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4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

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4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

Name: 4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler
Brand: Bicheng Technologies Limited
SKU: BIC-0069-V1.19
Price: 2.99 USD
Availability: InStock
Rating: 4.5 (105 reviews)

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-0069-V1.19

Number Of Layers:

Glass Epoxy:

RO4003C

Final Foil:

1.0

Final Height Of PCB:

2.1 Mm ±10%

Surface Finish:

Immersion Gold

Solder Mask Color:

N/A

Colour Of Component Legend:

N/A

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Good day.

Today we talk about a type of 4 layer high frequency PCB. This PCB is built on 2 sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the application of ultrahigh frequency coupler. Following is the stack-up.

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler 0
In general, multilayer Rogers high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).

RO4003C:
8mil	0.203mm
12mil	0.305mm
16mil	0.406mm
20mil	0.508mm
32mil	0.813mm
60mil	1.524mm

So it’s very interesting that stack-up of 4 layers can be done in many different ways.

The specifications of the board are as follows:
Base material: RO4003C 32mil + RO4450F 12mil PP
Layer count: 4 layers
Type: Castellation holes (half holes) on edge
Format: 113mm x 80mm = 1 type = 4 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: no / no
Final PCB height: 2.1 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months

You enjoy the features and benefits
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) AOI inspection;
3) Meeting your PCB needs from prototype to mass production;
4) 30000 square meter month capability;
5) 8000 types of PCB's per month;
6) More than 16 years of PCB experience;

Application
GPS antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar data acquisition converter, Spread spectrum, Attenuator

Appendix: Properties of RO4003C

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 1010		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 109		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	425		℃ TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.79		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

Thank you for your reading and you’re welcome to contact us for your PCB enquires.

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler 1

Products

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-0069-V1.19

Number Of Layers:

Glass Epoxy:

RO4003C

Final Foil:

1.0

Final Height Of PCB:

2.1 Mm ±10%

Surface Finish:

Immersion Gold

Solder Mask Color:

N/A

Colour Of Component Legend:

N/A

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

RO4003C:
8mil	0.203mm
12mil	0.305mm
16mil	0.406mm
20mil	0.508mm
32mil	0.813mm
60mil	1.524mm

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 1010		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 109		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	425		℃ TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.79		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

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4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

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PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

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High Frequency PCB

F4B SERIES PCBS