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F4BM High Frequency PCB with 0.5oz 1oz 2oz copper and HASL surface finish

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F4BM High Frequency PCB with 0.5oz 1oz 2oz copper and HASL surface finish

Name: F4BM High Frequency PCB with 0.5oz 1oz 2oz copper and HASL surface finish
Brand: Bicheng Enterprise
SKU: BIC-268-V2.68
Price: 2.99 USD
Availability: InStock
Rating: 4.7 (165 reviews)

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Enterprise

Certification

Model Number

BIC-268-V2.68

Number Of Layers:

Board Material:

Poyimide 25µm

Surface Cu Thickness:

1.0

Board Thickness:

0.25mm +/-10%

Surface Finish:

Immersion Gold

Solder Mask Color:

Black/Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

F4BM High Frequency PCB

Introduction

These series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

F4BM and F4BME have the same dielectric layer but different copper foil combinations: F4BM is paired with ED copper foil, suitable for applications without PIM requirements; F4BME is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.

By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM and F4BME achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.

Features & Benefits

-DK options available: 2.17 to 3.0, customizable DK

-Low loss

-F4BME paired with RTF copper foil, excellent PIM performance

-Diverse sizes, cost-effective

-Radiation resistance, low outgassing

-Commercialized, large-scale production, high cost-effectiveness

Laminate Models and Data Sheet

Product Technical Parameters

Product Model & Data Sheet

Product Features

Test Conditions

Unit

F4BM217

F4BM220

F4BM233

F4BM245

F4BM255

F4BM265

F4BM275

F4BM294

F4BM300

Dielectric Constant (Typical)

10GHz

2.17

2.2

2.33

2.45

2.55

2.65

2.75

2.94

3.0

Dielectric Constant Tolerance

±0.04

±0.05

±0.06

Loss Tangent (Typical)

10GHz

0.001

0.0011

0.0012

0.0013

0.0015

0.0016

0.0017

20GHz

0.0014

0.0015

0.0017

0.0018

0.0019

0.0021

0.0023

0.0025

Dielectric Constant Temperature Coefficient

-55ºC～150ºC

PPM/℃

-150

-142

-130

-120

-110

-100

-92

-85

-80

Peel Strength

1 OZ F4BM

N/mm

>1.8

1 OZ F4BME

N/mm

>1.6

Volume Resistivity

Standard Condition

MΩ.cm

≥6×10^6

Surface Resistivity

Standard Condition

MΩ

≥1×10^6

Electrical Strength (Z direction)

5KW,500V/s

KV/mm

>23

>25

>28

>30

Breakdown Voltage (XY direction)

5KW,500V/s

>30

>32

>34

>35

>36

Coefficient of Thermal Expansion

XY direction

-55 º~288ºC

ppm/ºC

2,534

2,230

2,025

1,621

1,417

1,416

1,215

Z direction

-55 º~288ºC

ppm/ºC

240

205

187

173

142

112

Thermal Stress

260℃, 10s,3 times

No delamination

Water Absorption

20±2℃, 24 hours

≤0.08

Density

Room Temperature

g/cm3

2.17

2.18

2.20

2.22

2.25

2.28

2.29

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.24

0.28

0.30

0.33

0.36

0.38

0.41

0.42

PIM

Only applicable to F4BME

dBc

≤-159

Flammability

UL-94

V-0

Material Composition

PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

Our PCB Capability (F4BM )

PCB Capability (F4BM)
PCB Material:	PTFE glass fiber cloth copper clad laminates
Designation (F4BM )	F4BM	DK (10GHz)	DF (10 GHz)
	F4BM217	2.17±0.04	0.0010
	F4BM220	2.20±0.04	0.0010
	F4BM233	2.33±0.04	0.0011
	F4BM245	2.45±0.05	0.0012
	F4BM255	2.55±0.05	0.0013
	F4BM265	2.65±0.05	0.0013
	F4BM275	2.75±0.05	0.0015
	F4BM294	2.94±0.06	0.0016
	F4BM300	3.00±0.06	0.0017
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)	0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

A PCB and Typical Applications

Displayed on the screen is a 2-layer copper high-frequency PCB with a low DK of 2.2, utilizing F4BM material and HASL surface finish on a 3.0mm substrate.

F4BM high-frequency PCB finds applications in microwave, RF, and radar systems, as well as in phase shifters, passive components, power dividers, couplers, combiners, feed networks, phased array antennas, satellite communications, and base station antennas.

Final - F4BM series aluminum-based/copper-based boards

These F4BM series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with either aluminum-based material or copper-based , serving as shielding or heat dissipation purposes.

Model examples

F4BM220-AL represents F4BM220 with an aluminum-based substrate.

Quality Policy

Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.

Evaluation and Audit of Suppliers

Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.

Contract Evaluation

Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.

Making, audit and control of manufacturing data.

When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.

Incoming Material Quality Control

All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.

Control of Production Process

Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

Final Control and Inspection

All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.

Product Delivery Audit

We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.

FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.

Customer Service

We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.

Tags:

high speed pcb,

high frequency circuit design

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