10-Layer Hybrid High-Frequency PCB RO4003C hydrocarbon ceramic laminates + 370HR FR-4 epoxy systems Immersion Gold Finish

10-Layer Hybrid High-Frequency PCB | RO4003C + 370HR | Immersion Gold Finish

Product Overview

We are pleased to present this newly customized 10-layer rigid PCB featuring a hybrid stackup that combines Rogers RO4003C high-frequency hydrocarbon ceramic laminates with Isola 370HR high-performance FR-4 epoxy systems. This advanced construction is designed for applications demanding superior high-frequency performance on outer layers combined with excellent thermal reliability and cost-effectiveness on inner layers.

The board measures 132mm x 144mm (single piece) with a total laminated thickness of 1.618mm and dimensional tolerance of ±0.15mm. The design incorporates blind vias (L1-L2, L9-L10, L7-L10) and resin-plugged vias for enhanced reliability. Minimum trace and space are not specified but impedance-controlled structures are implemented on critical layers. No statement regarding minimum hole size or blind via restrictions is provided in the base specification.

This design features blue solder mask on both sides with white silkscreen lettering for clear component identification. The Immersion Gold surface finish (135%-150% thickness) provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Impedance Control Specifications

RO4003C (Rogers Corporation)

The RO4003C™ laminate is a hydrocarbon ceramic material designed to offer superior high-frequency performance with low-cost circuit fabrication. Key characteristics include:

Low dielectric constant (3.38 ±0.05 at 10 GHz) – stable over broad frequency range

Low dissipation factor (0.0027 at 10 GHz) – minimal signal loss at high frequencies

Very low TCDk (+40 ppm/°C) – among the lowest of any circuit board material

High Tg (>280°C) – maintains dimensional stability during processing

FR-4 compatible processing – no specialized via preparation (no sodium etch required)

Low Z-axis CTE (46 ppm/°C) – excellent plated through-hole reliability

Excellent dimensional stability (<0.3 mm/m after etch) – ideal for multilayer constructions

RO4003C is ideal for RF microwave circuits, matching networks, controlled impedance transmission lines, and broadband applications where stable dielectric constant across frequency and temperature is critical.

370HR (Isola Group)

The 370HR is a high-performance multifunctional epoxy FR-4 system with a glass transition temperature of 180°C, designed for multilayer PWB applications requiring maximum thermal performance and reliability. Key characteristics include:

High Tg (180°C by DSC) – excellent thermal reliability for sequential lamination

High decomposition temperature (Td >340°C) – superior thermal stability

T260 >60 minutes, T288 >30 minutes – exceptional thermal stress resistance

Low Z-axis CTE (45 ppm/°C pre-Tg, 230 ppm/°C post-Tg) – reliable PTH performance

Z-axis expansion of only 2.8% (50-260°C) – minimizes stress during soldering

UV blocking and laser fluorescing – compatible with AOI and optical positioning systems

UL 94 V-0 flammability rating – meets fire safety standards

370HR has proven to be best-in-class for sequential lamination designs and provides improved thermal performance and lower expansion rates compared to traditional FR-4 while retaining FR-4 processability.

RO4003C Properties

370HR Properties

PCB Stackup & Construction

Via Structures:

Blind vias L1-L2 – connecting top layer to second layer

Blind vias L9-L10 – connecting bottom layer to ninth layer

Blind vias L7-L10 – deeper blind connection from bottom side

Resin-plugged vias – filled and planarized for enhanced reliability

Impedance Control:

Top layer: 12.2 mil trace width for 50Ω single-ended

Layer 3: 3.5 mil trace width with 5.5 mil spacing for 80Ω differential pair

Surface Finish: Immersion Gold (135%-150%)

The Immersion Gold finish offers excellent characteristics for high-reliability, fine-pitch applications:

Typical Applications

Thanks to the hybrid construction combining RO4003C's high-frequency performance with 370HR's thermal reliability, this PCB is ideally suited for:

• High-performance multilayer RF/microwave circuits
• Sequential lamination designs (370HR is best-in-class for this application)
• Mixed-dielectric multilayer board constructions
• Aerospace and defense electronics requiring both RF performance and thermal reliability
• Base station antennas and power amplifiers
• Satellite communication systems
• High-speed digital backplanes with RF sections

Key Benefits Summary

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.