WL-CT615 DK6.15 High-Performance Thermoset Hydrocarbon/Ceramic Laminate & Custom 2-Layer PCB Solution

Product Description

 

WL-CT615 High-Performance Thermoset Hydrocarbon/Ceramic Laminate & Custom 2-Layer PCB Solution

 

Introduction to WL-CT615

WL-CT615 is a high-performance thermosetting resin-based high-frequency laminate manufactured by Taizhou Wangling Insulation Material Factory. It belongs to the WL-CT series of organic polymer ceramic fiberglass cloth copper-clad laminates. The dielectric layer is composed of hydrocarbon resin, ceramic fillers, and fiberglass cloth reinforcement, providing excellent low-loss performance while maintaining exceptional PCB processability.

 

One of the key advantages of WL-CT615 is its FR4-compatible processing. Unlike PTFE-based materials that require specialized handling, WL-CT615 can be processed using standard FR4 manufacturing techniques, offering superior circuit stability and consistency while significantly simplifying the fabrication process. This makes it an ideal replacement for similar foreign products.

 

The hydrocarbon resin and composite ceramic system delivers outstanding low dielectric loss, high-temperature resistance, and excellent temperature stability. The material features a high Tg exceeding 280°C, ensuring dimensional stability and reliable plated-through-hole quality even under elevated temperatures.

 

The WL-CT series offers a wide range of dielectric constants, including 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15, providing design flexibility across various applications.

 

Copper Foil Options

Copper Foil Type	Key Characteristics
ED Copper	Standard electrodeposited copper; compatible with all WL-CT models
RTF Copper	Reverse-treated foil with adhesive backing; improves peel strength; not available for WL-CT615

 

Note: WL-CT615 is limited to ED copper foil only. Other WL-CT models can be supplied with either ED or RTF copper.

 

Key Technical Specifications (WL-CT615)

Property	Test Condition	Unit	WL-CT615 Value
Dielectric Constant (Typical) @ 10 GHz	10 GHz	—	6.15
Dielectric Constant (Design) @ 10 GHz	10 GHz, 50Ω Microstrip	—	6.4
Dielectric Constant Tolerance	—	—	±0.15
Dissipation Factor @ 2 GHz	2 GHz	—	0.0032
Dissipation Factor @ 10 GHz	10 GHz	—	0.004
Thermal Coefficient of Dk	-55°C to +150°C	ppm/°C	-122
Peel Strength (1 oz ED Copper)	1 oz, Normal State	N/mm	0.9
Volume Resistivity	Normal State	MΩ·cm	2×10⁷
Surface Resistivity	Normal State	MΩ	5×10⁶
Electrical Strength (Z-direction)	5 kV, 500 V/s	kV/mm	30
Breakdown Voltage (XY-direction)	5 kV, 500 V/s	kV	25
CTE – X axis	-55°C to +288°C	ppm/°C	15
CTE – Y axis	-55°C to +288°C	ppm/°C	17
CTE – Z axis	-55°C to +288°C	ppm/°C	33
Thermal Stress	288°C, 10s, 3 cycles	—	No Delamination
Moisture Absorption	23.5±2°C, 24 hours	%	0.08
Density	Room Temperature	g/cm³	2.18
Long-Term Operating Temperature	—	°C	-55 to +260
Thermal Conductivity (Z-direction)	—	W/(m·K)	0.72
Flammability	—	UL-94	V-0
Tg (Glass Transition Temperature)	—	°C	>280
Td (Decomposition Temperature)	Onset	°C	398
Halogen Content	—	—	Halogen-Free
Material Composition	—	—	Hydrocarbon + Ceramic + Fiberglass

 

Features & Benefits

WL-CT615 delivers a comprehensive set of advantages for high-frequency and high-reliability applications:

 

 

Feature	Description
High Dielectric Constant (6.15)	Enables circuit miniaturization and reduced wavelength for compact designs
Tight Dk Tolerance (±0.15)	Excellent batch-to-batch consistency for reliable performance
Low Dissipation Factor	0.0040 @ 10 GHz – suitable for high-frequency signal integrity
High Tg (>280°C)	Maintains dimensional stability and PTH reliability at elevated temperatures
Copper-Matched CTE (15/17 ppm/°C)	Matches copper expansion for reliable plated-through holes
High Thermal Conductivity (0.72 W/m·K)	Superior to thermoplastic alternatives; supports high-power applications
Radiation Resistance	Maintains stable dielectric and physical properties after radiation exposure
Low Outgassing	Meets aerospace vacuum outgassing requirements
Halogen-Free	Environmentally friendly
UL 94 V-0 Flammability	Meets stringent safety requirements

 

 

FR4-Compatible Processing: Can be fabricated using standard FR4 manufacturing techniques – no specialized processing required, unlike PTFE materials. This simplifies production, reduces costs, and improves circuit consistency.

