Rogers RO3003 High-Frequency Laminate and Custom Multilayer PCB 10mil RO3003 core +Tg170 FR-4

Product Description

When a design calls for the electrical performance of a ceramic-filled PTFE laminate but the complexity of a multilayer construction, the challenge is not just material selection—it is finding a material that plays well with others. Rogers RO3003 addresses this directly: a ceramic-filled PTFE composite engineered for exceptional electrical and mechanical stability at competitive prices, with mechanical properties that remain consistent regardless of the dielectric constant selected.

RO3000® series high-frequency circuit materials are ceramic-filled PTFE composites intended for commercial microwave and RF applications. Because their mechanical properties are consistent across the Dk range, designers can develop multilayer board designs that use different dielectric constant materials for individual layers without encountering warpage or reliability problems. RO3003 exhibits a CTE of 17 ppm/°C in the X-axis and 16 ppm/°C in the Y-axis—matched to copper—enabling excellent dimensional stability with typical etch shrinkage of less than 0.5 mils per inch. The Z-axis CTE of 25 ppm/°C provides exceptional plated through-hole reliability, even in severe thermal environments.

RO3000 series laminates can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with minor modifications. They are also suitable for use with epoxy glass multilayer board hybrid designs, such as combining RO3003 with FR-4.

Key Properties at a Glance (RO3003):

Applications

1. Automotive Radar – Including 77 GHz systems for collision avoidance and autonomous driving
2. Band Pass Filters – Stable Dk simplifies broadband filter design
3. Microstrip Patch Antennas – Consistent performance across frequency
4. Voltage Controlled Oscillators (VCOs) – Stable Dk versus temperature
5. Stripline and Multilayer Constructions – Reliable plated through-holes
6. Hybrid Multilayer Designs – Can be paired with FR-4 for cost-effective layer stacking

The material's low in-plane expansion coefficient, matched to copper, allows for more reliable surface mount assemblies and makes it ideal for applications sensitive to temperature change.

Custom PCB Manufacturing on RO3003

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers RO3003 and other advanced materials. The following specification details a representative 4-layer hybrid multilayer implementation:

PCB Construction Details:

Stack-up Configuration (Representative):

Note: Depth-controlled routing extends from L2 to L4 and is non-plated, allowing precise control of dielectric exposure in hybrid stack-ups.

Material Advantages

RO3003 exhibits a thermal coefficient of Dk of just -3 ppm/°C from -50 to 150°C, and stable Dk across frequency from 8 GHz to 40 GHz. This stability simplifies the design of broadband components and allows the material to be used across a wide range of applications.

A dissipation factor of 0.0010 at 10 GHz minimizes signal attenuation, supporting applications up to 77 GHz, including automotive radar.

The X/Y CTE of 17/16 ppm/°C is matched to copper, enabling excellent dimensional stability with typical etch shrinkage of less than 0.5 mils per inch. This allows for more reliable surface mount assemblies and tight registration tolerances.

The Z-axis CTE of 25 ppm/°C provides exceptional plated through-hole reliability, even in severe thermal environments, supporting reliable stripline and multilayer board constructions.

Because mechanical properties are consistent regardless of the dielectric constant selected, designers can develop multilayer board designs that use different Dk materials for individual layers without encountering warpage or reliability problems.

RO3003 is suitable for use with epoxy glass multilayer board hybrid designs, allowing cost-effective combinations such as RO3003 for high-frequency layers and FR-4 for digital or power layers. This is exactly the approach used in the 4-layer build specified here.

At 0.04%, RO3003 absorbs minimal moisture, maintaining stable electrical properties in humid environments.

The material can be fabricated using standard PTFE circuit board processing techniques with minor modifications, and is lead-free process compatible.

RO3003 is available in standard thicknesses from 0.005" (0.13mm) to 0.060" (1.52mm), with standard panel sizes of 12"×18" (305×457mm) and 24"×18" (610×457mm), clad with electrodeposited or rolled copper foil in ½ oz or 1 oz weights.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and automotive applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, hybrid multilayer configurations combining RO3003 with FR-4, depth-controlled routing, alternative surface finishes, or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.