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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers

  • Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers
  • Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers
  • Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers
  • Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-126-V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 2 Layers Glass Epoxy: RT/duroid 6035HTC
Board Thick: 0.6 Mm ±0.1 Outer Copper Thick: 1 Oz
Inner Copper Thick: 1 Oz Surface Finish: Immersion Gold (23.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied. Colour Of Component Legend: White, IJR-4000 MW300, Taiyo Brand
Test: 100% Electrical Test Prior Shipment

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for Power Amplifiers​
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and
copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.
 
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers 0
 
Features/Benefits:
1. High Thermal conductivity
Improved dielectric heat dissipation enables lower operating temperatures for high power applications

  • Low loss tangent

Excellent high frequency performance

  • Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

  • Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials
 
 
Some Typical Applications:
1. High Power RF and Microwave Amplifiers

  • Power Amplifiers, Couplers, Filters
  • Combiners, Power Dividers

Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers 1
 
PCB Capability (RT/duroid 6035HTC)

PCB Material:Ceramic-filled PTFE composites
Designation:RT/duroid 6035HTC
Dielectric constant:3.50±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 
Data Sheet of RT/duroid 6035HTC

PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z 8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108 MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108 AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06 %D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44 W/m/k80℃ASTM C518
Density2.2 gm/cm323℃ASTM D792
Copper Peel Stength7.9 pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-Free Process CompatibleYes    

 
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers 2
Rogers 6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold  for Power Amplifiers 3

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Other Products
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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