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High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

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High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

Name: High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB
Brand: Bicheng Technologies Limited
SKU: BIC-507-V0.62
Price: 2.99 USD
Availability: InStock
Rating: 4.8 (195 reviews)

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-507-V0.62

Number Of Layers:

Glass Epoxy:

IT-180ATC

Final Foil:

1.0 Oz

Final Height Of PCB:

1.6 Mm ±10%

Surface Finish:

Immersion Gold

Solder Mask Color:

Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB 0

PCB Parameters

Item	Description	Requirement	Actual	Result
1. Laminate	Material Type	FR-4 IT-180ATC	FR-4 IT-180ATC	ACC
	Tg	170℃	170℃	ACC
	Supplier	ITEQ	ITEQ	ACC
	Thickness	1.6±10% mm	1.63-1.68mm	ACC
2.Plating thickness	Hole Wall	≥25µm	26.51µm	ACC
	Outer copper	35µm	41.09µm	ACC
	Inner Copper
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D	TAIYO/ PSR-2000GT600D	ACC
	Color	Green	Green	ACC
	Rigidity (Pencil Test)	≥4H or above	5H	ACC
	S/M Thickness	≥10 µm	20.11µm	ACC
	Location	Both Sides	Both Sides	ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300	IJR-4000 MW300	ACC
	Color	White	White	ACC
	Location	C/S	C/S	ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES	YES	ACC
	Date Code	WWYY	2121	ACC
	Mark Location	Solder Side	Solder Side	ACC
7. Surface Finish	Method	Immersion Gold	Immersion Gold	ACC
	Tin Thickness
	Nickel Thickness	3-6µm	4.06µm	ACC
	Gold Thickness	0.05µm	0.056µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU	OK	ACC
8. Normativeness	REACH	Directive 1907 /2006	OK	ACC
9.Annular Ring	Min. Line Width (mil)	5mil	4.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	5mil	5.2mil	ACC
10.V-groove	Angle	30º	30º	ACC
10.V-groove	Residual thickness	0.4±0.1mm	0.43mm	ACC
11. Beveling	Angle
11. Beveling	Height
12. Function	Electrical Test	100% PASS	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	≦0.7%	0.21%	ACC
14. Reliability Test	Tape Test	No Peeling	OK	ACC
	Solvent Test	No Peeling	OK	ACC
	Solderability Test	265 ±5℃	OK	ACC
	Thermal Stress Test	288 ±5℃	OK	ACC
	Ionic Contamination Test	≦ 1.56 µg/c㎡	0.56µg/c㎡	ACC

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code	PTH	Required	Actual value				Result
1	Y	0.400	0.400	0.425	0.425	0.400	ACC
2	Y	0.450	0.450	0.500	0.475	0.450	ACC
3	Y	0.600	0.600	0.650	0.625	0.600	ACC
4	Y	0.725	0.750	0.775	0.775	0.750	ACC
5	Y	0.850	0.850	0.825	0.850	0.825	ACC

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