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How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates?

How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates?

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 8 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RT/duroid 5880
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
8 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Introduction

In the most demanding high-frequency and millimeter-wave applications—where signal integrity, minimal insertion loss, and consistent electrical performance are paramount—material selection becomes the single most critical design decision. Rogers RT/duroid® 5880 represents the gold standard in ultra-low-loss PTFE-based laminates, delivering the lowest electrical loss among reinforced PTFE materials while maintaining exceptional dielectric constant uniformity.

 

 

Designed for exacting stripline and microstrip circuit applications, RT/duroid 5880's randomly oriented glass microfibers result in exceptional dielectric constant uniformity—both from panel to panel and across a wide frequency range. Its extremely low dissipation factor extends the material's usefulness to Ku-band, millimeter-wave frequencies, and beyond, making it a trusted choice for aerospace, defense, and advanced communications systems.

 

 

This article provides a comprehensive overview of RT/duroid 5880 laminate properties, a detailed 2-layer PCB design example, and key sourcing information for engineers and procurement professionals.

 

How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates? 0

 

What Is Rogers RT/duroid 5880 Laminate?

Rogers RT/duroid 5880 is a glass microfiber-reinforced PTFE (polytetrafluoroethylene) composite specifically engineered for high-frequency circuit applications. Unlike woven fiberglass-reinforced PTFE materials, RT/duroid 5880 utilizes randomly oriented microfibers, which eliminate the dielectric constant anisotropy and non-uniformity that can occur with woven reinforcements.

 

 

This unique construction results in:

 

Isotropic electrical properties – Consistent Dk regardless of orientation

 

Exceptional Dk uniformity – 2.20 ± 0.02 from panel to panel

 

Stable performance across frequency – Dk remains constant from low frequencies to millimeter-wave

 

Ultra-low dissipation factor – 0.0004 to 0.0009 @ 10 GHz, among the lowest for any reinforced PTFE material

 

 

Key Differentiator: The Lowest Loss in a Reinforced PTFE Material

RT/duroid 5880 offers the lowest dissipation factor of any reinforced PTFE laminate available today. With a Df as low as 0.0004 at 1 MHz and 0.0009 at 10 GHz, it outperforms woven fiberglass PTFE materials (like DiClad 527, Df ≈ 0.0017) and hydrocarbon ceramic materials (like RO4835, Df ≈ 0.0037). This ultra-low loss characteristic makes RT/duroid 5880 the material of choice for applications where every fraction of a dB of insertion loss matters—including satellite communications, millimeter-wave radar, and high-performance test equipment.

 

