Rogers RO3210 high DK10.2 High-Frequency Laminate and Custom Multilayer PCB built on 0.508mm core RO3210+0.2mm RO4450F PP

Product Description

When a design demands high dielectric constant, low loss, and the mechanical robustness of woven glass reinforcement, the RO3210 laminate from Rogers Corporation delivers a compelling combination. Part of the RO3200™ series, this ceramic-filled, woven fiberglass-reinforced PTFE composite was engineered as an extension of the RO3000® series with one distinguishing characteristic—improved mechanical stability.

RO3200 series laminates combine the surface smoothness of a non-woven PTFE laminate, enabling finer line etching tolerances, with the rigidity of a woven glass PTFE laminate. This makes them well suited to multilayer constructions where dimensional stability and reliable plated through-holes are essential. RO3210 offers a dielectric constant of 10.2 with a dissipation factor of 0.0027, and can be fabricated using standard PTFE circuit board processing techniques. The material is manufactured under an ISO 9002 certified quality system.

Applications

1. Microwave and RF Circuits – Filters, couplers, and matching networks
2. Patch Antennas – Reduced element size through high Dk
3. Phased Array Antennas – Stable performance across elements
4. Satellite Communications – Reliable operation in demanding environments
5. Radar Systems – Ground-based and airborne radar front-ends
6. Multilayer Constructions – Reliable stripline and multilayer board designs
7. Power Amplifiers and Combiners – High Dk for compact power combining networks

Custom PCB Manufacturing on RO3210

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers RO3210 and other advanced materials. The following specification details a representative 4-layer multilayer implementation:

PCB Construction Details:

Stack-up Configuration:

Material Advantages

With a Dk of 10.2, RO3210 enables significant size reduction in RF and microwave circuits. This makes it an excellent choice for patch antennas, filters, and other components where footprint is at a premium, and where a higher Dk allows circuit dimensions to be reduced.

The distinguishing characteristic of the RO3200 series is improved mechanical stability compared to the RO3000 series. The woven fiberglass reinforcement provides rigidity and dimensional stability, making the material well suited to multilayer board constructions where warpage and registration are concerns.

RO3210 combines the surface smoothness of a non-woven PTFE laminate with the rigidity of a woven glass PTFE laminate. This smooth surface enables finer line etching tolerances, supporting tight trace/space requirements and consistent impedance control.

A dissipation factor of 0.0027 is low for a material with such a high dielectric constant, ensuring acceptable efficiency in miniaturized antennas and filters.

RO3210 can be paired with RO4450F prepreg (as demonstrated in the 4-layer stack-up above) to build reliable multilayer constructions. The material can be fabricated using standard PTFE circuit board processing techniques, with minor modifications.

The demonstrated PCB implementation includes controlled-depth slots, allowing precise control of dielectric exposure and enabling unique mechanical and electrical functionality in the finished board.

RO3200 series laminates are manufactured under an ISO 9002 certified quality system, ensuring consistent quality and reliability.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, multilayer configurations using RO3210 and RO4450F prepreg, controlled-depth slots, alternative surface finishes (silver, gold, ENIG), or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.