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High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-505-V0.45
Number Of Layers:
6
Glass Epoxy:
S1000-2M
Final Foil:
1.5 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
HASL LF
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.

 

Applications

Computers

Communications

Automotive electronics etc.

 

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control 0

 

PCB Parameters

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 S1000-2M FR-4 S1000-2M ACC
Tg 170 170 ACC
Supplier SHENGYI SHENGYI ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness Hole Wall 25µm 30.17µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper 30µm 33.69µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) 4H or above 5H ACC
S/M Thickness 10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method HASL Lead Free HASL Lead Free ACC
Tin Thickness 3-6µm 4.06µm ACC
Nickel Thickness      
Gold Thickness      
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 6mil 5.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove Angle      
Residual thickness      
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5 OK ACC
Thermal Stress Test 288 ±5 OK ACC
Ionic Contamination Test 1.56 µg/c 0.56µg/c ACC


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code PTH Required Actual value Result
1 Y 0.375 0.375 0.400 0.400 0.375 ACC
2 Y 0.500 0.500 0.550 0.525 0.525 ACC
3 Y 0.7*2.4 0.7*2.4 0.7*2.41 0.69*2.4 0.7*2.4 ACC
4 Y 0.625 0.625 0.600 0.625 0.600 ACC
5 Y 0.725 0.725 0.725 0.750 0.725 ACC
6 Y 0.900 0.925 0.900 0.900 0.900 ACC
7 Y 1.000 1.000 0.950 0.975 1.000 ACC
8 N 1.050 1.050 1.050 1.075 1.050 ACC
9 Y 1.300 1.300 1.300 1.325 1.325 ACC
10 Y 1.350 1.350 1.325 1.350 1.325 ACC
11 Y 1.575 1.575 1.600 1.600 1.575 ACC
12 Y 1.650 1.650 1.700 1.675 1.675 ACC
13 Y 1.700 1.700 1.750 1.725 1.725 ACC
14 Y 3.250 3.250 3.250 3.275 3.250 ACC
15 Y 3.450 3.450 3.400 3.425 3.450 ACC
16 Y 0.7*2.6 0.7*259 0.7*2.61 0.69*2.6 0.7*2.59 ACC

 


 

Impedance Test Report

Sample NO. Layer Line Width(mil)±10% Line Space (mil)±10% Impedance Type Required Value (ohm) Tolerance Actual Value Result
Single End Differential
1 L3 6.000 7.000   V 90.00 ±10% 93.59 ACC
L3 6.000 10.000   V 100.00 ±10% 102.33 ACC
L4 7.000 7.000   V 90.00 ±10% 88.99 ACC
L4 6.000 7.000   V 90.00 ±10% 90.76 ACC
                 
 
High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control 1
products
PRODUCTS DETAILS
High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-505-V0.45
Number Of Layers:
6
Glass Epoxy:
S1000-2M
Final Foil:
1.5 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
HASL LF
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.

 

Applications

Computers

Communications

Automotive electronics etc.

 

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control 0

 

PCB Parameters

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 S1000-2M FR-4 S1000-2M ACC
Tg 170 170 ACC
Supplier SHENGYI SHENGYI ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness Hole Wall 25µm 30.17µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper 30µm 33.69µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) 4H or above 5H ACC
S/M Thickness 10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method HASL Lead Free HASL Lead Free ACC
Tin Thickness 3-6µm 4.06µm ACC
Nickel Thickness      
Gold Thickness      
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 6mil 5.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove Angle      
Residual thickness      
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5 OK ACC
Thermal Stress Test 288 ±5 OK ACC
Ionic Contamination Test 1.56 µg/c 0.56µg/c ACC


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code PTH Required Actual value Result
1 Y 0.375 0.375 0.400 0.400 0.375 ACC
2 Y 0.500 0.500 0.550 0.525 0.525 ACC
3 Y 0.7*2.4 0.7*2.4 0.7*2.41 0.69*2.4 0.7*2.4 ACC
4 Y 0.625 0.625 0.600 0.625 0.600 ACC
5 Y 0.725 0.725 0.725 0.750 0.725 ACC
6 Y 0.900 0.925 0.900 0.900 0.900 ACC
7 Y 1.000 1.000 0.950 0.975 1.000 ACC
8 N 1.050 1.050 1.050 1.075 1.050 ACC
9 Y 1.300 1.300 1.300 1.325 1.325 ACC
10 Y 1.350 1.350 1.325 1.350 1.325 ACC
11 Y 1.575 1.575 1.600 1.600 1.575 ACC
12 Y 1.650 1.650 1.700 1.675 1.675 ACC
13 Y 1.700 1.700 1.750 1.725 1.725 ACC
14 Y 3.250 3.250 3.250 3.275 3.250 ACC
15 Y 3.450 3.450 3.400 3.425 3.450 ACC
16 Y 0.7*2.6 0.7*259 0.7*2.61 0.69*2.6 0.7*2.59 ACC

 


 

Impedance Test Report

Sample NO. Layer Line Width(mil)±10% Line Space (mil)±10% Impedance Type Required Value (ohm) Tolerance Actual Value Result
Single End Differential
1 L3 6.000 7.000   V 90.00 ±10% 93.59 ACC
L3 6.000 10.000   V 100.00 ±10% 102.33 ACC
L4 7.000 7.000   V 90.00 ±10% 88.99 ACC
L4 6.000 7.000   V 90.00 ±10% 90.76 ACC
                 
 
High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control 1
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