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1.1-Meter Extra-Long Rogers RO4003C PCB | 32mil, 1oz Copper, Immersion Gold, No Silkscreen, RF Circuit Board | 1100mm × 350mm

Brand Name: Rogers Model Number: RO4003C

Product Description

 

This article presents a custom extra-long Rogers RO4003C high-frequency PCB measuring 1100mm × 350mm—a true long-format board designed for applications that demand continuous high-frequency performance over an extended substrate area. Built on a 0.813mm (32mil) RO4003C laminate with 1oz finished copper, this double-sided board features an immersion gold finish (2u" gold thickness) and is supplied with no solder mask and no silkscreen, delivering an unobstructed, high-integrity copper surface for demanding RF and microwave designs.

 

RO4003C materials are proprietary woven-glass-reinforced hydrocarbon/ceramic composites that combine the electrical performance of PTFE/woven-glass materials with the manufacturability of epoxy/glass laminates. Available in various configurations, RO4003C laminates utilize 1080 or 1674 glass fabric styles, with all versions meeting the same electrical performance specifications.

 

RO4003C laminates offer tight control over the dielectric constant (Dk) and low signal loss. They can be processed using the same methods as standard epoxy/glass laminates—but at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based microwave materials, no special through-hole treatments or unique handling procedures are required.

 

1.1-Meter Extra-Long Rogers RO4003C PCB | 32mil, 1oz Copper, Immersion Gold, No Silkscreen, RF Circuit Board | 1100mm × 350mm

 

2. Key Specifications

Parameter Specification
Base Material Rogers RO4003C
Number of Layers 2 (Double-Sided)
Board Dimensions 1100 mm × 350 mm (1 piece)
Substrate Thickness 0.813 mm (32 mil)
Finished Copper Weight 1 oz (35 μm)
Surface Finish Immersion Gold (2u")
Solder Mask None
Silkscreen None
Electrical Testing 100% prior to shipment
Accepted Quality Standard IPC-Class-2
Artwork Format Gerber RS-274-X
Global Availability Worldwide shipping

 

 

Features

  1. Dk of 3.38 ± 0.05 at 10 GHz
  2. Dissipation factor of 0.0027 at 10 GHz
  3. Low Z-axis coefficient of thermal expansion at 46 ppm/°C
  4. Tight control on dielectric constant (Dk)
  5. Low loss
  6. Processes like FR-4 at lower fabrication cost

 

 

Benefits

  1. Ideal for multi-layer board (MLB) constructions
  2. Processes like FR-4 at lower fabrication cost
  3. Designed for performance-sensitive, high-volume applications
  4. Competitively priced
  5. No special through-hole treatments required (unlike PTFE-based materials)

 

 

Typical Applications

  1. Cellular infrastructure base station antennas
  2. WiMAX antenna networks
  3. RF/microwave circuits and matching networks
  4. Controlled impedance transmission lines
  5. Broadband applications
  6. Long-strip antenna substrates
  7. Oversized RF/microwave circuit boards

 

 

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

 

Available Configurations

Parameter RO4003C Options
Standard Thicknesses 0.008" (0.203mm) ± 0.001"; 0.012" (0.305mm) ± 0.001"; 0.016" (0.406mm) ± 0.0015"; 0.020" (0.508mm) ± 0.0015"; 0.032" (0.813mm) ± 0.002"; 0.060" (1.524mm) ± 0.004"
Standard Panel Sizes 24" × 18" (610 × 457 mm); 24" × 21" (610 × 533 mm); 24" × 36" (610 × 915 mm); 48" × 36" (1219 × 915 mm)
Standard Claddings Electrodeposited Copper Foil: ½ oz. (18 μm) HH/HH; 1 oz. (35 μm) H1/H1

 

1.1-Meter Extra-Long Rogers RO4003C PCB | 32mil, 1oz Copper, Immersion Gold, No Silkscreen, RF Circuit Board | 1100mm × 350mm

 

Low Outgassing Characteristics (Spacecraft Applications)

Rogers laminates, including the RO4000 series, have been tested per NASA's outgassing test procedure SP-R-0022A. The test consists of vacuum heating specimens in a copper enclosure at 125°C for 24 hours with a chrome-plated collector maintained at 25°C. The Total Mass Loss (TML) , Collected Volatile Condensable Materials (CVCM) , and Water Vapor Recovered (WVR) are expressed as a percentage of the original specimen mass.

 

In general, materials exhibiting a TML of less than 1.0% and CVCM less than 0.1% are considered "low outgassing" and suitable for space applications.

Product Total Mass Loss (TML %) Collected Volatiles (CVCM %) Water Vapor Recovered (WVR %)
RO4003C™ 0.06 0 0.02

 

 

These results confirm that RO4003C laminates meet the low-outgassing requirements for spacecraft applications, making them suitable for spaceborne RF/microwave electronics.

 

 

Extra-Long Board Capability

At 1100mm × 350mm, this board is one of the longest RO4003C PCBs available. The extended length makes it ideal for long-strip antenna substrates, phased array antenna elements, and other applications requiring a continuous high-frequency substrate over a large area. Our manufacturing process ensures excellent dimensional stability and uniform electrical performance across the entire board length.

 

High-Frequency Performance

RO4003C's Dk of 3.38 ± 0.05 and Df of 0.0027 at 10 GHz provide exceptional high-frequency performance for RF/microwave circuits, matching networks, and controlled impedance transmission lines. The material's low Z-axis CTE (46 ppm/°C) ensures reliable plated-through-hole quality even in severe thermal shock applications.

 

Cost-Effective FR-4 Processing

Unlike PTFE-based microwave materials, RO4003C processes like standard FR-4—no special through-hole treatments or handling procedures are required. This significantly reduces fabrication costs while maintaining high-frequency performance, making it ideal for performance-sensitive, high-volume applications.

 

Immersion Gold (2u") Surface Finish

The immersion gold (2u") surface finish provides a flat, oxidation-resistant, and highly solderable surface with excellent wire-bonding capability. The 2u" gold thickness ensures robust protection against corrosion and wear, making it suitable for long-term reliability in demanding environments.

 

No Solder Mask / No Silkscreen

The bare copper surface with immersion gold finish provides optimal signal integrity for high-frequency designs. No solder mask or silkscreen minimizes parasitic effects and ensures consistent RF performance across the entire board.

 

 

Conclusion

As a specialized supplier of custom high-frequency circuit boards, we combine the proven performance of Rogers RO4003C (Dk 3.38, Df 0.0027, low Z-axis CTE, FR-4 processability, and low outgassing) with our precision manufacturing capabilities to deliver world-class oversized PCB solutions. The 1100mm × 350mm long board offering fully leverages RO4003C's stable dielectric properties, low loss, and dimensional stability, ensuring your most demanding RF, microwave, and antenna applications achieve optimal performance over an extended form factor.

 

Whether you are developing long-strip antenna substrates, phased array antenna elements, or other large-area high-frequency circuits, our engineering team is ready to support your project. For technical consultations, samples, or volume orders, please contact us today. We look forward to being your trusted partner in high-frequency innovation.

 

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