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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-506-V0.81
Number Of Layers:
4
Glass Epoxy:
IT-180ATC
Final Foil:
1.5
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
HASL Lead Free
Solder Mask Color:
Black
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

 

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

 

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance 0

 

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

 

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Appendix: General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8   lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content)     --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content)     --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum     N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction   410-440
Thermal Stress 10 s at 288°C      
A. Unetched 2.4.13.1 Pass Rating
B. Etched   Pass  
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE      
A. Alpha 1   45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C   2.7 %
Thermal Resistance      
A. T260 2.4.24.1 >60 Minutes
 
High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance 1

 

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
  • name
  • name
  • name
  • name
  • name
High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-506-V0.81
Number Of Layers:
4
Glass Epoxy:
IT-180ATC
Final Foil:
1.5
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
HASL Lead Free
Solder Mask Color:
Black
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

 

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

 

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance 0

 

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

 

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Appendix: General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8   lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content)     --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content)     --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum     N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction   410-440
Thermal Stress 10 s at 288°C      
A. Unetched 2.4.13.1 Pass Rating
B. Etched   Pass  
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE      
A. Alpha 1   45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C   2.7 %
Thermal Resistance      
A. T260 2.4.24.1 >60 Minutes
 
High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance 1

 

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