Rogers RO4450F Bondply be used for 8-Layer copper weight Mixed-Material PCB that 4mil RO4350B + TG170 FR-4 + 8mil RO4003C

Product Description

Building a multilayer board that combines the high-frequency performance of Rogers laminates with the cost-efficiency of FR-4 requires more than just stacking materials—it requires a bonding layer that can bridge two different material systems without compromising electrical or mechanical integrity. The RO4450F bondply from Rogers Corporation is engineered for exactly this challenge.

The RO4400™ bondply family is comprised of prepreg grades based on the RO4000 series core materials, and are compatible in multilayer constructions with RO4000 laminates. A high postcure Tg makes RO4400 series bondply an excellent choice for multilayers requiring sequential laminations, as fully cured RO4400 bondplies are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements permit RO4400 bondply and low flow FR-4 bondply to be combined into non-homogeneous multilayer constructions using a single bond cycle.

RO4450F bondply has demonstrated improvement in lateral flow capability and is becoming the first choice for new designs or as a replacement in designs that have difficult fill requirements. With a dielectric constant of 3.52 ± 0.05 and a low Z-axis CTE of 50 ppm/°C, RO4450F provides reliable bonding while maintaining the electrical performance expected of a high-frequency material.

Key Properties at a Glance (RO4450F):

Applications

RO4450F bondply is designed for multilayer constructions combining RO4000 series laminates with FR-4. Typical applications include:

1. Backhaul Radios – High-frequency signal layers with cost-effective digital layers
2. Communication Systems – Mixed-material stack-ups for base stations and small cells
3. Power Amplifiers – Thermal and electrical performance where needed
4. Small Cells/DAS – Compact, cost-sensitive RF designs

Custom PCB Manufacturing on RO4450F Bondply

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers RO4450F and other advanced materials. The following specification details a representative 8-layer mixed-material implementation:

PCB Construction Details:

Stack-up Configuration (Representative):

Material Advantages

Excellent Lateral Flow Capability:
RO4450F bondply has demonstrated improved lateral flow capability, making it the first choice for designs with difficult fill requirements. This is particularly important in mixed-material stack-ups where the bonding layer must flow around copper features of varying heights and densities without leaving voids or resin-starved areas.

High Postcure Tg for Sequential Lamination:
With a Tg greater than 280°C, fully cured RO4450F bondply is capable of handling multiple lamination cycles. This makes it an excellent choice for multilayers requiring sequential laminations, where the bonded layers must survive subsequent high-temperature processing without degradation.

FR-4 Compatible Bonding:
RO4450F is compatible with FR-4 bond temperatures, permitting RO4400 bondply and low flow FR-4 bondply to be combined into non-homogeneous multilayer constructions using a single bond cycle. This enables the cost-effective hybrid stack-ups demonstrated in the 8-layer build specified here.

Low Z-Axis CTE for Plated Through-Hole Reliability:
The Z-axis CTE of 50 ppm/°C provides reliable plated through-hole performance, even in severe thermal environments. This is essential for mixed-material boards where different CTE values between layers can create stress on via barrels.

CAF Resistant:
RO4450F is resistant to conductive anodic filament (CAF) formation, enhancing long-term reliability in humid environments and under voltage bias.

Lead-Free Process Compatible:
The material is compatible with lead-free solder processing, meeting current environmental and reliability requirements.

IPC-Class-3 Standard:
This build is manufactured to IPC-Class-3 standards—the highest grade of manufacturing reliability for high-reliability electronics. IPC-Class-3 is used for mission-critical applications where downtime is unacceptable, including aerospace, medical, and defense systems. Class 3 boards require a 20% increase in minimum plating thickness over Class 1/2 boards, no copper voids, and stricter annular ring requirements.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-3 quality standards, ensuring the highest level of reliability for mission-critical applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, mixed-material configurations combining RO4000 series laminates with FR-4, sequential lamination, or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.