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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold

Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold

  • Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold
  • Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold
Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0188-V1.08
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T
Supply Ability: 50000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO4534
Final Foil: 1 Oz Final Height Of PCB: 0.6 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This is a type of antenna high frequency PCB which is built on Rogers RO4534 with 20mil substrate, starting 0.5oz copper, finished with 1oz copper. It contains fine lines with 4mil wide and microvias with 0.2mm diameter. The surface finish on pads is immersion gold with 0.05micron gold, green solder mask and white silkscreen legends. It is a double layer board fabricated as per IPC class 2, and every 50 pieces are vacuum-packed for shipment.

 

PCB Specifications

PCB SIZE 88 x 98mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
Rogers RO4534 0.508mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.2 mm / 3.5 mm
Number of Different Holes: 12
Number of Drill Holes: 895
Number of Milled Slots: 2
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: Rogers RO4534 0.508mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.6 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion Gold, 35%
Solder Mask Apply To: Both Sides
Solder Mask Color: Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Component Side
Colour of Component Legend White
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.2mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold 0

 

Our PCB Capabilities(2022)

Parameter Value
 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space 0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

 

Our Advantages

1. Wide range of high frequency materials, Rogers, Taconic and Wangling etc;

2. More than 19+ years’ high frequency PCB experience;

3. Strict WIP inspection and monitoring as well as working instruction;

4. 16000㎡ workshop;

5. 30000㎡ output capability per month;

6. 8000 types of PCB's per month;

7. Small quantity order is available;

8. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

9. IPC Class 2 / IPC Class 3;

10. Delivery on time: >98%, Customer complaint rate: <1%

 

Appendix: Typical Value of RO4534

Property RO4534 Direction Units Condition Test Method
Dielectric Constant, er Process 3.4 ± 0.08 Z - 10 GHz/23 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0022 Z - 2.5 GHz/23 IPC-TM-650, 2.5.5.5
0.0027 10 GHz/23
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.3 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 11 X ppm/ -55 to 288 IPC-TM-650, 2.4.41
14 Y
46 Z
Thermal Conductivity 0.6 - W/(m.K) 80 ASTM C518
Moisture Absorption 0.06 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.3 (1.1) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -
 
Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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