Wangling TFA1020 double sided PCB material Aerospace-Grade PTFE/Ceramic Composite Laminate with RTF (Reverse-Treated Foil)

Product Description

TFA1020 Aerospace-Grade PTFE/Ceramic Composite Laminate & Custom Ultra-Thin 2-Layer PCB Solution

 

1. Introduction to TFA1020

TFA1020 is a premium aerospace-grade high-frequency laminate belonging to the TFA series manufactured by Taizhou Wangling Insulation Material Factory. The dielectric layer is composed of PTFE resin and ceramic fillers – without any fiberglass cloth reinforcement. Unlike traditional PTFE laminates that use resin-impregnated fiberglass cloth, the TFA series employs an advanced prefabricated sheet manufacturing process followed by a specialized lamination technique, resulting in superior electrical, thermal, and mechanical properties.

 

The absence of fiberglass cloth eliminates the "glass-fiber effect" that can cause dielectric constant variations and increased loss at high frequencies. Instead, TFA1020 utilizes a large volume of uniformly dispersed specialty nano-ceramics mixed with PTFE resin, delivering:

 

• Excellent frequency stability up to 77 GHz, supporting millimeter-wave and automotive radar applications
• Minimal dielectric loss – the lowest in its class
• Lowest X/Y/Z anisotropy for consistent performance in all directions
• Copper-matched CTE for reliable plated-through-hole integrity
• Stable dielectric temperature characteristics

 

 

The TFA series offers four dielectric constant options: 2.94, 3.0, 6.15, and 10.2, corresponding to part numbers TFA294, TFA300, TFA615, and TFA1020.

 

TFA series comes standard with RTF (Reverse-Treated Foil) low-roughness copper foil, which reduces conductor loss while providing excellent peel strength. Rolled copper foil is also available as an option, and the material can be supplied with aluminum or copper base plates for enhanced thermal management.

 

 

2. Key Technical Specifications (TFA1020)

Property	Test Condition	Unit	TFA1020 Value
Dielectric Constant (Typical) @ 10 GHz	10 GHz	—	10.2
Dielectric Constant (Design) @ 10 GHz	10 GHz, 50Ω Microstrip	—	10.7
Dielectric Constant Tolerance	—	—	±0.20
Dissipation Factor @ 10 GHz	10 GHz	—	0.0015
Dissipation Factor @ 20 GHz	20 GHz	—	0.0017
Thermal Coefficient of Dk	-55°C to +150°C	ppm/°C	-340
Peel Strength (1 oz RTF Copper)	1 oz, Normal State	N/mm	>1.6
Volume Resistivity	Normal State	MΩ·cm	≥5×10⁷
Surface Resistivity	Normal State	MΩ	≥5×10⁷
Electrical Strength (Z-direction)	5 kV, 500 V/s	kV/mm	>30
Breakdown Voltage (XY-direction)	5 kV, 500 V/s	kV	>25
CTE – X axis	-55°C to +288°C	ppm/°C	16
CTE – Y axis	-55°C to +288°C	ppm/°C	16
CTE – Z axis	-55°C to +288°C	ppm/°C	30
Thermal Stress	260°C, 10s, 3 cycles	—	No Delamination
Moisture Absorption	20±2°C, 24 hours	%	0.015
Density	Room Temperature	g/cm³	3
Long-Term Operating Temperature	—	°C	-55 to +260
Thermal Conductivity (Z-direction)	—	W/(m·K)	0.88
Flammability	—	UL-94	V-0
Td (Decomposition Temperature)	Onset	°C	505
Material Composition	—	—	PTFE + Ceramic

 

Note: For dielectric thicknesses exceeding 1.5 mm, a very small amount of glass fiber cloth may be added for structural reinforcement.

 

 

3. Features & Benefits

TFA1020 delivers a comprehensive set of advantages for high-frequency, aerospace, and high-reliability applications:

 

 

Feature	Description
High Dielectric Constant (10.20)	Enables significant circuit miniaturization and reduced wavelength
Tight Dk Tolerance (±0.20)	Excellent batch-to-batch consistency for reliable performance
Ultra-Low Dissipation Factor	0.0015 @ 10 GHz – the lowest in its class for high-Dk materials
77 GHz Capability	Supports millimeter-wave and automotive radar applications
No Glass Fiber Reinforcement	Eliminates glass-fiber effect; minimizes anisotropy and dielectric loss
Copper-Matched CTE (16/16 ppm/°C)	Matches copper expansion for reliable PTH integrity
High Thermal Conductivity (0.88 W/m·K)	Superior heat dissipation for high-power applications
Ultra-Low Moisture Absorption (0.015%)	Exceptional stability in humid environments
Radiation Resistance	Maintains stable properties after radiation exposure
Low Outgassing	Meets aerospace vacuum outgassing requirements
UL 94 V-0 Flammability	Meets stringent safety requirements
High Decomposition Temperature (505°C)	Exceptional thermal stability

 

 

Superior High-Frequency Performance: The absence of glass fiber cloth eliminates anisotropic effects, providing consistent electrical performance across all directions. The ultra-low dissipation factor (0.0015 @ 10 GHz) ensures minimal signal loss.

