Product Description
4-Layer Hybrid High-Frequency PCB – Rogers RT/duroid 6202 + FR-4 with Via-in-Pad & IPC Class 3
1. Material Overview – RT/duroid 6202 (Rogers)
RT/duroid® 6202 is a low-loss, low-dielectric-constant PTFE-based laminate from Rogers Corporation, reinforced with limited woven glass fabric. It is specifically designed for complex microwave structures that require both mechanical reliability and electrical stability .
The addition of woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch) , enabling tight tolerance manufacturing for planar resistor applications and high-density multilayer circuits .
Key Material Characteristics
| Feature |
Benefit |
| Ultra-Low Dk (2.94 ± 0.04 @ 10 GHz) |
Reduces signal delay and crosstalk – ideal for high-frequency circuits up to 40 GHz+ . |
| Ultra-Low Df (0.0015 @ 10 GHz) |
Minimizes insertion loss – critical for antenna feed networks, radar systems, and beamforming networks . |
| TCDk = +5 ppm/°C |
Dielectric constant remains stable across temperature – essential for outdoor and aerospace applications . |
| X/Y CTE = 15 ppm/°C |
Matches copper's CTE – reduces stress on plated through-holes and surface-mount components . |
| Dimensional Stability = 0.07 mm/m |
Prevents double-etching and maintains tight positional tolerances . |
| Td = 500°C |
Exceptional thermal robustness – supports lead-free assembly and harsh operating environments . |
| Low Moisture Absorption (0.04%) |
Maintains electrical performance in humid conditions . |
| FR-4 Process Compatible |
Unlike many PTFE materials, RT/duroid 6202 can be processed with standard FR-4 fabrication techniques . |
| Lead-Free Process Compatible |
Fully supports 260°C peak reflow soldering . |
| UL 94 V-0 Flammability |
Meets safety requirements for commercial and aerospace applications . |
| Typical Applications |
|
| Market Segment |
Specific Use Cases |
| Aerospace & Defense |
Phased-array antennas, ground-based and airborne radar systems, commercial airline collision avoidance systems |
| Satellite Communications |
Beamforming networks, GPS antennas, high-reliability space-grade circuits |
| High-Frequency Test & Measurement |
Complex multilayer circuits with inter-layer connections |
| Microwave Backplanes |
High-reliability power backplanes, RF distribution networks |
2. Material Datasheet – Consolidated Properties (RT/duroid 6202)
| Property |
Direction |
Typical Value |
Unit |
Test Method |
| Dielectric Constant (Dk) @ 10 GHz |
Z |
2.94 ± 0.04 (≥0.020") |
– |
IPC-TM-650 2.5.5.5 |
| Dk @ 10 GHz (0.005" thickness) |
Z |
3.06 ± 0.04 |
– |
IPC-TM-650 2.5.5.5 |
| Dk @ 10 GHz (0.010–0.015" thickness) |
Z |
3.02 ± 0.04 |
– |
IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) @ 10 GHz |
Z |
0.0015 |
– |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dk |
Z |
5 |
ppm/°C |
IPC-TM-650 2.5.5.5; -50 to +150°C |
| Volume Resistivity |
Z |
1 × 10⁶ |
MΩ·cm |
ASTM D257; Condition A |
| Surface Resistivity |
Z |
1 × 10⁹ |
MΩ |
ASTM D257; Condition A |
| Thermal Conductivity |
– |
0.68 |
W/m·K |
ASTM C518; 80°C |
| CTE X (-55 to 288°C) |
X |
15 |
ppm/°C |
IPC-TM-650 2.4.41 |
| CTE Y (-55 to 288°C) |
Y |
15 |
ppm/°C |
IPC-TM-650 2.4.41 |
| CTE Z (-55 to 288°C) |
Z |
30 |
ppm/°C |
IPC-TM-650 2.4.41 |
| Td (Thermal Decomposition) |
– |
500 |
°C (TGA) |
ASTM D3850 |
| Specific Heat |
– |
0.93 (0.22) |
J/g·K (BTU/lb/°F) |
Calculated |
| Flammability |
– |
94V-0 |
Rating |
UL 94 |
| Tensile Modulus |
X,Y |
1007 (146) |
MPa (kpsi) |
ASTM D638; 23°C |
| Ultimate Stress |
X,Y |
30 (4.3) |
MPa (kpsi) |
ASTM D638; 23°C |
| Ultimate Strain |
X,Y |
4.9 |
% |
ASTM D638; 23°C |
| Compressive Modulus |
Z |
1035 (150) |
MPa (kpsi) |
ASTM D638 |
| Copper Peel Strength (1 oz ED foil) |
– |
9.1 (1.6) |
lbs/in (N/mm) |
IPC-TM-650 2.4.8 |
| Moisture Absorption |
– |
0.04 |
% |
IPC-TM-650 2.6.2.1; ASTM D570; D23/24, D48/50 |
| Density |
– |
2.1 |
g/cm³ |
ASTM D792 |
| Dimensional Stability |
X,Y |
0.07 |
mm/m (mil/in) |
IPC-TM-650 2.4.3.9; after etch +E/150 |
Note on Dk Variation: Due to construction limitations, the dielectric constant of RT/duroid 6202 varies slightly by laminate thickness: 0.005" = 3.06 ± 0.04, 0.010–0.015" = 3.02 ± 0.04, ≥0.020" = 2.94 ± 0.04 .
