TSM-DS3 High Frequency PCB Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB with Immersion Gold

TSM-DS3 High Frequency Printed Circuit Board

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Material Introduction

TSM-DS3 is an exceptional thermally stable material that boasts industry-leading low loss properties with a dissipation factor (DF) of 0.0011 at 10 GHz. It offers the predictability and consistency comparable to the best fiberglass reinforced epoxies available in the market.

TSM-DS3 stands out as a ceramic-filled reinforced material with a remarkably low fiberglass content of approximately 5%. This unique composition allows it to rival epoxies in fabricating large format complex multilayers, making it an ideal choice for demanding applications.

One of the key highlights of TSM-DS3 is its suitability for high power applications. With a high thermal conductivity (TC) of 0.65 W/m*K, this material efficiently conducts heat away from other heat sources in a printed wiring board (PWB) design. This capability ensures effective heat dissipation and helps maintain optimal performance in high-power scenarios.

Moreover, TSM-DS3 has been developed to exhibit very low coefficients of thermal expansion, making it highly suitable for applications that undergo demanding thermal cycling. This exceptional feature enhances the material's performance and reliability, providing stability even in environments with significant temperature variations.

Features

1.TSM-DS3 offers an industry-leading dissipation factor (DF) of 0.0011 at 10GHz

2. With high thermal conductivity, TSM-DS3 effectively conducts heat away from heat sources.

3.The material has a low fiberglass content of approximately 5%.

4.TSM-DS3 exhibits dimensional stability comparable to epoxy materials.

5. It enables the fabrication of large format, high layer count printed wiring boards (PWBs) with complex designs.

6. The material allows for the successful construction of complex PCBs with high yield and consistent performance.

7. TSM-DS3 maintains stable dielectric constant (DK) within +/- 0.25 across a wide temperature range (-30 °C to 120 °C).

8. It is compatible with resistor foils, expanding its range of applications.

Typical Applications

TSM-DS3 finds application in various fields, including:

1. Couplers

• Phased Array Antennas
• Radar Manifolds
• mmWave Antennas
• Oil Drilling
• Semiconductor / Automatic Test Equipment (ATE) Testing

Our PCB Capability (TSM-DS3)

TSM-DS3 Typical Values