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Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
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Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
  • name

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

MOQ: 1
Price: USD20~30
Standard Packaging: Vaccum
Delivery Period: 5-6 working days
Payment Method: T/T / Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-209-V1.0
Board Thick:
1.524mm ±0.13mm
Copper Thick:
1oz (35µm), 2oz (70µm)
Surface Finish:
Immersion Gold, HASL, Immersion Silver, Immersion Tin,Bare Copper, OSP, Pure Gold Plated Etc..
Solder Mask Color:
Green
Colour Of Component Legend:
White
TEST:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD20~30
Packaging Details:
Vaccum
Delivery Time:
5-6 working days
Payment Terms:
T/T / Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.

 

Features and Benefits

1. Copper matched CTE in X and Y axis

2. Low Z-direction CTE of 20 ppm /°C

3. Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability

4. Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change

5. High reliability on plated through holes

6. 0.02% low moisture absorption

7. Great number of NASA outgassing values.

8. High thermal conductivity of 0.56 W/m/K

 

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards 0

 

Our PCB Capability (CLTE-XT laminates)

PCB Capability (CLTE-XT Laminates)
PCB material: Ceramic/PTFE Microwave Composite
Designation: CLTE-XT
Dielectric constant: 2.94
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold plated etc..

 

The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.

 

Typical Applications

1. Advanced Driver Assistance Systems (ADAS)

2. CNI (communication, navigation and identification) Applications

3. Defense Microwave/RF Applications

4. Microwave Feed Networks

5. Phased Array Antennas

6. Power Amplifiers

7. Patch Antennas

8. Radar Manifolds

9. Satellite & Space Electronics

 

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards 1

 

Data Sheet (CLTE-XT laminates)

Properties CLTE-XT Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.94 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6
PIM (For antenna only) - dBc - 50 ohm
0.060"		 43dBm 1900 MHz
Thermal Properties
Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 1.7
(9)		 N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD, CMD) 40.7, 40.0
(5.9, 5.8)		 MPa (ksi ) 25˚C  3˚C - ASTM D790
Tensile Strength (MD, CMD) 29.0, 25.5
(4.2, 3.7)		 MPa (ksi ) 23C/50RH - ASTM D638
Flex Modulus (MD. CMD) 3247, 3261
(471, 473)		 MPa (ksi ) 25C  3C - ASTM D790
Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650 2.6.2.1
Density 2.17 g/cm³ C-24/23/50 - ASTM D792
Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716
NASA Outgassing 0.02 / 0.00 %   TML/CVCM ASTM E595

 

 

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards 2

 

Tags: 

high speed pcb,  

high frequency circuit design

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
  • name
Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
MOQ: 1
Price: USD20~30
Standard Packaging: Vaccum
Delivery Period: 5-6 working days
Payment Method: T/T / Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-209-V1.0
Board Thick:
1.524mm ±0.13mm
Copper Thick:
1oz (35µm), 2oz (70µm)
Surface Finish:
Immersion Gold, HASL, Immersion Silver, Immersion Tin,Bare Copper, OSP, Pure Gold Plated Etc..
Solder Mask Color:
Green
Colour Of Component Legend:
White
TEST:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD20~30
Packaging Details:
Vaccum
Delivery Time:
5-6 working days
Payment Terms:
T/T / Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.

 

Features and Benefits

1. Copper matched CTE in X and Y axis

2. Low Z-direction CTE of 20 ppm /°C

3. Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability

4. Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change

5. High reliability on plated through holes

6. 0.02% low moisture absorption

7. Great number of NASA outgassing values.

8. High thermal conductivity of 0.56 W/m/K

 

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards 0

 

Our PCB Capability (CLTE-XT laminates)

PCB Capability (CLTE-XT Laminates)
PCB material: Ceramic/PTFE Microwave Composite
Designation: CLTE-XT
Dielectric constant: 2.94
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold plated etc..

 

The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.

 

Typical Applications

1. Advanced Driver Assistance Systems (ADAS)

2. CNI (communication, navigation and identification) Applications

3. Defense Microwave/RF Applications

4. Microwave Feed Networks

5. Phased Array Antennas

6. Power Amplifiers

7. Patch Antennas

8. Radar Manifolds

9. Satellite & Space Electronics

 

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards 1

 

Data Sheet (CLTE-XT laminates)

Properties CLTE-XT Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.94 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6
PIM (For antenna only) - dBc - 50 ohm
0.060"		 43dBm 1900 MHz
Thermal Properties
Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 1.7
(9)		 N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD, CMD) 40.7, 40.0
(5.9, 5.8)		 MPa (ksi ) 25˚C  3˚C - ASTM D790
Tensile Strength (MD, CMD) 29.0, 25.5
(4.2, 3.7)		 MPa (ksi ) 23C/50RH - ASTM D638
Flex Modulus (MD. CMD) 3247, 3261
(471, 473)		 MPa (ksi ) 25C  3C - ASTM D790
Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650 2.6.2.1
Density 2.17 g/cm³ C-24/23/50 - ASTM D792
Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716
NASA Outgassing 0.02 / 0.00 %   TML/CVCM ASTM E595

 

 

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards 2

 

Tags: 

high speed pcb,

high frequency circuit design

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