Properties of RT/duroid 5880 Laminate

Property Typical Value Direction Units Condition Test Method
Electrical Properties          
Dielectric Constant, εr (Process) 2.20 ± 0.02 Z C24/23/50, 10 GHz IPC-TM-650 2.5.5.5¹
Dielectric Constant, εr (Process) 2.2 Z C24/23/50, 1 MHz IPC-TM-650 2.5.5.3
Dielectric Constant, εr (Design) 2.2 Z 8 GHz – 40 GHz Differential Phase Length Method²
Dissipation Factor, tan δ 0.0004 Z C24/23/50, 1 MHz IPC-TM-650 2.5.5.3
Dissipation Factor, tan δ 0.0009 Z C24/23/50, 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of εr -125 Z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 2 × 10⁷ Z Mohm cm C96/35/90 ASTM D257
Surface Resistivity 3 × 10⁷ Z Mohm C/96/35/90 ASTM D257
Thermal Properties          
Coefficient of Thermal Expansion (CTE) 31 X ppm/°C 0°C – 100°C IPC-TM-650 2.4.41
  48 Y ppm/°C 0°C – 100°C IPC-TM-650 2.4.41
  237 Z ppm/°C 0°C – 100°C IPC-TM-650 2.4.41
Thermal Conductivity 0.2 Z W/m/K 80°C ASTM C518
Specific Heat 0.96 (0.23) N/A J/g/K (cal/g/°C) Calculated
Decomposition Temperature (Td) 500 N/A °C (TGA) ASTM D3850
Mechanical Properties          
Tensile Modulus (@ 23°C) 1070 (156) X MPa (kpsi) A ASTM D638
  860 (125) Y MPa (kpsi) A ASTM D638
Tensile Modulus (@ 100°C) 450 (65) X MPa (kpsi) A ASTM D638
  380 (55) Y MPa (kpsi) A ASTM D638
Ultimate Tensile Stress (@ 23°C) 29 (4.2) X MPa (kpsi) A ASTM D638
  27 (3.9) Y MPa (kpsi) A ASTM D638
Ultimate Tensile Stress (@ 100°C) 20 (2.9) X MPa (kpsi) A ASTM D638
  18 (2.6) Y MPa (kpsi) A ASTM D638
Ultimate Tensile Strain 6 X % A ASTM D638
  4.9 Y % A ASTM D638
Compressive Modulus (@ 23°C) 710 (103) X MPa (kpsi) A ASTM D695
  710 (103) Y MPa (kpsi) A ASTM D695
  940 (136) Z MPa (kpsi) A ASTM D695
Compressive Modulus (@ 100°C) 500 (73) X MPa (kpsi) A ASTM D695
  500 (73) Y MPa (kpsi) A ASTM D695
  670 (97) Z MPa (kpsi) A ASTM D695
Ultimate Compressive Stress 27 (3.9) X MPa (kpsi) A ASTM D695
  29 (5.3) Y MPa (kpsi) A ASTM D695
  52 (7.5) Z MPa (kpsi) A ASTM D695
Ultimate Compressive Strain 8.5 X % A ASTM D695
  7.7 Y % A ASTM D695
  12.5 Z % A ASTM D695
Physical & Environmental Properties          
Moisture Absorption 0.02 N/A % 0.062" (1.6mm), D48/50 ASTM D570
Density 2.2 N/A gm/cm³ N/A ASTM D792
Copper Peel Strength 31.2 (5.5) N/A pli (N/mm) 1 oz (35μm) EDC foil, after solder float IPC-TM-650 2.4.8
Flammability V-0 N/A N/A UL 94
Lead-Free Process Compatible Yes N/A N/A

 

Notes:

1. Specification values are measured per IPC-TM-650 method 2.5.5.5 at ~10 GHz, 23°C. Testing based on 1 oz. electrodeposited copper foil.
2. The design Dk is an average number from several different tested lots of material on the most common thicknesses.
3. Typical values should not be used for specification limits, except where noted.
4. SI units given first with other frequently used units in parentheses.

A certificate of conformance containing lot-specific data accompanies each shipment.

 

Features and Benefits Summary

Feature Benefit
Ultra-low dissipation factor (0.0004 – 0.0009 @ 10 GHz) Lowest loss among reinforced PTFE materials; extends usability to Ku-band and millimeter-wave
Dk of 2.20 ± 0.02 Exceptional uniformity from panel to panel; predictable impedance control
Randomly oriented glass microfibers Isotropic electrical properties; eliminates Dk anisotropy
Stable Dk across frequency Consistent performance from low frequencies to >40 GHz
Low moisture absorption (0.02%) Negligible performance drift in humid environments
Low Z-axis CTE (237 ppm/°C) Reliable plated-through-holes in thermal environments
Excellent chemical resistance Resistant to all solvents and reagents used in PCB processing
Lead-free process compatible Suitable for modern high-temperature assembly processes
V-0 flammability rating UL 94 compliant for safety-critical applications
Easy machinability Can be cut, sheared, drilled, and milled to shape

 

 

Standard Offerings

RT/duroid 5880 laminates are available in a comprehensive range of thicknesses, panel sizes, and copper cladding options.