 

Circuit Miniaturization: With a Dk of 10.20, TFA1020 enables significant size reduction compared to low-Dk materials, making it ideal for compact RF and microwave modules.

 

Excellent Phase Stability: Stable frequency and phase performance from -55°C to +150°C ensures reliable operation in temperature-varying environments.

 

Exceptional Thermal Management: Thermal conductivity of 0.88 W/(m·K) – significantly higher than standard PTFE materials – enables efficient heat dissipation in high-power applications.

 

Space-Grade Reliability: Radiation resistance and low outgassing make TFA1020 suitable for spaceborne, aerospace, and defense applications.

 

Simplified Processing: Can be processed using standard PTFE PCB manufacturing techniques, with excellent machinability for fine-line circuits and dense hole patterns.

 

High PTH Reliability: Low Z-axis CTE (30 ppm/°C) combined with copper-matched XY CTE ensures reliable plated-through-hole integrity.

 

Versatile Cladding Options: Standard RTF copper foil reduces conductor loss while providing excellent peel strength; optional rolled copper, embedded 50Ω resistor foil, aluminum, or copper base plates available.

 

 

4. Custom Ultra-Thin 2-Layer PCB Solution on TFA1020

Leveraging the advanced properties of TFA1020, we offer the following precision-engineered ultra-thin 2-layer rigid PCB solution. This design is ideal for space-constrained, high-reliability RF, microwave, and aerospace applications requiring exceptional electrical performance and compact form factors.

 

 

Parameter	Specification
Base Material	Wangling TFA1020 (RTF Copper)
Number of Layers	2
Finished Board Size	67.4 mm × 89 mm (±0.15 mm)
Finished Board Thickness	0.25 mm
Minimum Trace / Space	4 / 6 mils
Minimum Hole Size	0.35 mm (through-hole only; no blind vias)
Outer Layer Copper Weight	1 oz (35 μm)
Via Plating Thickness	20 μm
Surface Finish	Pure Gold (Electroplated Gold)
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% prior to shipment
Accepted Quality Standard	IPC-Class-2
Artwork Format	Gerber RS-274-X
Global Availability	Worldwide shipping

 

 

Design & Manufacturing Highlights

 

Ultra-Thin Profile: At just 0.25 mm finished thickness with a 5 mil (0.127 mm) core, this PCB offers an exceptionally low-profile, lightweight solution – ideal for space-constrained aerospace, satellite, and portable RF modules.

 

High-DK Design: With a Dk of 10.20 ± 0.20, this PCB enables significant circuit size reduction, allowing for compact antenna arrays, phase shifters, and RF front-end modules.

 

Ultra-Low Loss Performance: The dissipation factor of 0.0015 at 10 GHz ensures minimal insertion loss, preserving signal integrity in high-frequency and millimeter-wave applications.

 

Fine-Feature Capability: Supports 4/6 mil trace/space and 0.35 mm micro-vias, enabling dense high-frequency circuit layouts.

 

No Solder Mask / No Silkscreen: The bare copper surface with pure gold finish provides optimal signal integrity for high-frequency designs. No solder mask or silkscreen minimizes parasitic effects and ensures consistent RF performance.

 

Pure Gold Surface Finish: Electroplated pure gold (rather than ENIG) provides an exceptionally flat, highly conductive, and oxidation-resistant surface with excellent wire-bonding capability and solderability. Pure gold eliminates any potential magnetic or corrosion issues associated with nickel layers, making it the preferred choice for high-frequency, aerospace, and RF applications where signal integrity and reliability are critical.

 

RTF Copper Foil: The standard RTF low-roughness copper foil reduces conductor loss while providing excellent peel strength.

 

Excellent PTH Reliability: With 20 μm via plating and low Z-axis CTE (30 ppm/°C), the PCB offers outstanding plated-through-hole integrity even under thermal cycling conditions.

 

Strict Quality Control: Every board undergoes 100% electrical testing and is manufactured to IPC-Class-2 standards, guaranteeing consistent quality and performance.

 

 

5. Typical Applications

Aerospace Equipment

Microwave & Antenna Systems

Radar Systems

Phased Array Antennas & Beamforming Networks

Satellite Communications & Navigation

Power Amplifiers

Millimeter-Wave Applications

Test & Measurement Equipment

 

 

6. Conclusion

As a specialized supplier of custom high-frequency circuit boards, we combine the proven performance of Wangling TFA1020 – an aerospace-grade, fiberglass-free PTFE/ceramic composite with exceptional electrical, thermal, and mechanical properties – with our precision manufacturing capabilities to deliver world-class PCB solutions. Our ultra-thin 2-layer offering fully leverages TFA1020's high dielectric constant (10.20), ultra-low loss (0.0015 @ 10 GHz), copper-matched CTE (16/16 ppm/°C), high thermal conductivity (0.88 W/m·K), and 77 GHz capability, ensuring your most demanding RF, aerospace, and defense designs achieve optimal performance and reliability in the most compact form factors.

 

 

Whether you are developing satellite communication payloads, phased array antennas, automotive radar systems, or high-power RF amplifiers, our engineering team is ready to support your project. For technical consultations, samples, or volume orders, please contact us today.

 

We look forward to being your trusted partner in high-frequency innovation.