 

Superior Thermal Stability: With high Tg (>280°C) and low TCDk (-122 ppm/°C), WL-CT615 maintains stable electrical performance across a wide temperature range.

 

High PTH Reliability: Low Z-axis CTE (33 ppm/°C) combined with copper-matched XY CTE ensures reliable plated-through-hole integrity under thermal cycling.

 

Excellent Thermal Management: Thermal conductivity of 0.72 W/(m·K) – exceeding typical thermoplastic materials – enables efficient heat dissipation in power applications.

 

Radiation Resistance & Low Outgassing: Suitable for aerospace, spaceborne, and defense applications requiring exceptional reliability.

 

Versatile Design Options: Available in multiple Dk values and compatible with aluminum base plates for shielding and heat dissipation.

 

Cost-Effective: Commercial-grade, high-volume production with excellent price-to-performance ratio.

 

 

Custom 2-Layer PCB Solution on WL-CT615

Leveraging the advanced properties of WL-CT615, we offer the following precision-engineered 2-layer rigid PCB solution. This design is ideal for high-frequency applications requiring excellent thermal stability, FR4-compatible processing, and reliable electrical performance.

 

 

PCB Construction Details

Parameter	Specification
Base Material	Wangling WL-CT615 (ED Copper)
Number of Layers	2
Finished Board Size	99.03 mm × 45.6 mm (±0.15 mm)
Finished Board Thickness	0.3 mm
Minimum Trace / Space	4 / 5 mils
Minimum Hole Size	0.4 mm (through-hole only; no blind vias)
Outer Layer Copper Weight	1 oz (35 μm)
Via Plating Thickness	20 μm
Surface Finish	ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Green
Bottom Solder Mask	Green
Electrical Testing	100% prior to shipment
Accepted Quality Standard	IPC-Class-2
Artwork Format	Gerber RS-274-X
Global Availability	Worldwide shipping

 

Design & Manufacturing Highlights

 

FR4-Compatible Processing: WL-CT615 can be processed using standard FR4 manufacturing techniques, offering shorter lead times, lower costs, and superior circuit consistency compared to PTFE-based materials.

 

High-DK Design: With a Dk of 6.15 ± 0.15, this PCB enables significant circuit size reduction, ideal for compact RF and microwave modules.

 

Fine-Feature Capability: Supports 4/5 mil trace/space and 0.4 mm micro-vias, enabling dense high-frequency circuit layouts.

 

Green Solder Mask on Both Sides: Provides comprehensive protection for both top and bottom copper layers, ensuring long-term reliability.

 

White Silkscreen on Both Sides: Clear component identification on both sides facilitates assembly and inspection.

 

ENEPIG Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) provides a flat, highly solderable surface with excellent oxidation resistance. The palladium layer prevents nickel corrosion (black pad syndrome), ensuring superior wire bonding capability and long-term reliability – ideal for high-reliability aerospace and defense applications.

 

Excellent PTH Reliability: With 20 μm via plating and low Z-axis CTE (33 ppm/°C), the PCB offers outstanding plated-through-hole integrity.

 

Strict Quality Control: Every board undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, guaranteeing consistent quality and performance.

 

 

Typical Applications

 

Base Station Antennas & Satellite Antennas

Automotive Radar, Sensors & Navigation Systems

Power Amplifiers

Satellite High-Frequency Heads

RF Devices & Filters

WiMAX Antennas & Distributed Antennas

Phased Array Antennas & Beamforming Networks

Aerospace & Defense Equipment

 

 

Conclusion

As a specialized supplier of custom high-frequency circuit boards, we combine the proven performance of Wangling WL-CT615 – a thermosetting hydrocarbon/ceramic laminate with exceptional thermal stability, FR4-compatible processing, and high reliability – with our precision manufacturing capabilities to deliver world-class PCB solutions. Our 2-layer offering fully leverages WL-CT615's high dielectric constant (6.15), low loss (0.0040 @ 10 GHz), high Tg (>280°C), copper-matched CTE, and superior thermal conductivity (0.72 W/m·K), ensuring your most demanding RF, aerospace, and defense designs achieve optimal performance and reliability.

 

 

Whether you are developing automotive radar systems, satellite communication payloads, base station antennas, or high-power RF amplifiers, our engineering team is ready to support your project.

 

For technical consultations, samples, or volume orders, please contact us today.

 

We look forward to being your trusted partner in high-frequency innovation.