Taizhou Wangling Insulation Material Factory F4BM233 PTFE Fiberglass Cloth Copper Clad Laminate Overview

Taizhou Wangling Insulation Material Factory F4BM233 PTFE Fiberglass Cloth Copper Clad Laminate Overview

The F4BM233 is a key model within the Taizhou Wangling Insulation Material Factory's F4BM series of high-performance Polytetrafluoroethylene (PTFE) fiberglass cloth copper clad laminates. This product is specifically engineered for advanced microwave and RF applications that demand high frequency stability and low loss, making it an ideal substrate for critical components such as phased array radars, satellite communications, base station antennas, power dividers, and couplers.

Core Characteristics & Standard Specifications

The defining feature of the F4BM233 is its optimal balance between a stable dielectric constant (Dk) and an extremely low dissipation factor (Df). According to the product datasheet, its typical dielectric constant at 10GHz is 2.33, with a tight tolerance of ±0.04. Its dissipation factor is as low as 0.0011 at 10GHz and 0.0015 at 20GHz, ensuring minimal signal attenuation and distortion during transmission, thereby significantly enhancing system efficiency.

Regarding thermo-mechanical performance, the F4BM233 demonstrates excellent stability. Its coefficient of thermal expansion (CTE) is 22-30 ppm/°C in the XY direction and 205 ppm/°C in the Z direction, offering better compatibility with the CTE of copper foil used in PCB fabrication, which improves the reliability of multilayer board structures. The material shows no delamination after undergoing a solder shock test at 260°C for 10 seconds, repeated three times, verifying its superior heat resistance and lamination process reliability. Its long-term operating temperature range is -55°C to +260°C, suitable for demanding environmental conditions.

In terms of electrical and reliability metrics, the F4BM233 also excels: Peel Strength (with ED copper foil) >1.8 N/mm; Volume Resistivity ≥6×10⁶ MΩ·cm; Surface Resistance ≥1×10⁶ MΩ; Electric Strength (Z-direction) >23 KV/mm; Breakdown Voltage (XY-direction) >32 KV. Its water absorption is exceptionally low at ≤0.08%, guaranteeing stable performance in humid environments. The product complies with the UL 94 V-0 flammability rating.

Product Composition & Options

The dielectric layer of F4BM233 is composed of Polytetrafluoroethylene (PTFE) resin and fiberglass cloth, scientifically formulated and pressed. This model is paired with ED copper foil, making it suitable for applications without specific Passive Intermodulation (PIM) requirements. Customers can select ED copper foil in various thicknesses, such as 0.5OZ (0.018mm) and 1OZ (0.035mm), based on design needs.

The laminate offers a wide range of size and thickness options. Standard sizes include 460×610mm and 914×1220mm, with non-standard customization also supported. A broad selection of dielectric thicknesses is available, starting from 0.127mm, with options for either overall thickness (including copper) or pure dielectric thickness to meet diverse design requirements.

Application & Value Proposition

In summary, the F4BM233 is a well-balanced and reliable high-frequency circuit substrate. Its stable dielectric properties, extremely low loss, excellent thermal stability, and mechanical strength enable it to serve as a high-quality, cost-effective, commercially available, and mass-producible alternative to comparable high-end foreign products. It provides an outstanding material solution for high-tech fields such as microwave/RF, radar systems, satellite communications, and 5G base station antennas. All data provided are typical values, and suitability for specific applications should be verified and confirmed by the customer.