F4BM233 low DK 2.33 PTFE Fiberglass Laminate with ED copper foil and Custom 4mm core thick PCB Solutions

Product Description

For antenna designers seeking a well-balanced, cost-effective PTFE substrate with a low dielectric constant and excellent batch-to-batch consistency, the F4BM233 from Taizhou Wangling Insulation Materials Factory offers a compelling combination of performance and value. Built on a scientifically formulated blend of glass fiber cloth, PTFE resin, and PTFE film, this laminate delivers improved electrical performance over the standard F4B series—wider dielectric constant range, lower dielectric loss, higher insulation resistance, and greater stability—while remaining a direct replacement for comparable foreign products.

The F4BM and F4BME series share the same dielectric layer but differ in their copper foil. F4BM is paired with ED copper foil, making it suitable for applications without strict PIM requirements. F4BME is paired with reverse-treated RTF copper foil, delivering excellent PIM performance, more precise line control, and lower conductor loss. In both series, the dielectric constant is precisely tuned by adjusting the ratio between PTFE and glass fiber cloth—achieving low loss while enhancing dimensional stability. Higher dielectric constants correspond to higher glass content, which in turn improves dimensional stability, lowers thermal expansion, and enhances temperature drift performance, at a slight cost in dielectric loss.

Key Properties at a Glance (F4BM233):

Note: F4BM233 offers a Dk range of 2.17 to 3.0, with customizable values. The minimum available dielectric thickness is 0.1mm.

Applications

1. Microwave and RF Circuits – Filters, couplers, and matching networks
2. Radar Phase Shifters – Stable Dk for precise phase control
3. Passive Components – Power dividers, couplers, and combiners
4. Feed Networks – Antenna feed structures requiring low loss
5. Phased Array Antennas – Consistent performance across elements
6. Satellite Communications – Reliable operation in demanding environments
7. Base Station Antennas – Cost-effective feed networks and radiating elements

Custom PCB Manufacturing on F4BM233

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using F4BM233 and other advanced materials. The following specification details a representative double-sided PCB implementation:

PCB Construction Details:

With a Dk of 2.33 ± 0.04 at 10 GHz, F4BM233 provides tight impedance control and repeatable circuit performance. The material is available in a Dk range from 2.17 to 3.0, with custom values available to suit specific design requirements.

A dissipation factor of 0.0011 at 10 GHz and 0.0015 at 20 GHz minimizes signal attenuation, supporting efficient antenna feed networks and low-loss passive components across a broad frequency range.

When paired with reverse-treated RTF copper foil, the F4BME variant achieves PIM values of ≤ -159 dBc, making it suitable for sensitive receive paths in base station and satellite antennas.

The glass fiber cloth reinforcement provides mechanical strength and dimensional stability, with a CTE of 22 ppm/°C in X and 30 ppm/°C in Y—reasonably matched to copper for plated through-hole reliability. Higher Dk versions offer even greater dimensional stability due to increased glass content.

F4BM233 is available in dielectric thicknesses from 0.1mm up to 12.0mm, enabling a wide variety of circuit designs. Thicknesses of 0.1mm and 0.127mm are available as dielectric-only options, useful for thin, flexible constructions.

The material exhibits radiation resistance and low outgassing, making it suitable for space and aerospace applications.

As a commercially available, mass-producible material, F4BM233 offers a high cost-performance ratio, with multiple standard panel sizes (460×610mm, 500×600mm, 850×1200mm, 914×1220mm, 1000×1200mm) and custom sizes available to reduce material waste.

The series can be supplied with copper or aluminum bases (F4BM—CU or F4BM—AL) for shielding or heat dissipation, with metal base thicknesses from 0.48 mm to 3.98 mm.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative Dk values (2.17 to 3.0), copper foil options (ED or reverse-treated RTF), metal-backed configurations, or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.