F4BTME350 Ceramic-Filled PTFE Laminate with Reverse-Treated Copper and Custom 2-layer PCB built on 10mil substrate material for RF Microwave

Product Description

For antenna designers balancing PIM performance, dielectric constant, and cost, the choice of copper foil can be just as important as the choice of dielectric. The F4BTME350 from Taizhou Wangling Insulation Materials Factory pairs a ceramic-filled PTFE dielectric with reverse-treated RTF copper foil, delivering excellent PIM characteristics, precise line control, and reduced conductor loss in a commercially scalable material.

F4BTME350 is a glass fiber cloth reinforced, nano-ceramic-filled PTFE laminate. By incorporating high-dielectric, low-loss nano-ceramics into the F4BM dielectric layer, the material achieves a higher dielectric constant, improved heat resistance, lower thermal expansion, higher insulation resistance, and better thermal conductivity—all while preserving low-loss behavior. The F4BTME variant is specifically paired with reverse-treated RTF copper foil for superior PIM performance, making it well suited to sensitive receive paths and high-performance antenna systems.

Models & Data Sheet

Our PCB Capability (F4BTME)

Applications

1. 4G/5G Base Station Antennas – Feed networks and radiating elements requiring low PIM
2. Low Noise Amplifiers (LNAs) and LNBs/LNCs – Low-loss signal paths for sensitive receivers
3. Phased Array and Phase-Sensitive Antennas – Precise phase control across elements
4. Satellite Communications – Reliable performance in aerospace and cabin equipment
5. Microwave and RF Modules – Filters, couplers, and matching networks
6. Radar Systems – Including automotive radar front-ends
7. High-Power Amplifiers and Passive Components – Power dividers, couplers, and combiners
8. PCS/PCN Large-Format Antennas – Cost-effective feed networks

Custom PCB Manufacturing on F4BTME350

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using F4BTME350 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

Higher Dielectric Constant with Low Loss:

The nano-ceramic filler raises the Dk to 3.5 while maintaining a low dissipation factor of 0.0025 at 10 GHz and 0.0035 at 20 GHz. This enables more compact circuit designs without compromising signal integrity.

Excellent PIM Performance:
When paired with reverse-treated RTF copper foil, F4BTME350 achieves PIM values of ≤ -160 dBc. This makes it an excellent choice for sensitive receive paths in base station, satellite, and phased array antennas, where PIM-related interference can degrade system performance.

Precise Line Control and Low Conductor Loss:
The reverse-treated RTF copper foil provides finer line definition and lower conductor loss compared to standard ED copper, supporting tight trace/space requirements and consistent impedance control.

Outstanding Thermal Stability:
With a CTE of 10 ppm/°C in X and 12 ppm/°C in Y (closely matched to copper), plus a low dielectric constant temperature coefficient of -60 ppm/°C, F4BTME350 maintains stable electrical performance across temperature extremes from -55°C to +260°C.

Improved Thermal Management:
A thermal conductivity of 0.54 W/m·K in the Z-direction helps dissipate heat in high-power RF applications, while the material's high insulation resistance and breakdown voltage (>40 kV in XY direction) ensure reliable operation.

Radiation and Outgassing Resistance:
The material exhibits low outgassing and radiation resistance, making it suitable for space and aerospace applications where these properties are critical.

Cost-Effective and Scalable:
As a commercially available, mass-producible material, F4BTME350 offers a high cost-performance ratio with a wide range of available thicknesses (0.254 mm to 12.0 mm) and panel sizes (460×610mm, 600×500mm, 914×1220mm), reducing material waste and lowering overall system cost. Metal-backed options (aluminum or copper) are also available for shielding or heat dissipation.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative copper foils (ED or reverse-treated RTF), metal-backed options (aluminum or copper), or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.