Laminate Standard Availability
| Parameter |
Options |
| Standard Thicknesses |
0.005" (0.127mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm), 0.030" (0.762mm) |
| Standard Panel Sizes |
12" × 18", 24" × 18", 24" × 36" |
| Copper Cladding |
EDC ½ oz, 1 oz; Rolled ½ oz, 1 oz, 2 oz; Reverse-treated; Resitive foil |
| Prepreg |
RT/duroid 6202PR – available in roll or panel form |
3. Custom PCB – 4-Layer Hybrid RT/duroid 6202 + FR-4 with Via-in-Pad & IPC Class 3
This 4-layer hybrid board demonstrates our capability to combine dissimilar materials (RT/duroid 6202 + FR-4) in a single, high-reliability PCB with IPC-6012 Class 3 compliance and advanced via-in-pad technology .
Basic Specifications
| Item |
Specification |
| Layer Count |
4 layers |
| Stack-Up Type |
Hybrid – Top: RT/duroid 6202 (0.127mm) + Prepreg (0.381mm) + Bottom: FR-4 (0.4mm) |
| Finished Board Thickness |
1.014 mm |
| Inner Layer Copper |
0.5 oz |
| Outer Layer Copper |
1 oz (top and bottom) |
| Surface Finish |
ENIG (Electroless Nickel/Immersion Gold) |
| Solder Mask |
Blue – both sides |
| Silkscreen |
White – both sides |
| Panel Size |
110 mm × 35 mm (single unit, including tooling strips, mounting holes, and fiducials) |
Advanced Process Features
| Feature |
Detail |
Benefit |
| Via-in-Pad (VIP) |
All vias: resin-plugged + plated-over copper cap |
Enables component placement directly on vias – essential for dense layouts |
| Resin Plugging |
Vias filled with resin and planarized |
Provides flat surface for capping; prevents solder wicking |
| Capped Vias |
Electroplated copper over filled vias |
Ensures electrical continuity and mechanical reliability |
| ENIG Finish |
Immersion Gold over Nickel |
Excellent solderability, flat surface, corrosion resistance – ideal for fine-pitch and wire bonding |
| 25µm Hole Wall Copper |
IPC-6012 Class 3 requirement |
Ensures robust PTH reliability in harsh environments (aerospace, defense) |
| Hybrid Material Bonding |
RT/duroid 6202 + FR-4 with appropriate prepreg |
Balances RF performance and cost – high-frequency signals on RT/duroid, routing/power on FR-4 |
Stack-Up Design
This configuration ensures that critical RF paths reside entirely within RT/duroid 6202, while the bulk of digital and power routing uses FR-4 – giving you the best of both worlds .
