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TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.
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TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.
  • name
  • name

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-156-V1.00
Number Of Layers:
2
Glass Epoxy:
TMM3
Final Foil:
1.0
Final Height Of PCB:
0.6 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
N/A
Colour Of Component Legend:
N/A
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T
Supply Ability:
50000 pieces per month
Product Description

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This is a type of double layer high frequency PCB which is built on 20mil TMM3 substrate. It’s with immersion gold, 1oz copper(finished). Green solder mask is printed on top layer and bottom layer is open to air. This mini PCB is manufactured as per IPC class 3, every 50 boards are packed for shipment. It’s for the application of patch antennas.

 

PCB Specifications

PCB SIZE 35 x 51mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM3 0.508mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.40 mm / 2.50 mm
Number of Different Holes: 3
Number of Drill Holes: 3
Number of Milled Slots: 0
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TMM3 0.508mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.68 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold, 99%
Solder Mask Apply To: Top Layer
Solder Mask Color: Green
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.40mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

 

Typical Applications

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

Our PCB Capability(TMM3)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM3
Dielectric constant: 3.27
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

 

Data Sheet of TMM3

Property TMM3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.27±0.032 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 3.45 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +37 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 109 - Mohm.cm - ASTM D257
Surface Resistivity >9x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 441 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 15 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 15 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 23 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 16.53 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.72 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.12
Specific Gravity 1.78 - - A ASTM D792
Specific Heat Capacity 0.87 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

 

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. 0

 

Tags: 

high speed pcb,  

high frequency circuit design

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.
  • name
  • name
TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-156-V1.00
Number Of Layers:
2
Glass Epoxy:
TMM3
Final Foil:
1.0
Final Height Of PCB:
0.6 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
N/A
Colour Of Component Legend:
N/A
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T
Supply Ability:
50000 pieces per month
Product Description

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This is a type of double layer high frequency PCB which is built on 20mil TMM3 substrate. It’s with immersion gold, 1oz copper(finished). Green solder mask is printed on top layer and bottom layer is open to air. This mini PCB is manufactured as per IPC class 3, every 50 boards are packed for shipment. It’s for the application of patch antennas.

 

PCB Specifications

PCB SIZE 35 x 51mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM3 0.508mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.40 mm / 2.50 mm
Number of Different Holes: 3
Number of Drill Holes: 3
Number of Milled Slots: 0
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TMM3 0.508mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.68 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold, 99%
Solder Mask Apply To: Top Layer
Solder Mask Color: Green
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.40mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

 

Typical Applications

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

Our PCB Capability(TMM3)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM3
Dielectric constant: 3.27
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

 

Data Sheet of TMM3

Property TMM3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.27±0.032 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 3.45 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +37 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 109 - Mohm.cm - ASTM D257
Surface Resistivity >9x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 441 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 15 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 15 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 23 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 16.53 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.72 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.12
Specific Gravity 1.78 - - A ASTM D792
Specific Heat Capacity 0.87 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

 

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. 0

 

Tags: 

high speed pcb,

high frequency circuit design

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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