenylene Oxide resin (PPO) and Custom 1MM thermoplastic material PCB with EPIG

Product Description

For compact, high-reliability RF designs requiring a high dielectric constant and excellent low-temperature performance, Wangling's TP960 high-frequency laminate delivers a compelling combination of properties. The TP series is a unique high-frequency thermoplastic material in the industry, with a dielectric layer composed of ceramics and polyphenylene oxide (PPO) resin—without fiberglass reinforcement. The dielectric constant is precisely adjusted by tuning the ratio between ceramics and PPO resin, and the specialized production process yields excellent dielectric performance and high reliability.

The TP series offers an exceptionally wide dielectric constant range from 3 to 25, with common values including 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20. The material is available in three configurations: TP (unclad, smooth surface), TP-1 (single-sided copper clad), and TP-2 (double-sided copper clad).

TP960 features a dielectric constant of 9.6, making it an excellent candidate for miniaturized antenna designs where physical size reduction is critical. Its low moisture absorption, wide operating temperature range, and radiation resistance make it ideal for demanding applications including BeiDou navigation, missile-borne systems, fuze technology, and compact antennas.

Standard panel sizes include 150×150mm, 160×160mm, 200×200mm, and 170×240mm, with custom sizes available. Standard thicknesses range from 0.5mm to 12.0mm, with custom thicknesses available. For Dk ≤ 10.2, the minimum thickness is 0.5mm; for Dk > 10.2, the minimum thickness is 0.8mm.

Key Properties at a Glance:

Applications

TP960 laminates are well suited to a broad range of high-frequency applications, including:

1. Global Satellite Navigation Systems – BeiDou and other GNSS constellations
2. Missile-Borne Systems – Compact, rugged RF front-ends
3. Fuze Technology – Miniaturized, reliable RF circuits
4. Miniaturized Antennas – High Dk enables significant size reduction
5. Aerospace and Defense Electronics – Radiation resistance and low outgassing
6. RF and Microwave Circuitry – Stable Dk for consistent performance

Custom PCB Manufacturing on TP960

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Wangling TP960 and other advanced materials. The following specification details a representative double-sided rigid PCB implementation:

PCB Construction Details:

Material Advantages

High, Precisely Controlled Dielectric Constant:
TP960 offers a dielectric constant of 9.6 ± 0.19 at 10 GHz with a tolerance of ±2%. The high Dk enables significant miniaturization of RF circuits—patch antennas, filters, and matching networks can be substantially reduced in size compared to lower-Dk materials, making TP960 ideal for space-constrained applications.

Low Dielectric Loss:
With a dissipation factor of 0.0012 at 10 GHz, TP960 minimizes signal attenuation in transmission lines. While loss increases with frequency, the change remains modest within the 10 GHz range, ensuring consistent performance across common wireless bands.

No Fiberglass Reinforcement:
The TP series contains no glass fiber reinforcement. The dielectric layer consists of ceramics and PPO resin, eliminating the fiberglass effect that can cause variations in dielectric constant and providing more homogeneous electrical performance.

Excellent Low-Temperature Performance:
TP960 can be used continuously from -100°C to +150°C, with particularly excellent low-temperature characteristics. This makes it suitable for applications subject to extreme cold, including high-altitude and space environments.

Radiation Resistance and Low Outgassing:
The material exhibits radiation resistance and low outgassing properties, critical for space and defense applications where material degradation and contamination must be minimized.

Very Low Moisture Absorption:
With moisture absorption of just 0.01%, TP960 maintains stable electrical properties even in humid environments—an essential attribute for outdoor and harsh-environment applications.

Superior Adhesion and Machinability:
The adhesion between copper foil and dielectric is more reliable than vacuum-deposited films on ceramic substrates. The material is easy to machine—drilling, turning, grinding, shearing, and milling are all possible, unlike ceramic substrates. This dramatically reduces processing costs and increases yield.

Processing Notes:
TP960 is a thermoplastic material and should be processed accordingly. Multilayer lamination is generally not recommended; if required, low-temperature bonding sheets should be selected with careful consideration of feasibility. The material is not suitable for 260°C thermal shock testing or wave soldering. Soldering is recommended using a constant-temperature soldering iron for manual work. Reflow soldering is generally not recommended; if performed, the maximum set temperature should not exceed 200°C, with full consideration of feasibility and stability.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative copper foils, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.