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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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F4BTMS High Frequency PCB with buried 50Ω resistor copper foil

F4BTMS High Frequency PCB with buried 50Ω resistor copper foil

  • F4BTMS High Frequency PCB with buried 50Ω resistor copper foil
F4BTMS High Frequency PCB with buried 50Ω resistor copper foil
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0610-V6.10
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Board Material: Polyimide 50 µm ITEQ 60℃ Board Thickness: 0.25mm
Surface Cu Thickness: 35 µm Coverlay Colour: Yellow
Color Of Silkscreen: White Surface Finish: Immersion Gold
Function: 100% Pass Electrical Test

F4BTMS High Frequency PCB

Introduction

The F4BTMS series is an upgraded version of the F4BTM series. Building upon its foundation, significant technological advancements have been made in material formulation and manufacturing processes. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications, capable of replacing similar foreign products.

 

By incorporating a small amount of ultra-thin and ultra-fine fiberglass cloth reinforcement, along with a significant and uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the fiberglass effect during the propagation of electromagnetic waves is minimized, reducing dielectric loss and enhancing dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. The material also possesses excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.

 

The F4BTMS series comes standard with RTF low roughness copper foil, which not only reduces conductor loss but also provides excellent peel strength. It can be paired with copper-based or aluminum-based options.

 

F4BTMS294 can be combined with buried 50Ω resistor copper foil to create a resistor film substrate.

 

The circuit boards can be processed using standard PTFE board fabrication techniques, taking advantage of the excellent mechanical and physical properties of the material. They are suitable for multi-layer, high-layer-count, and backplane processing. Additionally, they exhibit excellent processability in dense hole and fine line routing.

 

Product Features

- Minimal dielectric constant tolerance and excellent batch-to-batch consistency.

- Extremely low dielectric loss.

- Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.

- Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.

- Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.

- Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.

- Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.

- Improved thermal conductivity, suitable for high-power applications.

- Excellent dimensional stability.

- Low water absorption.

 

Models & Data Sheet

Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTMS220 F4BTMS233 F4BTMS255 F4BTMS265 F4BTMS294 F4BTMS300 F4BTMS350 F4BTMS430 F4BTMS450 F4BTMS615 F4BTMS1000
Dielectric Constant (Typical) 10GHz / 2.2 2.33 2.55 2.65 2.94 3.00 3.50 4.30 4.50 6.15 10.20
Dielectric Constant Tolerance / / ±0.02 ±0.03 ±0.04 ±0.04 ±0.04 ±0.04 ±0.05 ±0.09 ±0.09 ±0.12 ±0.2
Dielectric Constant (Design) 10GHz / 2.2 2.33 2.55 2.65 2.94 3.0 3.50 4.3 4.5 6.15 10.2
Loss Tangent (Typical) 10GHz / 0.0009 0.0010 0.0012 0.0012 0.0012 0.0013 0.0016 0.0015 0.0015 0.0020 0.0020
20GHz / 0.0010 0.0011 0.0013 0.0014 0.0014 0.0015 0.0019 0.0019 0.0019 0.0023 0.0023
40GHz / 0.0013 0.0015 0.0016 0.0018 0.0018 0.0019 0.0024 0.0024 0.0024 / /
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -130 -122 -92 -88 -20 -20 -39 -60 -58 -96 -320
Peel Strength 1 OZ RTF copper N/mm >2.4 >2.4 >1.8 >1.8 >1.2 >1.2 >1.2 >1.2 >1.2 >1.2 >1.2
Volume Resistivity Standard Condition MΩ.cm ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8
Surface Resistivity Standard Condition ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >34 >40 >40 >42 >44 >45 >48 >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >35 >38 >40 >42 >48 >52 >55 >52 >54 >55 >42
Coefficientof Thermal Expansion (X, Y direction) -55 º~288ºC ppm/ºC 40, 50 35, 40 15, 20 15, 20 10, 12 10, 11 10, 12 13, 12 12, 12 10, 12 16, 18
Coefficientof Thermal Expansion (Z direction) -55 º~288ºC ppm/ºC 290 220 80 72 22 22 20 47 45 40 32
Thermal Stress 260℃, 10s,3 times / No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % 0.02 0.02 0.025 0.025 0.02 0.025 0.03 0.08 0.08 0.1 0.03
Density Room Temperature g/cm3 2.18 2.22 2.26 2.26 2.25 2.28 2.3 2.51 2.53 2.75 3.2
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.26 0.28 0.31 0.36 0.58 0.58 0.6 0.63 0.64 0.67 0.81
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.

 

Our PCB Capability (F4BTMS)

PCB Capability (F4BTMS)
PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.
Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz)
F4BTMS220 2.2±0.02 0.0009
F4BTMS233 2.33±0.03 0.0010
F4BTMS255 2.55±0.04 0.0012
F4BTMS265 2.65±0.04 0.0012
F4BTMS294 2.94±0.04 0.0012
F4BTMS300 3.0±0.04 0.0013
F4BTMS350 3.5±0.05 0.0016
F4BTMS430 4.3±0.09 0.0015
F4BTMS450 4.5±0.09 0.0015
F4BTMS615 6.15±0.12 0.0020
F4BTMS1000 10.2±0.2 0.0020
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

A F4BTMS PCB and Typical Applications:

Presented on the screen is an F4BTMS high-frequency PCB, utilizing a 3.2mm substrate with HASL coating on the pads. F4BTMS PCBs are extensively employed in various domains, including:

 

  • Aerospace and aviation equipment, space installations, and cabin setups.
  • Microwave and RF applications.
  • Radar systems, particularly in military applications.
  • Feed networks for signal distribution.
  • Phase-sensitive antennas and phased array antennas.
  • Satellite communications, and much more.

F4BTMS High Frequency PCB with buried 50Ω resistor copper foil 0

 

Final (F4BTMS series aluminum-based/copper-based boards)

This series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based or copper-based layer. This configuration serves as shielding or heat dissipation.

 

The model numbers are F4BTMS***-AL or F4BTMS***-CU. For example,

F4BTMS220-AL represents F4BTMS220 with aluminum-based substrate.

F4BTMS294-CU represents F4BTMS294 with copper-based substrate.

F4BTMS High Frequency PCB with buried 50Ω resistor copper foil 1

F4BTMS High Frequency PCB with buried 50Ω resistor copper foil 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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