Thickness (Inches) Thickness (mm) Tolerance
0.005" 0.127 mm ± 0.0005"
0.010" 0.252 mm ± 0.0007"
0.020" 0.508 mm ± 0.0015"
0.031" 0.787 mm ± 0.0020"
0.062" 1.575 mm ± 0.0030"

 

 

Standard Panel Sizes & Claddings

Parameter Options
Standard Panel Sizes 18" × 12" (457 × 305 mm)
  18" × 24" (457 × 610 mm)
  Additional panel sizes available
Electrodeposited Copper (EDC) ½ oz. (18 μm) HH/HH
  1 oz. (35 μm) *H1/H1*
Rolled Copper Foil ½ oz. (18 μm) *5R/5R*
  1 oz. (35 μm) *1R/1R*
Additional Claddings Heavy metal, resistive foil, unclad, aluminum, copper, or brass plate available

 

 

2-Layer PCB Design Example Using RT/duroid 5880

To demonstrate the practical application of RT/duroid 5880, the following is a complete 2-layer rigid PCB design case.

 

How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates? 1

 

PCB Design Specifications

Parameter Specification
Base Material Rogers RT/duroid 5880
Layer Count 2-layer rigid
Board Dimensions 102.00 mm × 65.00 mm per panel, ±0.15 mm
Minimum Trace/Space 4 / 6 mils
Minimum Hole Size 0.35 mm
Blind/Buried Vias None
Finished Cu Weight 1 oz (35 μm) all layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold (ENIG)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% prior to shipment
Artwork Format Gerber RS-274-X
Accepted Standard IPC-Class-2
Service Area Worldwide

 

Design Observations

This larger board (102 mm × 65 mm) features a relatively high component count (46 components) and a significant number of vias (29 vias) despite having only 2 nets.

 

Key observations include:

 

High via density – Frequent grounding or shielding vias, typical of sensitive microwave designs operating at millimeter-wave frequencies

 

No solder mask – Preserves the ultra-low-loss characteristics of RT/duroid 5880; solder mask would introduce additional dielectric loss

 

No silkscreen – Maintains a clean RF surface; avoids contamination

 

ENIG surface finish – Provides excellent solderability and flatness; suitable for fine-pitch SMT components

 

RT/duroid 5880's ultra-low loss (Df ≈ 0.0009) – Critical for maintaining signal integrity at Ku-band and millimeter-wave frequencies

 

IPC-Class-2 compliance – Ensures reliability for commercial aerospace and defense applications

 

 

Manufacturing Process Highlights

 

Easily machined – RT/duroid 5880 laminates can be cut, sheared, drilled, and milled using standard PTFE processing techniques

 

Excellent chemical resistance – Resistant to all solvents and reagents used in etching circuits or plating edges and holes

 

Fine-pitch capability – 4/6 mil trace/spacing supports high-density millimeter-wave circuit layouts

 

100% electrical testing – Guarantees functional integrity of every board

 

 

Typical Applications

•Commercial Airline Broadband Antennas

• Microstrip and Stripline Circuits

• Millimeter Wave Applications

• Radar Systems

• Missile Guidance Systems

• Point to Point Digital Radio Antennas

 

 

Conclusion

Rogers RT/duroid 5880 laminates represent the pinnacle of ultra-low-loss PTFE-based materials for high-frequency and millimeter-wave applications. With a dielectric constant of 2.20 ± 0.02 and a dissipation factor as low as 0.0009 at 10 GHz, RT/duroid 5880 delivers the lowest electrical loss of any reinforced PTFE material available today.

 

 

Key advantages include:

 

Ultra-low loss (Df = 0.0004 – 0.0009) – Enables operation at Ku-band and millimeter-wave frequencies

 

Exceptional Dk uniformity (2.20 ± 0.02) – Predictable impedance control; consistent performance

 

Isotropic properties – Random microfiber reinforcement eliminates Dk anisotropy

 

Stable performance across frequency – Constant Dk from low frequencies to >40 GHz

 

Low moisture absorption (0.02%) – Negligible performance drift in humid environments

 

NASA low-outgassing – Suitable for aerospace and space applications

 

V-0 flammability – UL 94 compliant for safety-critical systems

 

Easy machinability – Can be cut, sheared, drilled, and milled using standard methods

 

Whether used in radar systems, satellite communications, millimeter-wave backhaul, or high-performance test equipment, RT/duroid 5880 provides the ultimate low-loss foundation for demanding high-frequency circuit designs.

