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TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold
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TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold
  • name
  • name

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise
Certification
UL
Model Number
BIC-293-V2.93
Number Of Layers:
4
Board Material:
Polyimide 25µm
Surface Cu Thickness:
1.0
Board Thickness:
0.20 Mm +/-10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Yellow Coverlay / Green Solder Mask
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This board is a 2-layer rigid PCB with specific construction details and specifications. The board utilizes copper layers on both sides, each with a thickness of 35 μm. The core material used is Taconic TSM-DS3 with a thickness of 0.762 mm (30mil). The overall finished board thickness is 0.88mm.

 

The board has dimensions of 120mm x 75mm with a tolerance of +/- 0.15mm. The minimum trace/space is 7/8 mils, indicating the minimum width of conductive traces and the minimum spacing between them. The minimum hole size is 0.3mm.

 

The finished copper weight is 1oz (1.4 mils) on the outer layers and the via plating thickness is 20 μm. The surface finish is immersion gold, providing a protective and conductive layer on the surface of the PCB.

 

The board has a black top silkscreen and there is no bottom silkscreen or top/bottom solder mask. The boards undergo a 100% electrical test to ensure its functionality prior to shipment.

 

插入STAKCUP图片

 

PCB Specifications

PCB SIZE 120 x 75mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
TSM-DS3 0.762mm
copper ------- 18um(0.5oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 7 mil / 8 mil
Minimum / Maximum Holes: 0.3 mm / 2.5 mm
Number of Different Holes: 11
Number of Drill Holes: 72
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Ceramic-filled Fiberglass TSM-DS3
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.88 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold, 49%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Top Side
Colour of Component Legend Black
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94 V0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold 0

 

Our PCB Capability (2024)

Factory Process Capability (2024)
Substrate Types and Brands Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115
Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.
Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;
F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;
F4BTM298, F4BTM300, F4BTM320, F4BTM350;
F4BTME298, F4BTME300, F4BTME320, F4BTME350;
TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;
TF300, TF440, TF600, TF960, TF1020, TF1600;
F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;
TFA294, TFA300, TFA615, TFA1020;
WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615. Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size 1200mm x 572 mm
Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness 10.0 mm
Blind Buried Holes (Non-crossing) 0.1mm
Maximum Hole Aspect Ratio 15:01
Minimum Mechanical Drill Hole Diameter 0.1 mm
Through-hole Tolerance +/- 0.0762 mm
Press-fit Hole Tolerance +/- 0.05mm
Non-plated Copper Hole Tolerance +/- 0.05mm
Maximum Number of Layers 32
Internal and External Layer Maximum Copper Thickness 12Oz
Minimum Drill Hole Tolerance +/- 2mil
Minimum Layer-to-Layer Tolerance +/- 3mil
Minimum Line Width/Spacing 3mil/3mil
Minimum BGA Diameter 8mil
Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.

 

 

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold 1

 

Tags: 

high speed pcb,  

high frequency circuit design

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold
  • name
  • name
TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise
Certification
UL
Model Number
BIC-293-V2.93
Number Of Layers:
4
Board Material:
Polyimide 25µm
Surface Cu Thickness:
1.0
Board Thickness:
0.20 Mm +/-10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Yellow Coverlay / Green Solder Mask
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This board is a 2-layer rigid PCB with specific construction details and specifications. The board utilizes copper layers on both sides, each with a thickness of 35 μm. The core material used is Taconic TSM-DS3 with a thickness of 0.762 mm (30mil). The overall finished board thickness is 0.88mm.

 

The board has dimensions of 120mm x 75mm with a tolerance of +/- 0.15mm. The minimum trace/space is 7/8 mils, indicating the minimum width of conductive traces and the minimum spacing between them. The minimum hole size is 0.3mm.

 

The finished copper weight is 1oz (1.4 mils) on the outer layers and the via plating thickness is 20 μm. The surface finish is immersion gold, providing a protective and conductive layer on the surface of the PCB.

 

The board has a black top silkscreen and there is no bottom silkscreen or top/bottom solder mask. The boards undergo a 100% electrical test to ensure its functionality prior to shipment.

 

插入STAKCUP图片

 

PCB Specifications

PCB SIZE 120 x 75mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
TSM-DS3 0.762mm
copper ------- 18um(0.5oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 7 mil / 8 mil
Minimum / Maximum Holes: 0.3 mm / 2.5 mm
Number of Different Holes: 11
Number of Drill Holes: 72
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Ceramic-filled Fiberglass TSM-DS3
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.88 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold, 49%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Top Side
Colour of Component Legend Black
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94 V0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold 0

 

Our PCB Capability (2024)

Factory Process Capability (2024)
Substrate Types and Brands Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115
Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.
Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;
F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;
F4BTM298, F4BTM300, F4BTM320, F4BTM350;
F4BTME298, F4BTME300, F4BTME320, F4BTME350;
TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;
TF300, TF440, TF600, TF960, TF1020, TF1600;
F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;
TFA294, TFA300, TFA615, TFA1020;
WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615. Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size 1200mm x 572 mm
Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness 10.0 mm
Blind Buried Holes (Non-crossing) 0.1mm
Maximum Hole Aspect Ratio 15:01
Minimum Mechanical Drill Hole Diameter 0.1 mm
Through-hole Tolerance +/- 0.0762 mm
Press-fit Hole Tolerance +/- 0.05mm
Non-plated Copper Hole Tolerance +/- 0.05mm
Maximum Number of Layers 32
Internal and External Layer Maximum Copper Thickness 12Oz
Minimum Drill Hole Tolerance +/- 2mil
Minimum Layer-to-Layer Tolerance +/- 3mil
Minimum Line Width/Spacing 3mil/3mil
Minimum BGA Diameter 8mil
Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.

 

 

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold 1

 

Tags: 

high speed pcb,

high frequency circuit design

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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