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RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
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RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
  • name
  • name

RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications

MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-136-V0.24
Number Of Layers:
2
Glass Epoxy:
RO4350B LoPro 30.7mil (0.78mm), Tg 288℃
Final Foil:
1 Oz
Final Height Of PCB:
0.9 Mm ±10%
Surface Finish:
Immersion Gold 0.025µm Over 3µm Nickel
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-8.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

 

 

 

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4350B LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4350B LoPro
Dielectric constant: 3.48±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

 

Typical Properties of RO4350B LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.48 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.55 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0037 0.0031 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 50 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 X 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 11473(1664) Y MPa(kpsi) RT ASTM D638
Tensile Strength 175(25.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 255(37)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 14 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
16 y
35 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 390   °C TGA   ASTM D3850
Thermal Conductivity 0.62   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.86   gm/cm3 23°C ASTM D792
Copper Peel Strength 0.88(5.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 0
 
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 1
 
Tags: 

high speed pcb,  

high frequency circuit design

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
  • name
  • name
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-136-V0.24
Number Of Layers:
2
Glass Epoxy:
RO4350B LoPro 30.7mil (0.78mm), Tg 288℃
Final Foil:
1 Oz
Final Height Of PCB:
0.9 Mm ±10%
Surface Finish:
Immersion Gold 0.025µm Over 3µm Nickel
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-8.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

 

 

 

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4350B LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4350B LoPro
Dielectric constant: 3.48±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

 

Typical Properties of RO4350B LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.48 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.55 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0037 0.0031 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 50 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 X 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 11473(1664) Y MPa(kpsi) RT ASTM D638
Tensile Strength 175(25.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 255(37)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 14 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
16 y
35 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 390   °C TGA   ASTM D3850
Thermal Conductivity 0.62   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.86   gm/cm3 23°C ASTM D792
Copper Peel Strength 0.88(5.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 0
 
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 1
 
Tags: 

high speed pcb,

high frequency circuit design

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Tel: 86-755-27374847
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