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2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish

2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RT/duroid® 6006 PCB
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

2-Layer RT/duroid® 6006 PCB | 10mil Core | Immersion Silver Finish

 

 

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RT/duroid® 6006 high-frequency laminate. As a ceramic-PTFE composite specifically engineered for electronic and microwave circuit applications requiring a high dielectric constant, this material enables significant circuit size reduction while maintaining excellent electrical performance.

 

2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish 0

 

The board is supplied as two types (2 pieces) with dimensions of 134.8mm x 78.65mm per piece, dimensional tolerance of ±0.15mm. Finished board thickness is 0.4mm (including 10mil core + 2 x 35μm copper). Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.

 

This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The Immersion Silver surface finish provides excellent solderability, low contact resistance, and superior RF performance, making it particularly suitable for high-frequency and RF applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

 

 

PCB General Specifications

Parameter Detail
Layer Count 2-Layer Rigid
Base Material Rogers RT/duroid® 6006 (Ceramic-PTFE composite)
Board Dimensions 134.8mm x 78.65mm (2 types = 2 PCBs) ±0.15mm
Finished Thickness 0.4mm
Core Thickness 10mil (0.254mm)
Min. Trace / Space 5 / 6 mils
Min. Hole Size 0.3mm
Blind Vias None
Finished Cu Weight 1 oz (1.4 mils / 35μm) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Silver
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2
Availability Worldwide
Components / Pads / Vias / Nets 46 / 64 / 41 / 2

 

 

Material Advantages: RT/duroid® 6006

The RT/duroid® 6006 microwave laminates from Rogers Corporation are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. With a Dk value of 6.15, these laminates enable significant circuit size reduction while maintaining excellent high-frequency performance.

 

2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish 1

 

Key material highlights:

Ceramic-PTFE composite construction provides a unique balance of electrical and mechanical properties

 

Tight dielectric constant and thickness control ensures repeatable circuit performance across production lots

 

Low moisture absorption (0.05%) maintains stable electrical properties in humid environments

 

Excellent thermal mechanical stability supports reliable operation across a wide temperature range

 

High thermal decomposition temperature (Td > 500°C) offers exceptional thermal stability

 

The material is supplied clad both sides with electrodeposited copper foil. The combination of high Dk and low loss makes RT/duroid 6006 ideal for operating at X-band frequencies and below. Standard dielectric thicknesses include 0.010", 0.025", 0.050", 0.075", and 0.100", with additional thicknesses available upon request.

 

 

RT/duroid® 6006 Material Properties

Property Test Condition Value Benefit
Dielectric Constant (εr) Process 10 GHz / 23°C 6.15 ±0.15 High Dk enables circuit size reduction
Dielectric Constant (εr) Design 8 GHz to 40 GHz 6.45 Accurate design for broadband applications
Dissipation Factor (tan δ) 10 GHz / 23°C 0.0027 Low loss, ideal for X-band and below
TCDk (Thermal Coefficient of εr) -50°C to +170°C -410 ppm/°C Predictable performance across temperature
Surface Resistivity COND A 7 × 10⁷ MΩ Clean signal integrity
Volume Resistivity COND A 2 × 10⁷ MΩ·cm High insulation resistance
CTE (X-axis) -55°C to +288°C 47 ppm/°C Dimensional stability
CTE (Y-axis) -55°C to +288°C 34 ppm/°C Dimensional stability
CTE (Z-axis) -55°C to +288°C 117 ppm/°C Reliable PTH performance
Thermal Conductivity 80°C 0.49 W/(m·K) Basic heat dissipation
Moisture Absorption D48/50°C, 0.050" thick 0.05% Stable in humid environments
Density 2.7 g/cm³ High ceramic content
Td (Thermal Decomposition) TGA >500°C Excellent thermal stability
Copper Peel Strength After solder float 2.5 N/mm (14.3 pli) Reliable copper adhesion
Flammability Rating UL 94 V-0 Fire safety compliant
Lead-Free Process Compatible Yes Ready for modern assembly

 

 

PCB Stackup & Construction

The board features a thin, high-performance 2-layer stackup:

 

Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper

 

Dielectric Core: Rogers RT/duroid® 6006 – 10mil (0.254mm)

 

Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper

 

Total Finished Thickness: 0.4mm

 

Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 46 components, 64 total pads (26 thru-hole, 38 top SMT), 41 vias, and 2 nets.

 

Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.

 

 

Typical Applications

Thanks to its high Dk (6.15), low loss, and stable electrical properties, this PCB is ideally suited for:

Patch antennas

Satellite communications systems

Power amplifiers

Aircraft collision avoidance systems

Ground radar warning systems

Electronic and microwave circuits requiring high dielectric constant

 

 

Available Configurations

RT/duroid 6006 laminates are available with standard dielectric thicknesses of 0.010", 0.025", 0.050", 0.075", and 0.100" (0.254, 0.635, 1.270, 1.905, 2.54 mm). Copper cladding options range from ½ oz. to 2 oz./ft² (18 to 70 μm), including standard and reverse-treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may also be specified. Standard panel sizes include 10"x10", 10"x20", and 18"x12", with additional sizes available upon request.

 

 

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.

