TP440 DK value 4.4 High-Frequency Thermoplastic PPO/Ceramic Laminate material & Custom 2-Layer bare copper PCB with low-temperature range -100°C to +150°C

Product Description

TP440 High-Frequency Thermoplastic PPO/Ceramic Laminate & Custom 2-Layer PCB Solution

 

1. Introduction to TP440

TP440 is a unique high-frequency thermoplastic laminate manufactured by Taizhou Wangling Insulation Material Factory. The dielectric layer is composed of ceramic fillers and polyphenylene oxide (PPO) resin, without any fiberglass cloth reinforcement. This innovative material is produced through a specialized manufacturing process that enables precise dielectric constant adjustment by varying the ceramic-to-PPO resin ratio.

 

Unlike ceramic substrates or fiberglass-reinforced PTFE materials, TP440 offers an exceptional combination of high electrical performance, excellent mechanical machinability, and cost-effective processing. It is available in three configurations:

 

Variant	Description
TP	Unclad (no copper) smooth-surface material
TP-1	Single-sided copper-clad
TP-2	Double-sided copper-clad

 

TP440 specifically features a dielectric constant of 4.4 ± 0.09 at 10 GHz, making it an ideal choice for applications requiring moderate dielectric constant, ultra-low loss, and excellent low-temperature performance.

 

2. Key Technical Specifications (TP440)

Property	Test Condition	Unit	TP440 Value
Dielectric Constant @ 10 GHz	10 GHz	—	4.4 ± 0.09
Dielectric Constant Tolerance	—	—	±2%
Dissipation Factor @ 10 GHz	10 GHz	—	0.001
Thermal Coefficient of Dk	-55°C to +150°C	ppm/°C	-50
Peel Strength (1 oz, Normal)	1 oz, Normal State	N/mm	>0.6
Peel Strength (1 oz, After Damp Heat)	1 oz, After Damp Heat	N/mm	>0.4
Volume Resistivity	Normal State, 500V	MΩ·cm	>1×10⁹
Surface Resistivity	Normal State, 500V	MΩ	>1×10⁷
CTE – X axis	-55°C to +150°C	ppm/°C	60
CTE – Y axis	-55°C to +150°C	ppm/°C	60
CTE – Z axis	-55°C to +150°C	ppm/°C	70
Moisture Absorption	20±2°C, 24 hours	%	≤0.01
Density	Room Temperature	g/cm³	1.89
Thermal Conductivity	Z-direction	W/(m·K)	0.44
Long-Term Operating Temperature	—	°C	-100 to +150
Material Composition	—	—	PPO + Ceramic + ED Copper Foil

 

 

3. Features & Benefits

TP440 delivers a unique combination of advantages for high-frequency and specialized applications:

 

 

Feature	Description
Wide Dk Range (3–25)	Customizable dielectric constants available; common values include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, 20
Ultra-Low Dissipation Factor	0.0010 @ 10 GHz – excellent signal integrity
No Glass Fiber Reinforcement	Eliminates glass-fiber effect; minimizes anisotropy
Wide Operating Temperature	-100°C to +150°C – exceptional low-temperature performance
Radiation Resistance & Low Outgassing	Suitable for space and aerospace applications
Excellent Machinability	Can be drilled, turned, ground, sheared, etched – superior to ceramic substrates
Thickness Options	Minimum 0.5 mm; various thicknesses available and customizable
ED Copper Foil	Standard copper foil thicknesses: 0.018 mm and 0.035 mm

 

 

Superior Electrical Performance: The absence of fiberglass cloth eliminates anisotropic effects, providing consistent electrical performance across all directions. The ultra-low dissipation factor (0.0010 @ 10 GHz) ensures minimal signal loss.

 

Exceptional Low-Temperature Performance: With a long-term operating temperature down to -100°C, TP440 is ideally suited for aerospace, missile-borne, and cryogenic applications where other materials may fail.

 

Versatile Dielectric Constants: The dielectric constant can be selected from 3 to 25 according to circuit requirements, offering unmatched design flexibility.

 

Superior Machinability: Unlike ceramic substrates, TP440 can be easily machined using standard methods (drilling, turning, grinding, shearing, etching), significantly reducing fabrication costs and lead times.

 

Reliable Copper Adhesion: The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum-deposited coatings, ensuring long-term reliability.

 

Low Moisture Absorption (≤0.01%): Exceptional stability in humid environments – among the lowest in the industry.

 

Radiation Resistance & Low Outgassing: Suitable for spaceborne and defense applications.

 

Cost-Effective: High yield rates and significantly lower processing costs compared to ceramic substrates.

