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5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
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5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
  • name
  • name

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold

MOQ: 1
Price: USD20~30
Standard Packaging: Vacuum
Delivery Period: 4-5 working days
Payment Method: T/T,Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0087-V5.4
Number Of Layers:
5
Glass Epoxy:
RO4003C 20mil, Tg 288℃
Final Height Of PCB:
2.1mm ±0.16
Final Foil External:
1.0 Oz
Surface Finish:
Electroless Nickel Over Immersion Gold (ENIG)( 2 µ" Over 100 µ" Nickel)
Solder Mask Color:
No Solder Mask Required
Colour Of Component Legend:
No Silkscreen Required
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD20~30
Packaging Details:
Vacuum
Delivery Time:
4-5 working days
Payment Terms:
T/T,Paypal
Supply Ability:
45000 pieces per month
Product Description

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we're going to talk about a type of 5-layer high frequency PCB made on Rogers RO4003C.

5 layer PCB is fabricated on 3 cores of RO4003C and etched 1 layer copper off to achieve 5 layers.

 

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 0

 

Viewing from the stack up, we can see 3 sheets of 20 mil cores achieve the basic layer structure, 2 layers of dielectric material (prepreg) bond the 3 cores which result in 5-layer board. Copper weight in inner-layer is half ounce, outer-layer 1 ounce. Final height of the board is 2.1mm thick.

 

Following is the picture of micro-section, which can more intuitively reflect the structure of the board. No solder mask is applied on the surface, pads are immersion gold plated.

 

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 1

 

Actually the stack up of multilayer PCBs can be done in many different ways according to the different requirements or applications for controlled impedances, signal transmission etc. There’re many types of cores for our designer to choose in RO4003C family, such as 8mil, 12mil, 16mil, 20mil, 32mil and 60mil etc.

 

The core has fixed thickness, it is very important to the electrical length of RF lines on the circuit board.

 

We have a variety of high frequency materials for customers to choose from, the main are Rogers 4000 series, 3000 series, 5000 series and 6000 series, Taconic TLX series, TLY series etc. and Chinese F4B series etc.

 

If you're interested in, please feel free to contact us.

Thank you for your reading.

 

Our PCB Capability 2022

Parameter Value
　Layer Counts　 1-32
　Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--350µm (0.5oz - 10oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 2

 

 

 
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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
  • name
  • name
5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
MOQ: 1
Price: USD20~30
Standard Packaging: Vacuum
Delivery Period: 4-5 working days
Payment Method: T/T,Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0087-V5.4
Number Of Layers:
5
Glass Epoxy:
RO4003C 20mil, Tg 288℃
Final Height Of PCB:
2.1mm ±0.16
Final Foil External:
1.0 Oz
Surface Finish:
Electroless Nickel Over Immersion Gold (ENIG)( 2 µ" Over 100 µ" Nickel)
Solder Mask Color:
No Solder Mask Required
Colour Of Component Legend:
No Silkscreen Required
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD20~30
Packaging Details:
Vacuum
Delivery Time:
4-5 working days
Payment Terms:
T/T,Paypal
Supply Ability:
45000 pieces per month
Product Description

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we're going to talk about a type of 5-layer high frequency PCB made on Rogers RO4003C.

5 layer PCB is fabricated on 3 cores of RO4003C and etched 1 layer copper off to achieve 5 layers.

 

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 0

 

Viewing from the stack up, we can see 3 sheets of 20 mil cores achieve the basic layer structure, 2 layers of dielectric material (prepreg) bond the 3 cores which result in 5-layer board. Copper weight in inner-layer is half ounce, outer-layer 1 ounce. Final height of the board is 2.1mm thick.

 

Following is the picture of micro-section, which can more intuitively reflect the structure of the board. No solder mask is applied on the surface, pads are immersion gold plated.

 

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 1

 

Actually the stack up of multilayer PCBs can be done in many different ways according to the different requirements or applications for controlled impedances, signal transmission etc. There’re many types of cores for our designer to choose in RO4003C family, such as 8mil, 12mil, 16mil, 20mil, 32mil and 60mil etc.

 

The core has fixed thickness, it is very important to the electrical length of RF lines on the circuit board.

 

We have a variety of high frequency materials for customers to choose from, the main are Rogers 4000 series, 3000 series, 5000 series and 6000 series, Taconic TLX series, TLY series etc. and Chinese F4B series etc.

 

If you're interested in, please feel free to contact us.

Thank you for your reading.

 

Our PCB Capability 2022

Parameter Value
　Layer Counts　 1-32
　Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--350µm (0.5oz - 10oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 2

 

 

 
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6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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