4. Why RT/duroid 6202 + FR-4 Hybrid for This Design?
| Requirement |
How RT/duroid 6202 + FR-4 Addresses It |
| High-frequency signal integrity (RF front-end) |
RT/duroid 6202's Df = 0.0015 @ 10 GHz minimizes insertion loss – critical for antenna feed networks and radar systems . |
| Temperature-stable performance |
TCDk = +5 ppm/°C ensures stable impedance over -50°C to +150°C – essential for aerospace and outdoor applications . |
| Mechanical reliability |
X/Y CTE = 15 ppm/°C matches copper – reduces PTH stress and ensures reliable surface-mount soldering . |
| Dimensional tolerance |
Dimensional stability = 0.07 mm/m – enables tight positional tolerances for complex microwave circuits . |
| Cost-effectiveness |
Hybrid construction places expensive RT/duroid only where needed (RF layers), using FR-4 for routing/power – reducing material cost . |
| IPC Class 3 reliability |
25µm hole wall copper and robust material properties meet the highest reliability standards for aerospace and defense. |
| Dense BGA routing |
Via-in-pad support (resin plug + cap) allows breakout from fine-pitch components. |
Comparison Table – RT/duroid 6202 vs. Standard FR-4 vs. High-End RF Materials
| Parameter |
RT/duroid 6202 |
Standard FR-4 (High-Tg) |
High-End PTFE (e.g., RT/duroid 5880) |
| Dk (@ 10 GHz) |
2.94 ± 0.04 |
~4.2–4.5 |
~2.20 |
| Df (@ 10 GHz) |
0.0015 |
~0.015–0.020 |
~0.0009 |
| TCDk (ppm/°C) |
+5 |
~+50 to +100 |
~0 (very low) |
| Td (TGA) |
500°C |
~340°C |
~500°C |
| CTE X/Y (ppm/°C) |
15/15 |
~14–16 |
~17–20 |
| CTE Z (ppm/°C) |
30 |
~50–70 |
~30–40 |
| Moisture Absorption |
0.04% |
~0.3–0.5% |
~0.02% |
| Dimensional Stability (mm/m) |
0.07 |
~0.10–0.20 |
~0.05–0.10 |
| Glass Reinforcement |
Limited woven glass |
E-glass |
No glass (pure PTFE) |
| FR-4 Process Compatibility |
Yes |
Yes |
Limited (sodium etch) |
| Relative Cost |
High |
Low |
Very High |
| Primary Application |
Radar, phased arrays, high-reliability RF |
General digital |
Space-grade, ultra-low-loss |
Application Areas
Phased-Array Antennas
Airborne & Ground-Based Radar
Commercial Airline Collision Avoidance Systems
Power Backplanes (High-Frequency)
Beamforming Networks
Q1: What makes RT/duroid 6202 different from standard FR-4?
A: RT/duroid 6202 offers significantly lower Dk (2.94 vs. ~4.2–4.5) , lower Df (0.0015 vs. ~0.015–0.020) , TCDk = +5 ppm/°C (very stable across temperature), X/Y CTE matched to copper (15 ppm/°C) , and excellent dimensional stability (0.07 mm/m) – all within a PTFE-based glass-reinforced system compatible with FR-4 processes .
Q2: Why use a hybrid stack-up (RT/duroid + FR-4) instead of all-RT/duroid?
A: Cost optimization. RT/duroid is significantly more expensive than FR-4. By placing RT/duroid only on the top layer (where RF signals are launched) and using FR-4 for routing and power distribution, we reduce material cost while maintaining critical RF performance. Hybrid construction is widely used in RF + control board designs .
Q3: Is RT/duroid 6202 compatible with lead-free soldering?
A: Yes. RT/duroid 6202 is lead-free process compatible and supports 260°C peak reflow soldering .
Q4: Can all vias be resin-plugged and capped (via-in-pad)?
A: Yes. Our manufacturing process supports resin plugging + electroplated capping for all vias. This is standard for this 4-layer design and enables component placement directly over vias.
Q5: What is IPC-6012 Class 3, and why is it important?
A: IPC-6012 Class 3 is the highest reliability class for rigid printed boards, requiring 25µm minimum hole wall copper, stringent inspection criteria, and proven thermal/mechanical reliability. It is required for aerospace, defense, medical, and high-reliability telecom applications.
Q6: What surface finishes are available for this hybrid board?
A: ENIG (Immersion Gold) is specified for this design. We also offer immersion silver, immersion tin, ENEPIG, and OSP – depending on your application requirements.
Contact Us
As a specialized PCB supplier based in China, we have extensive experience with Rogers RT/duroid materials, hybrid stack-ups (RT/duroid + FR-4) , and complex via-in-pad processes.
We provide:
- Full material traceability (certificates from Rogers)
- IPC-6012 Class 3 qualification with 25µm hole wall copper
- Impedance testing (TDR) with detailed reports
- X-ray and cross-section inspection for via quality
- Electrical testing (flying probe / fixture)
- Quick-turn prototypes and volume production
For technical inquiries, stack-up review, or quotation requests, please contact our sales team directly. We are ready to support your high-frequency aerospace, defense, and telecom projects.
Your message must be between 20-3,000 characters!