products
PRODUCTS DETAILS
Home > Products >
Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Contact Us
Contact Now
Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers
  • name
  • name

Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers

MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-128-V2.0
Number Of Layers:
2
Glass Epoxy:
RT/duroid 6035HTC
Final Foil:
1.0 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
ENIG
Solder Mask Color:
Green
Colour Of Component Legend:
NO
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-8.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and

copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

 

 

 

Features/Benefits:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

 

2. Low loss tangent

Excellent high frequency performance

 

3. Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

 

4. Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

 

Some Typical Applications:

1. High Power RF and Microwave Amplifiers

2. Power Amplifiers, Couplers, Filters

3. Combiners, Power Dividers

 

 

 

PCB Capability (RT/duroid 6035HTC)

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RT/duroid 6035HTC

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   MΩ A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 
 
Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers 0
 
Tags: 

high speed pcb,  

high frequency circuit design

Recommended Products
F4BTME High Frequency PCB with reverse-treated (RTF) copper foil

F4BTME High Frequency PCB with reverse-treated (RTF) copper foil

Contact Now
F4BTM High Frequency PCB Built On formulating fiberglass cloth With aluminum-based or copper-based

F4BTM High Frequency PCB Built On formulating fiberglass cloth With aluminum-based or copper-based

Contact Now
TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement

TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement

Contact Now
F4BME High Frequency PCB with reverse-treated foil (RTF) copper foil DK 2.17 to 3.0

F4BME High Frequency PCB with reverse-treated foil (RTF) copper foil DK 2.17 to 3.0

Contact Now
F4BM High Frequency PCB with 0.5oz 1oz 2oz copper and HASL surface finish

F4BM High Frequency PCB with 0.5oz 1oz 2oz copper and HASL surface finish

Contact Now
TF High Frequency PCB the smooth surface material without copper cladding

TF High Frequency PCB the smooth surface material without copper cladding

Contact Now
WL-CT High Frequency PCB|High TG value above 280°C|double-sided 1.6mm WL-CT338 PCB with immersion gold coating

WL-CT High Frequency PCB|High TG value above 280°C|double-sided 1.6mm WL-CT338 PCB with immersion gold coating

Contact Now
TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

Contact Now
TSM-DS3 High Frequency PCB Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB with Immersion Gold

TSM-DS3 High Frequency PCB Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB with Immersion Gold

Contact Now
RO3003G2 High Frequency PCB Built on 10mil 0.254mm substrates with Immersion Gold

RO3003G2 High Frequency PCB Built on 10mil 0.254mm substrates with Immersion Gold

Contact Now
RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL

RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL

Contact Now
products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers
  • name
  • name
Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers
MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-128-V2.0
Number Of Layers:
2
Glass Epoxy:
RT/duroid 6035HTC
Final Foil:
1.0 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
ENIG
Solder Mask Color:
Green
Colour Of Component Legend:
NO
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-8.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and

copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

 

 

 

Features/Benefits:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

 

2. Low loss tangent

Excellent high frequency performance

 

3. Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

 

4. Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

 

Some Typical Applications:

1. High Power RF and Microwave Amplifiers

2. Power Amplifiers, Couplers, Filters

3. Combiners, Power Dividers

 

 

 

PCB Capability (RT/duroid 6035HTC)

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RT/duroid 6035HTC

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   MΩ A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 
 
Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers 0
 
Tags: 

high speed pcb,

high frequency circuit design

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
Sitemap |  Privacy Policy | China Good Quality Newly Shipped RF PCB Supplier. Copyright © 2016-2024 Shenzhen Bicheng Electronics Technology Co., Ltd . All Rights Reserved.