20-Layer TU-872/SLK TG200 FR4 HDI PCB board with Impedance control | 3.0mm Thick | Nickel-Palladium-Gold Finish

20-Layer TU-872 SLK PCB | 3.0mm Thick | Nickel-Palladium-Gold Finish

Product Overview

We are pleased to present this newly customized 20-layer high-density interconnect (HDI) PCB built on TU-872 SLK high-performance modified epoxy FR-4 resin laminate. Engineered for high-speed, low-loss, and high-frequency multilayer circuit board applications, this material delivers excellent electrical properties with stable dielectric constant and low dissipation factor.

The board measures 215mm x 137mm and is supplied as 4 pieces per panel, shipped in a 2x2 configuration. Total finished board thickness is 3.0mm with dimensional tolerance of ±0.15mm. This is an HDI board incorporating laser optics features, resin-filled vias, and impedance matching structures. Minimum trace and space and minimum hole size are not specified in the base specification.

This design features green solder mask on both sides with white silkscreen lettering for clear component identification. The Nickel-Palladium-Gold (NiPdAu) surface finish provides excellent solderability, ultra-flat surface for fine-pitch components, superior corrosion resistance, and wire bondability. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-3 quality standards (higher than standard IPC-2). Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Material Advantages: TU-872 SLK

The TU-872 SLK laminate from Taiyo (based on a high-performance modified epoxy FR-4 resin) is reinforced with regular woven E-glass and designed specifically with low dielectric constant and low dissipation factor for high-speed, low-loss, and high-frequency multilayer circuit board applications.

Key material highlights:

• Low dielectric constant (<4.0) – stable and flat Dk/Df performance across frequency
• Low dissipation factor (<0.010) – excellent signal integrity for high-speed designs
• High Tg (>170°C by DSC, >340°C by TMA) – superior thermal reliability
• Excellent T260, T288, T300 performance – outstanding thermal stress resistance
• Improved Z-axis CTE (<3.0%) – reliable plated through-hole quality
• Anti-CAF capability – enhanced resistance to conductive anodic filament formation
• Excellent moisture resistance – stable performance in humid environments
• Lead-free process compatible – suitable for environmental protection standards
• FR-4 compatible processing – no specialized fabrication equipment required
• Superior dimensional stability, thickness uniformity, and flatness

Industry Approvals:

• IPC-4101E Type Designation: /29, /99, /101, /126
• IPC-4101E/126 Validation Services QPL Certified
• UL Designation - ANSI Grade: FR-4.0
• UL File Number: E189572
• Flammability Rating: 94V-0
• Maximum Operating Temperature: 130°C
• Performance and Processing Advantages:
• Compatible with modified FR-4 processes
• Excellent through-hole and soldering reliability
• Enhanced toughness through allyl network forming compound
• Superior chemical resistance and thermal stability

Typical Applications:

Radio frequency circuits

Backplanes, high-performance computing

Line cards, storage devices

Servers, telecom, base stations

Office routers

TU-872 SLK Material Properties

HDI Features:

Resin-filled vias – planarized via filling for enhanced reliability and layer stacking

Laser optics integration – precision optical alignment features incorporated into the design

Impedance matching – controlled impedance structures for signal integrity

Quality Standard: IPC-Class-3
This board is manufactured to IPC-Class-3 standards, representing the highest level of electronic product reliability for harsh environments, continuous operation, and mission-critical applications where downtime is unacceptable.

Surface Finish: Nickel-Palladium-Gold (NiPdAu)

The Nickel-Palladium-Gold (NiPdAu) finish offers distinct advantages over traditional ENIG for high-reliability and HDI applications:

Typical Applications

Thanks to its low Dk/Df, high Tg, and HDI capabilities, this PCB is ideally suited for:

High-performance computing and servers

Telecommunications and base station equipment

Radio frequency (RF) circuits

Backplanes and line cards

Storage devices and office routers

High-speed digital designs requiring impedance control

Key Benefits Summary

TU-872 SLK laminates are available in:

Thicknesses: 0.002" (0.05mm) to 0.062" (1.58mm) in sheet or panel form

Copper Foil Cladding: 1/3 oz to 5 oz for built-up and double sides

Prepregs: TU-87P SLK available in roll or panel form

Glass Styles: 106, 1080, 3313, 2116, and other prepreg grades available upon request

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012 and IPC-Class-3 requirements. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.