RO3006 High-Frequency PCB Laminate: Dk 6.15, Low Loss, and CTE Matched to Copper for Compact RF Designs

Product Description

What is RO3006?

It is a ceramic-filled PTFE composite laminate from Rogers Corporation. It is designed for commercial microwave and RF applications. The dielectric constant (Dk) is 6.15 ±0.15 at 10 GHz. The dissipation factor (Df) is 0.0020 at 10 GHz. The material has a very low CTE of 17 ppm/°C in the X and Y axes. This matches the CTE of copper. The Z-axis CTE is 24 ppm/°C. The decomposition temperature (Td) is 500°C. The material is UL94 V-0 rated. It has very low moisture absorption (0.02%). It is ideal for applications that require high Dk and excellent dimensional stability.

 

 

What PCB can be built with it?

A complete 2-layer RF PCB solution can be provided. The board is based on RO3006 material. The finished thickness is 0.25 mm (10 mils). The copper weight is 1 oz per layer. OSP (Organic Solderability Preservative) is applied as the surface finish. No solder mask is applied on either side. Black silkscreen is printed on the top layer. The minimum trace and space are 5 and 7 mils. The minimum hole size is 0.25 mm. Via plating thickness is 20 µm. The quality standard is IPC Class 2. This board is ideal for automotive radar, GPS antennas, cellular power amplifiers, and patch antennas.

 

 

1. Material Overview

RO3006 is a ceramic-filled PTFE composite laminate. It is manufactured by Rogers Corporation. It is part of the RO3000® series of high-frequency circuit materials. This series was designed for commercial microwave and RF applications.

 

The material offers exceptional electrical and mechanical stability. The mechanical properties are consistent across the entire RO3000 series. This is true regardless of the dielectric constant that is selected. Multilayer board designs can be developed using different Dk materials for individual layers. Warpage and reliability problems are avoided.

 

Key Features of RO3006:

 

Ceramic-Filled PTFE Composite — The material combines PTFE with ceramic fillers. This provides stable electrical properties and excellent mechanical performance.

 

High Dielectric Constant — The Dk is 6.15 ±0.15 at 10 GHz. This is ideal for applications that require smaller circuit sizes.

 

Low Dissipation Factor — The Df is 0.0020 at 10 GHz. Signal loss is minimized.

 

Excellent Thermal Stability — The decomposition temperature (Td) is > 500°C. This is exceptional for PTFE-based materials.

 

Copper-Matched CTE — The CTE is 17 ppm/°C in the X and Y axes. This matches the CTE of copper. Excellent dimensional stability is achieved. Typical etch shrinkage is less than 0.5 mils per inch.

 

Low Z-Axis CTE — The Z-axis CTE is 24 ppm/°C. Exceptional plated through-hole reliability is provided. This holds true even in severe thermal environments.

 

Stable Dk Over Temperature — The dielectric constant is very stable over a range of temperatures. The step change in Dk that occurs for PTFE glass materials near room temperature is eliminated.

 

 

2. RO3006 Technical Data Sheet

Property	Typical Value	Units	Test Conditions	Test Method
Dielectric Constant (process)	6.15 ±0.15	—	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dielectric Constant (design)	6.5	—	8 GHz – 40 GHz	Differential Phase Length
Dissipation Factor	0.002	—	10 GHz / 23°C	IPC-TM-650 2.5.5.5
TCDk	-262	ppm/°C	-50 to 150°C / 10 GHz	IPC-TM-650 2.5.5.5
Volume Resistivity	10⁵	MΩ-cm	Condition A	IPC-TM-650 2.5.17.1
Surface Resistivity	10⁵	MΩ	Condition A	IPC-TM-650 2.5.17.1
Decomposition Temperature (Td)	500	°C (TGA)	—	ASTM D3850
CTE X-axis	17	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
CTE Y-axis	17	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
CTE Z-axis	24	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
Thermal Conductivity	0.79	W/(m·K)	50°C	ASTM D5470
Copper Peel Strength	7.1	lbs/in	1 oz EDC after solder float	IPC-TM-650 2.4.8
Young's Modulus	1498 / 1293	MPa	23°C	ASTM D638
Dimensional Stability	1.8	mm/m	Condition A	IPC-TM-650 2.2.4
Flammability	V-0	—	—	UL 94
Moisture Absorption	0.02	%	D48/50	IPC-TM-650 2.6.2.1
Density	2.6	g/cm³	23°C	ASTM D792
Specific Heat Capacity	0.86	J/g/K	—	Calculated
Lead-Free Process Compatible	Yes	—	—	—

 

 

 

