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Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

MOQ: 1
Price: USD 2.88-6.99 per piece
Standard Packaging: Vacuum
Delivery Period: 4-5 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0057-V2.8
Number Of Layers:
2
Glass Epoxy:
RO3210
Final Height Of PCB:
1.3mm ±0.1
Final Foil External:
1 Oz
Surface Finish:
Immersion Ni/Au
Solder Mask Color:
N/A
Colour Of Component Legend:
N/A
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.88-6.99 per piece
Packaging Details:
Vacuum
Delivery Time:
4-5 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.

 

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas 0

 

Typical applications:

1. Automotive collision avoidance systems

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellites

6. LMDS and wireless broadband

7. Microstrip patch antennas

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems

 

 

PCB Specifications

PCB SIZE 102 x 102mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18µm(0.5 oz)+plate TOP layer
RO3210 1.270mm
copper ------- 18µm(0.5 oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 6 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 2.5 mm
Number of Different Holes: 8
Number of Drill Holes: 32
Number of Milled Slots: 0
Number of Internal Cutouts: NO
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3210 1.270mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 1.3 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas 1

 

Data Sheet of Rogers 3210 (RO3210)

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
 
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Stength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
 
 
Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas 2
 
products
PRODUCTS DETAILS
Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas
MOQ: 1
Price: USD 2.88-6.99 per piece
Standard Packaging: Vacuum
Delivery Period: 4-5 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0057-V2.8
Number Of Layers:
2
Glass Epoxy:
RO3210
Final Height Of PCB:
1.3mm ±0.1
Final Foil External:
1 Oz
Surface Finish:
Immersion Ni/Au
Solder Mask Color:
N/A
Colour Of Component Legend:
N/A
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.88-6.99 per piece
Packaging Details:
Vacuum
Delivery Time:
4-5 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.

 

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas 0

 

Typical applications:

1. Automotive collision avoidance systems

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellites

6. LMDS and wireless broadband

7. Microstrip patch antennas

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems

 

 

PCB Specifications

PCB SIZE 102 x 102mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18µm(0.5 oz)+plate TOP layer
RO3210 1.270mm
copper ------- 18µm(0.5 oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 6 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 2.5 mm
Number of Different Holes: 8
Number of Drill Holes: 32
Number of Milled Slots: 0
Number of Internal Cutouts: NO
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3210 1.270mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 1.3 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas 1

 

Data Sheet of Rogers 3210 (RO3210)

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
 
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Stength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
 
 
Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas 2
 
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