 

Products
PRODUCTS DETAILS
How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates?
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 8 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
Rogers
Certification
ISO9001
Model Number
RT/duroid 5880
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
8 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Introduction

In the most demanding high-frequency and millimeter-wave applications—where signal integrity, minimal insertion loss, and consistent electrical performance are paramount—material selection becomes the single most critical design decision. Rogers RT/duroid® 5880 represents the gold standard in ultra-low-loss PTFE-based laminates, delivering the lowest electrical loss among reinforced PTFE materials while maintaining exceptional dielectric constant uniformity.

 

 

Designed for exacting stripline and microstrip circuit applications, RT/duroid 5880's randomly oriented glass microfibers result in exceptional dielectric constant uniformity—both from panel to panel and across a wide frequency range. Its extremely low dissipation factor extends the material's usefulness to Ku-band, millimeter-wave frequencies, and beyond, making it a trusted choice for aerospace, defense, and advanced communications systems.

 

 

This article provides a comprehensive overview of RT/duroid 5880 laminate properties, a detailed 2-layer PCB design example, and key sourcing information for engineers and procurement professionals.

 

How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates? 0

 

What Is Rogers RT/duroid 5880 Laminate?

Rogers RT/duroid 5880 is a glass microfiber-reinforced PTFE (polytetrafluoroethylene) composite specifically engineered for high-frequency circuit applications. Unlike woven fiberglass-reinforced PTFE materials, RT/duroid 5880 utilizes randomly oriented microfibers, which eliminate the dielectric constant anisotropy and non-uniformity that can occur with woven reinforcements.

 

 

This unique construction results in:

 

Isotropic electrical properties – Consistent Dk regardless of orientation

 

Exceptional Dk uniformity – 2.20 ± 0.02 from panel to panel

 

Stable performance across frequency – Dk remains constant from low frequencies to millimeter-wave

 

Ultra-low dissipation factor – 0.0004 to 0.0009 @ 10 GHz, among the lowest for any reinforced PTFE material

 

 

Key Differentiator: The Lowest Loss in a Reinforced PTFE Material

RT/duroid 5880 offers the lowest dissipation factor of any reinforced PTFE laminate available today. With a Df as low as 0.0004 at 1 MHz and 0.0009 at 10 GHz, it outperforms woven fiberglass PTFE materials (like DiClad 527, Df ≈ 0.0017) and hydrocarbon ceramic materials (like RO4835, Df ≈ 0.0037). This ultra-low loss characteristic makes RT/duroid 5880 the material of choice for applications where every fraction of a dB of insertion loss matters—including satellite communications, millimeter-wave radar, and high-performance test equipment.

 