 

Products
PRODUCTS DETAILS
2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RT/duroid® 6006 PCB
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

2-Layer RT/duroid® 6006 PCB | 10mil Core | Immersion Silver Finish

 

 

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RT/duroid® 6006 high-frequency laminate. As a ceramic-PTFE composite specifically engineered for electronic and microwave circuit applications requiring a high dielectric constant, this material enables significant circuit size reduction while maintaining excellent electrical performance.

 

2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish 0

 

The board is supplied as two types (2 pieces) with dimensions of 134.8mm x 78.65mm per piece, dimensional tolerance of ±0.15mm. Finished board thickness is 0.4mm (including 10mil core + 2 x 35μm copper). Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.

 

This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The Immersion Silver surface finish provides excellent solderability, low contact resistance, and superior RF performance, making it particularly suitable for high-frequency and RF applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

 

 

PCB General Specifications

Parameter Detail
Layer Count 2-Layer Rigid
Base Material Rogers RT/duroid® 6006 (Ceramic-PTFE composite)
Board Dimensions 134.8mm x 78.65mm (2 types = 2 PCBs) ±0.15mm
Finished Thickness 0.4mm
Core Thickness 10mil (0.254mm)
Min. Trace / Space 5 / 6 mils
Min. Hole Size 0.3mm
Blind Vias None
Finished Cu Weight 1 oz (1.4 mils / 35μm) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Silver
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2
Availability Worldwide
Components / Pads / Vias / Nets 46 / 64 / 41 / 2

 

 

Material Advantages: RT/duroid® 6006

The RT/duroid® 6006 microwave laminates from Rogers Corporation are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. With a Dk value of 6.15, these laminates enable significant circuit size reduction while maintaining excellent high-frequency performance.

 

2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish 1

 

Key material highlights:

Ceramic-PTFE composite construction provides a unique balance of electrical and mechanical properties

 

Tight dielectric constant and thickness control ensures repeatable circuit performance across production lots

 

Low moisture absorption (0.05%) maintains stable electrical properties in humid environments

 

Excellent thermal mechanical stability supports reliable operation across a wide temperature range

 

High thermal decomposition temperature (Td > 500°C) offers exceptional thermal stability

 

The material is supplied clad both sides with electrodeposited copper foil. The combination of high Dk and low loss makes RT/duroid 6006 ideal for operating at X-band frequencies and below. Standard dielectric thicknesses include 0.010", 0.025", 0.050", 0.075", and 0.100", with additional thicknesses available upon request.

 

 

RT/duroid® 6006 Material Properties

Property Test Condition Value Benefit
Dielectric Constant (εr) Process 10 GHz / 23°C 6.15 ±0.15 High Dk enables circuit size reduction
Dielectric Constant (εr) Design 8 GHz to 40 GHz 6.45 Accurate design for broadband applications
Dissipation Factor (tan δ) 10 GHz / 23°C 0.0027 Low loss, ideal for X-band and below
TCDk (Thermal Coefficient of εr) -50°C to +170°C -410 ppm/°C Predictable performance across temperature
Surface Resistivity COND A 7 × 10⁷ MΩ Clean signal integrity
Volume Resistivity COND A 2 × 10⁷ MΩ·cm High insulation resistance
CTE (X-axis) -55°C to +288°C 47 ppm/°C Dimensional stability
CTE (Y-axis) -55°C to +288°C 34 ppm/°C Dimensional stability
CTE (Z-axis) -55°C to +288°C 117 ppm/°C Reliable PTH performance
Thermal Conductivity 80°C 0.49 W/(m·K) Basic heat dissipation
Moisture Absorption D48/50°C, 0.050" thick 0.05% Stable in humid environments
Density 2.7 g/cm³ High ceramic content
Td (Thermal Decomposition) TGA >500°C Excellent thermal stability
Copper Peel Strength After solder float 2.5 N/mm (14.3 pli) Reliable copper adhesion
Flammability Rating UL 94 V-0 Fire safety compliant
Lead-Free Process Compatible Yes Ready for modern assembly

 

 

PCB Stackup & Construction

The board features a thin, high-performance 2-layer stackup:

 

Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper

 

Dielectric Core: Rogers RT/duroid® 6006 – 10mil (0.254mm)

 

Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper

 

Total Finished Thickness: 0.4mm

 

Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 46 components, 64 total pads (26 thru-hole, 38 top SMT), 41 vias, and 2 nets.

 

Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.

 

 

Typical Applications

Thanks to its high Dk (6.15), low loss, and stable electrical properties, this PCB is ideally suited for:

Patch antennas

Satellite communications systems

Power amplifiers

Aircraft collision avoidance systems

Ground radar warning systems

Electronic and microwave circuits requiring high dielectric constant

 

 

Available Configurations

RT/duroid 6006 laminates are available with standard dielectric thicknesses of 0.010", 0.025", 0.050", 0.075", and 0.100" (0.254, 0.635, 1.270, 1.905, 2.54 mm). Copper cladding options range from ½ oz. to 2 oz./ft² (18 to 70 μm), including standard and reverse-treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may also be specified. Standard panel sizes include 10"x10", 10"x20", and 18"x12", with additional sizes available upon request.

 

 

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.

 

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