3. Key Advantages of RO3006

Feature	Benefit
Dk is 6.15 ±0.15	Tight tolerance allows consistent impedance control
Df is 0.0020 at 10 GHz	Low loss minimizes signal attenuation in microwave circuits
Td is > 500°C	Exceptional thermal decomposition resistance is provided
CTE X/Y is 17 ppm/°C	CTE matches copper; excellent dimensional stability is achieved
CTE Z is 24 ppm/°C	Reliable plated through-hole performance is ensured
TCDk is -262 ppm/°C	Stable Dk over temperature eliminates step change near room temperature
Thermal conductivity is 0.79 W/m·K	Heat dissipation is improved compared to standard PTFE
Moisture absorption is 0.02%	Very low water absorption ensures stable performance in humid environments
Uniform mechanical properties	Warpage is prevented in multilayer designs with different Dk values
UL94 V-0 rating is achieved	Fire safety compliance is ensured

 

 

4. Application Fields

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

 

 

5. Custom 2-Layer RF PCB – Complete Specification

A complete 2-layer RF PCB solution can be provided based on RO3006. The specifications are shown below.

 

 

Board Specifications

Specification	Detail
Board Type	2-Layer RF PCB
Base Material	Rogers RO3006 (0.005" / 0.127 mm core)
Finished Board Thickness	0.25 mm (10 mils)
Finished Copper Weight	1 oz (35 µm) per layer
Board Dimensions	43.66 × 28.01 mm (1 piece)
Minimum Trace / Space	5 / 7 mils
Minimum Hole Size	0.25 mm
Via Plating Thickness	20 µm
Surface Finish	OSP (Organic Solderability Preservative)
Top Solder Mask	No
Bottom Solder Mask	No
Top Silkscreen	Black
Bottom Silkscreen	No
IPC Classification	Class 2
Artwork Format	Gerber RS-274-X
Testing	100% Electrical Test (before shipment)
Availability	Worldwide

 

 

6. Why OSP Finish Is Used

OSP (Organic Solderability Preservative) is chosen for this RF PCB. The advantages are listed below.

Advantage	Benefit
Solderability is preserved	The copper surface is protected from oxidation until soldering
Flat surface is provided	This is ideal for fine-pitch SMT components
Cost-effective finish is achieved	OSP is less expensive than ENIG or gold plating
Lead-free compatible	OSP is compatible with lead-free soldering processes
No significant RF impact	OSP does not introduce significant loss at RF frequencies
Re-workable	Boards can be reworked easily if needed

 

 

7. Why No Solder Mask Is Used

Advantage	Benefit
Weight is reduced	Thin, lightweight boards are achieved
Cost is reduced	Solder mask application is eliminated
RF performance is optimized	Solder mask can affect impedance and introduce loss at high frequencies
Bare copper grounding is enabled	Direct grounding connections can be made
Visual inspection is simplified	Traces and pads are clearly visible

 

 

Comparison Table – RO3006 vs. RO3003 vs. RO3035

Parameter	RO3006	RO3003	RO3035
Dk at 10 GHz	6.15 ±0.15	3.00 ±0.04	3.50 ±0.05
Df at 10 GHz	0.002	0.001	0.0015
CTE X/Y (ppm/°C)	17/17	17/17	17/17
CTE Z (ppm/°C)	24	24	24
Td (°C)	>500	>500	>500
Thermal Conductivity (W/m·K)	0.79	0.5	0.5
Moisture Absorption (%)	0.02	0.02	0.02
Primary Use	High-DK RF	Low-loss, low-DK	Balanced Dk/Df

 

 

Q1: What is the dielectric constant of RO3006?

The process Dk is 6.15 ±0.15 at 10 GHz and 23°C. The design Dk is 6.50 from 8 GHz to 40 GHz. This high Dk allows smaller circuit sizes to be achieved.

 

 

Q2: Why is the CTE of RO3006 important?

The CTE in the X and Y axes is 17 ppm/°C. This matches the CTE of copper. Excellent dimensional stability is provided. Etch shrinkage is less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/°C. Reliable plated through-hole performance is ensured.

 

 

Q3: What is OSP finish and why is it used?

OSP stands for Organic Solderability Preservative. It is a water-based organic coating that is applied to copper pads. It protects the copper from oxidation before soldering. It is cost-effective. It provides a flat surface. It is compatible with lead-free soldering.

 

 

Q4: Is RO3006 suitable for automotive radar applications?

Yes. RO3006 is widely used in 77 GHz automotive radar applications. The high Dk, low loss, excellent thermal stability, and low CTE make it ideal for this application.

 

 

Q5: What is the typical lead time for custom RO3006 PCBs?

A: Lead times vary based on complexity and quantity. For 2-layer RF PCBs like the example described, typical lead times are 7 to 12 working days. Please contact us for specific project timelines.

 

 

Ready to Get Started?

RO3006 raw laminate can be provided. Fully fabricated 2-layer RF PCBs with OSP finish and fine-line capability can be manufactured.

Contact us today for:

Material sampling and testing

RF circuit design assistance

Impedance calculation and design support

PCB quoting and DFM review

Technical support for your specific application