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Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers
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Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers
  • name
  • name

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-126-V1.0
Number Of Layers:
2 Layers
Glass Epoxy:
RT/duroid 6035HTC
Board Thick:
0.6 Mm ±0.1
Outer Copper Thick:
1 Oz
Inner Copper Thick:
1 Oz
Surface Finish:
Immersion Gold (23.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color:
Green, PSR-2000GT600D, Taiyo Supplied.
Colour Of Component Legend:
White, IJR-4000 MW300, Taiyo Brand
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers​
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and
copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.
 

 
Features/Benefits:
1. High Thermal conductivity
Improved dielectric heat dissipation enables lower operating temperatures for high power applications

  • Low loss tangent

Excellent high frequency performance

  • Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

  • Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials
 
 
Some Typical Applications:
1. High Power RF and Microwave Amplifiers

  • Power Amplifiers, Couplers, Filters
  • Combiners, Power Dividers


 
PCB Capability (RT/duroid 6035HTC)

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 
Data Sheet of RT/duroid 6035HTC

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   MΩ A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers 0
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers 1

Tags: 

high speed pcb,  

high frequency circuit design

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers
  • name
  • name
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-126-V1.0
Number Of Layers:
2 Layers
Glass Epoxy:
RT/duroid 6035HTC
Board Thick:
0.6 Mm ±0.1
Outer Copper Thick:
1 Oz
Inner Copper Thick:
1 Oz
Surface Finish:
Immersion Gold (23.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color:
Green, PSR-2000GT600D, Taiyo Supplied.
Colour Of Component Legend:
White, IJR-4000 MW300, Taiyo Brand
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers​
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and
copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.
 

 
Features/Benefits:
1. High Thermal conductivity
Improved dielectric heat dissipation enables lower operating temperatures for high power applications

  • Low loss tangent

Excellent high frequency performance

  • Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

  • Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials
 
 
Some Typical Applications:
1. High Power RF and Microwave Amplifiers

  • Power Amplifiers, Couplers, Filters
  • Combiners, Power Dividers


 
PCB Capability (RT/duroid 6035HTC)

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 
Data Sheet of RT/duroid 6035HTC

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   MΩ A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers 0
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers 1

Tags: 

high speed pcb,

high frequency circuit design

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6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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