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4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

Minimum Order Quantity : 1 Price : USD 2.99-9.99 PER PIECE
Packaging Details : Vacuum Delivery Time : 10 working days
Payment Terms : T/T, Western Union Supply Ability : 45000 pieces per month
Place of Origin: China Brand Name: Bicheng Technologies Limited
Certification: UL Model Number: BIC-0069-V1.19

Detail Information

Number Of Layers: 4 Glass Epoxy: RO4003C
Final Foil: 1.0 Final Height Of PCB: 2.1 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: N/A
Colour Of Component Legend: N/A Test: 100% Electrical Test Prior Shipment

Product Description

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
 
Hello everyone,
Good day.
 
Today we talk about a type of 4 layer high frequency PCB. This PCB is built on 2 sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the application of ultrahigh frequency coupler. Following is the stack-up.
 
4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler
In general, multilayer Rogers high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).

 

RO4003C Thickness

8mil 0.203mm
12mil 0.305mm
16mil 0.406mm
20mil 0.508mm
32mil 0.813mm
60mil 1.524mm

So it’s very interesting that stack-up of 4 layers can be done in many different ways.
 
 
The specifications of the board are as follows:
Base material: RO4003C 32mil + RO4450F 12mil PP
Layer count: 4 layers
Type: Castellation holes (half holes) on edge
Format: 113mm x 80mm = 1 type = 4 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: no / no
Final PCB height: 2.1 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
 


You enjoy the features and benefits
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) AOI inspection;
3) Meeting your PCB needs from prototype to mass production;
4) 30000 square meter month capability;
5) 8000 types of PCB's per month;
6) More than 16 years of PCB experience;
 


Application
GPS antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar data acquisition converter, Spread spectrum, Attenuator
 


Appendix: Properties of RO4003C

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

 

Thank you for your reading and you’re welcome to contact us for your PCB enquires.
 
4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

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