 

 

Important Processing Considerations

TP440 is a thermoplastic material with specific processing requirements:

Consideration	Details
Maximum Temperature	Not suitable for 260°C thermal shock testing; cannot undergo wave soldering
Recommended Soldering	Manual soldering with constant-temperature soldering iron
Reflow Soldering	Not generally recommended; if attempted, maximum temperature should not exceed 200°C
Multilayer Processing	Generally not recommended; if required, use low-temperature bonding sheets and thoroughly evaluate feasibility
High-Temperature Effects	Above 180°C, material may deform, copper foil may peel, and electrical performance may change significantly

 

 

4. Custom 2-Layer PCB Solution on TP440

Leveraging the unique properties of TP440, we offer the following precision-engineered 2-layer rigid PCB solution. This design is ideal for aerospace, missile-borne, GPS antenna, and other high-reliability applications requiring exceptional low-temperature performance and excellent machinability.

 

 

PCB Construction Details

Parameter	Specification
Base Material	Wangling TP440 (ED Copper)
Number of Layers	2
Finished Board Size	45.63 mm × 97.01 mm (±0.15 mm)
Finished Board Thickness	1.6 mm
Minimum Trace / Space	5 / 8 mils
Minimum Hole Size	0.3 mm (through-hole only; no blind vias)
Outer Layer Copper Weight	1 oz (35 μm)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold (ENIG)
Top Silkscreen	Black
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% prior to shipment
Accepted Quality Standard	IPC-Class-2
Artwork Format	Gerber RS-274-X
Global Availability	Worldwide shipping

 

 

Design & Manufacturing Highlights

 

Optimized Thickness: The 1.5 mm dielectric core provides excellent mechanical rigidity and dimensional stability, ideal for applications requiring robust structural support.

 

Moderate Dk Design: With a Dk of 4.4 ± 0.09, this PCB provides a balanced solution for a wide range of RF and microwave circuits requiring moderate dielectric constant and low loss.

 

Ultra-Low Loss Performance: The dissipation factor of 0.0010 at 10 GHz ensures minimal insertion loss and excellent signal integrity.

 

Fine-Feature Capability: Supports 5/8 mil trace/space and 0.3 mm micro-vias, enabling dense high-frequency circuit layouts.

 

No Solder Mask: Bare copper surface with immersion gold finish provides optimal signal integrity for high-frequency designs, minimizing parasitic effects.

 

Black Silkscreen on Top: Clear component identification for assembly and inspection.

 

Immersion Gold Surface Finish: Provides a flat, oxidation-resistant, and highly solderable surface with excellent wire-bonding capability and reliability.

 

Excellent PTH Reliability: With 20 μm via plating, the PCB offers reliable plated-through-hole integrity.

 

Exceptional Low-Temperature Performance: TP440's operating temperature range extends down to -100°C, making this PCB ideal for extreme cold environments.

 

Superior Machinability: The board can be easily machined using standard methods, ensuring precise fabrication and cost-effective production.

 

Strict Quality Control: Every board undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, guaranteeing consistent quality and performance.

 

 

Critical Processing Guidelines

Due to the thermoplastic nature of TP440, please observe the following guidelines for assembly and use:

 

Soldering: Manual soldering with a constant-temperature iron is recommended. Do not use wave soldering.

 

Reflow Soldering: Not generally recommended. If required, maximum temperature must not exceed 200°C.

 

Thermal Testing: Not suitable for 260°C thermal shock testing.

 

Operating Temperature: Long-term use range is -100°C to +150°C. Exceeding 180°C may cause deformation, copper peel, or electrical performance changes.

 

Multilayer Processing: Generally not recommended; consult with our engineering team for specific requirements.

 

 

5. Typical Applications

GPS Antennas

Missile-Borne Electronics

Fuze Systems

Miniaturized Antennas

Beidou Navigation Systems

Aerospace Equipment

Radar Systems

High-Frequency Test Fixtures

 

 

6. Conclusion

As a specialized supplier of custom high-frequency circuit boards, we combine the unique properties of Wangling TP440 – a high-performance thermoplastic PPO/ceramic laminate with exceptional low-temperature performance, excellent machinability, and ultra-low loss – with our precision manufacturing capabilities to deliver world-class PCB solutions. Our 2-layer offering fully leverages TP440's moderate dielectric constant (4.4), ultra-low loss (0.0010 @ 10 GHz), exceptional low-temperature range (-100°C to +150°C), and superior machinability, ensuring your most demanding aerospace, defense, and GPS applications achieve optimal performance and reliability.

 

 

Whether you are developing GPS antennas, missile-borne electronics, fuze systems, or miniaturized antennas, our engineering team is ready to support your project.

 

For technical consultations, samples, or volume orders, please contact us today. We look forward to being your trusted partner in high-frequency innovation.