Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

Home ProductsMultilayer PCB Board

Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission

Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission

  • Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission
Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-106-V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 12 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Glass Epoxy: RO3003 Final Height Of PCB: 1.2 Mm ±0.1mm
Final Foil External: 1oz Surface Finish: Immersion Gold (14.6% ) 0.05µm Over 3µm Nickel
Solder Mask Color: Green Colour Of Component Legend: White
TEST: 100% Electrical Test Prior Shipment Number Of Layers: 6

Rogers RO3003 RF PCB bonding with FastRise-28 Prepreg for High Speed Signal Transmission

(PCB's are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers



Data Sheet of RO3003 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.06
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC
Surface Resistivity 107   COND A IPC
Tensile Modulus 930
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


Taconic company's FastRise-28 semi-solidified sheet is specially designed for high-speed digital signal transmission applications and millimeter-wave RF multi-layer printed board manufacturing. It is matched with other microwave substrate materials of TACONIC company to manufacture multilayer microwave printed circuit boards.


FastRise-28 semi-solidified sheet can meet the design requirements of stripline structure with low dielectric loss. The thermosetting properties of the adhesive material make it meet the design requirements of multiple laminated manufacturing. In addition, a large number of ceramic powder fillers are selected in the composition of the semi-solidified sheet, which makes the dimensional stability of the corresponding products very good. Because of its high performance thermosetting resin, it shows good bonding effect on copper foil and some PTFE materials.


The main properties of this adhesive sheet material are shown in the table below.


FastRise-28 (FR-28) Typical Value
Property Value Direction Units Condition Test Method
Dielectric Constant,ε 2.78 - - 10 GHz IPC-TM-650
Dissipation Factor,tanδ 0.0015 - - 10 GHz IPC-TM-650
Water Absorption 0.08   %   IPC TM-650
Dielectric breakdown voltage 49   KV   IPC TM-650 2.5.6
Dielectric strength 1090   V/mil   ASTM D 149
Volume Resistivity 8.00 x 108   MΩ/cm   IPC-TM-650
Surface Resistivity 3.48 x 108     IPC-TM-650
Tg 188     ASTM E 1640
Tensil strength 1690 X psi   ASTM D 882
1480 Y psi
Tensil modulus 304 X psi   ASTM D 882
295 Y psi
Density 1.82   gm/cm³   ASTM D-792 Method A
Td 709   °F   IPC TM-650
Peel Strength 7   lbs/in   IPC-TM-650 2.4.8
Thermal Conductivity 0.25   W/mk   ASTM F433
Coefficient of Thermal Expansion 59
ppm/   IPC-TM-650 2.4.41
Hardness 68   Shore D   ASTM D 2240


More FastRise Prepregs

fastRise Prepreg
Product Carrier film (mil) Film Elognation (%) Pressed Thickness (mil) Pressed Thickness (mil) Pressed Thickness (mil) Nominal DK (Min. / Max.) (10 GHz) Typical Flow (%)
FR-26-0025-60 1 200-300 2.7 1.3 1 2.58 17
FR-27-0030-25 2.3 30-60 3.5 2.1 Not recommended 2.74 (2.71 / 2.78) 4
FR-27-0035-66 1 200-300 3.7 2.5 2.1 2.7 36
FR-27-0040-25 3 30-60 4.9 3.7 Not recommended 2.74 4
FR-28-0040-50 1 200-300 4.9 3.7 3.5 2.81 (2.80 / 2.82) 23
FR-27-0042-75 2.3 30-60 5.16 3.96 3.5 2.73 35
FR-27-0045-35 3 30-60 5.8 4.6 4.2 2.75 (2.73 / 2.77) 13
FR-27-0050-40 3 30-60 6.1 5.5 4.9 2.76 (2.71 / 2.80) 23
        0.5 oz Cu. 50% removal 1 oz. Cu. 50% removal    



FastRise is a non-reinforced prepreg that is manufactured between release liners so that individual plies of FastRise do not stick together. The adhesive layer on the surface of the PTFE/cereamic film can be quite tacky especially for freshly manufactured material. It is recommended to refrigerate FastRise prior to lamination. Continuous refrigeration is always a good practice for storing prepregs as this will extend the shelf lile. However, because FastRise can be quite tacky, FastRise should be refrigerated as close to 4℃ as possible. FastRise will stiffen up and will separate from the release liners a lot easier.



Various laminate cores are used in conjunction with FastRise prepreg to produce multilayer boards for the RF/digital/ATE multilayer markets. FastRise when used in a symmetrical board design, will result in optimum electrical and mechanical performance. Because of the thermoset properties of the bonding agent, multiple bonding cycles can be achieved without worry of delamination. In addition, the recommended press temperature of 215.5℃ is within reach of most boards houses.


Here’s a type of RF PCB built on Rogers RO3003 core bonding by FastRise-28. It is 6-layer stack-up with 1oz copper on each layer. Finished board will be 1.2mm thick, pads are immersion gold plated. There’s 2+N+2 steps blind via from layer 1 to layer 4. See the stack-up as follows.


Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission 0


Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Other Products
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Mobile Site Privacy PolicyChina Multilayer PCB Board Supplier. Copyright © 2016 - 2024 All Rights Reserved. Developed by ECER