High-frequency TMM13i Dk of 12.85 Microwave ceramic thermoset polymer composite Material & Custom 2-layer PCB

Product Description

1. TMM13i Material Overview

Rogers TMM13i is an isotropic thermoset microwave laminate engineered for high-reliability plated-through-hole (PTH) stripline and microstrip applications. It is a ceramic-filled hydrocarbon thermoset polymer composite that combines many of the desirable electrical and mechanical properties of ceramic substrates with the processing convenience of traditional PTFE-based microwave laminates—without requiring specialized production techniques.

 

 

TMM10i Typical Value
Property		TMM10i	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.80±0.245	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.9	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-43	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		267	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		19	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ℃	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		-	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.8	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.13
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.72	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

 

 

2. Core Advantages & Benefits

TMM13i delivers a unique combination of performance and processability, making it an ideal choice for demanding microwave applications:

 

Stable High Dk (12.85 ± 0.35): Ideal for circuit miniaturization and single-material system designs across a wide range of applications.

 

Low Dissipation Factor (0.0019 @ 10 GHz): Ensures low insertion loss and high signal integrity at microwave frequencies.

 

Excellent Thermal Stability: The ultra-low TCDk (-70 ppm/°K) guarantees consistent electrical performance across temperature variations.

 

Copper-Matched CTE (19/19/20 ppm/°C): Matches the thermal expansion of copper, significantly improving plated-through-hole reliability and reducing etch shrinkage.

 

Superior Mechanical Properties: Resists creep and cold flow, ensuring long-term dimensional stability.

 

Chemical Resistance: Withstands common PCB etchants and solvents, minimizing fabrication damage.

 

Simplified Processing: Does not require sodium naphthanate treatment before electroless plating, unlike many PTFE-based materials.

 

Thermoset Resin System: Does not soften when heated, enabling reliable wire bonding without pad lifting or substrate deformation.

 

High Thermal Conductivity: Approximately twice that of traditional PTFE/ceramic laminates, facilitating efficient heat dissipation from power circuits.

 

 

3. Custom 2-Layer PCB Solution on TMM13i

Leveraging the exceptional properties of TMM13i, we offer the following precision-engineered 2-layer rigid PCB solution, suitable for a broad range of high-frequency and high-reliability applications.

 

 

PCB Construction Details

Parameter	Specification
Base Material	Rogers TMM13i
Number of Layers	2
Finished Board Size	89.65 mm × 45.27 mm (per panel)
Finished Board Thickness	0.6 mm
Minimum Trace / Space	5 / 8 mils
Minimum Hole Size	0.25 mm (through-hole only; no blind vias)
Outer Layer Copper Weight	1 oz (35 μm)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% prior to shipment
Accepted Standard	IPC-Class-2
Artwork Format	Gerber RS-274-X
Global Availability	Worldwide shipping

 

 

Design & Manufacturing Highlights:

 

Precision Patterning: With support for 5/8 mil trace/space and 0.25 mm micro-vias, our process accommodates dense, high-frequency circuit layouts.

 

Optimized Stackup: The 0.508 mm substrate thickness combined with 35 μm copper on both sides provides an excellent foundation for controlled impedance designs (e.g., 50Ω microstrip or stripline).

 

Reliable Interconnects: The Immersion Gold finish delivers a flat, oxidation-resistant, and highly solderable surface, ensuring robust component attachment and wire-bonding performance.

 

Strict Quality Control: Every board is subjected to 100% electrical testing and manufactured in compliance with IPC-Class-2, guaranteeing consistent quality and field reliability.

 

 

4. Typical Applications

The combination of TMM13i's electrical stability and mechanical robustness makes it ideal for the following applications:

 

RF & Microwave Circuits: Power amplifiers, combiners, filters, and couplers.

 

Satellite Communication Systems: High-frequency signal processing modules.

 

Antenna Systems: GPS antennas, patch antennas, phased-array antennas.

 

Test & Measurement: Chip testers and RF probe interfaces.

 

Advanced Components: Dielectric polarizers, lenses, and beamforming networks.

 

 

5. Conclusion

As a specialized high-frequency PCB supplier, we combine the advanced material performance of Rogers TMM13i with our precision manufacturing capabilities to deliver custom, high-reliability circuit solutions to customers across the globe. Our 2-layer PCB offering fully harnesses TMM13i's advantages in dielectric stability, thermal management, and mechanical strength, ensuring your designs meet the most demanding performance requirements.

 

We are committed to supporting your innovation in wireless communications, aerospace, and RF systems. For technical inquiries, samples, or volume orders, please contact us today. We look forward to partnering with you on your next high-frequency project.