Properties of RT/duroid 5880 Laminate

Property Typical Value Direction Units Condition Test Method
Electrical Properties          
Dielectric Constant, εr (Process) 2.20 ± 0.02 Z C24/23/50, 10 GHz IPC-TM-650 2.5.5.5¹
Dielectric Constant, εr (Process) 2.2 Z C24/23/50, 1 MHz IPC-TM-650 2.5.5.3
Dielectric Constant, εr (Design) 2.2 Z 8 GHz – 40 GHz Differential Phase Length Method²
Dissipation Factor, tan δ 0.0004 Z C24/23/50, 1 MHz IPC-TM-650 2.5.5.3
Dissipation Factor, tan δ 0.0009 Z C24/23/50, 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of εr -125 Z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 2 × 10⁷ Z Mohm cm C96/35/90 ASTM D257
Surface Resistivity 3 × 10⁷ Z Mohm C/96/35/90 ASTM D257
Thermal Properties          
Coefficient of Thermal Expansion (CTE) 31 X ppm/°C 0°C – 100°C IPC-TM-650 2.4.41
  48 Y ppm/°C 0°C – 100°C IPC-TM-650 2.4.41
  237 Z ppm/°C 0°C – 100°C IPC-TM-650 2.4.41
Thermal Conductivity 0.2 Z W/m/K 80°C ASTM C518
Specific Heat 0.96 (0.23) N/A J/g/K (cal/g/°C) Calculated
Decomposition Temperature (Td) 500 N/A °C (TGA) ASTM D3850
Mechanical Properties          
Tensile Modulus (@ 23°C) 1070 (156) X MPa (kpsi) A ASTM D638
  860 (125) Y MPa (kpsi) A ASTM D638
Tensile Modulus (@ 100°C) 450 (65) X MPa (kpsi) A ASTM D638
  380 (55) Y MPa (kpsi) A ASTM D638
Ultimate Tensile Stress (@ 23°C) 29 (4.2) X MPa (kpsi) A ASTM D638
  27 (3.9) Y MPa (kpsi) A ASTM D638
Ultimate Tensile Stress (@ 100°C) 20 (2.9) X MPa (kpsi) A ASTM D638
  18 (2.6) Y MPa (kpsi) A ASTM D638
Ultimate Tensile Strain 6 X % A ASTM D638
  4.9 Y % A ASTM D638
Compressive Modulus (@ 23°C) 710 (103) X MPa (kpsi) A ASTM D695
  710 (103) Y MPa (kpsi) A ASTM D695
  940 (136) Z MPa (kpsi) A ASTM D695
Compressive Modulus (@ 100°C) 500 (73) X MPa (kpsi) A ASTM D695
  500 (73) Y MPa (kpsi) A ASTM D695
  670 (97) Z MPa (kpsi) A ASTM D695
Ultimate Compressive Stress 27 (3.9) X MPa (kpsi) A ASTM D695
  29 (5.3) Y MPa (kpsi) A ASTM D695
  52 (7.5) Z MPa (kpsi) A ASTM D695
Ultimate Compressive Strain 8.5 X % A ASTM D695
  7.7 Y % A ASTM D695
  12.5 Z % A ASTM D695
Physical & Environmental Properties          
Moisture Absorption 0.02 N/A % 0.062" (1.6mm), D48/50 ASTM D570
Density 2.2 N/A gm/cm³ N/A ASTM D792
Copper Peel Strength 31.2 (5.5) N/A pli (N/mm) 1 oz (35μm) EDC foil, after solder float IPC-TM-650 2.4.8
Flammability V-0 N/A N/A UL 94
Lead-Free Process Compatible Yes N/A N/A

 

Notes:

1. Specification values are measured per IPC-TM-650 method 2.5.5.5 at ~10 GHz, 23°C. Testing based on 1 oz. electrodeposited copper foil.
2. The design Dk is an average number from several different tested lots of material on the most common thicknesses.
3. Typical values should not be used for specification limits, except where noted.
4. SI units given first with other frequently used units in parentheses.

A certificate of conformance containing lot-specific data accompanies each shipment.

 

Features and Benefits Summary

Feature Benefit
Ultra-low dissipation factor (0.0004 – 0.0009 @ 10 GHz) Lowest loss among reinforced PTFE materials; extends usability to Ku-band and millimeter-wave
Dk of 2.20 ± 0.02 Exceptional uniformity from panel to panel; predictable impedance control
Randomly oriented glass microfibers Isotropic electrical properties; eliminates Dk anisotropy
Stable Dk across frequency Consistent performance from low frequencies to >40 GHz
Low moisture absorption (0.02%) Negligible performance drift in humid environments
Low Z-axis CTE (237 ppm/°C) Reliable plated-through-holes in thermal environments
Excellent chemical resistance Resistant to all solvents and reagents used in PCB processing
Lead-free process compatible Suitable for modern high-temperature assembly processes
V-0 flammability rating UL 94 compliant for safety-critical applications
Easy machinability Can be cut, sheared, drilled, and milled to shape

 

 

Standard Offerings

RT/duroid 5880 laminates are available in a comprehensive range of thicknesses, panel sizes, and copper cladding options.

Thickness (Inches) Thickness (mm) Tolerance
0.005" 0.127 mm ± 0.0005"
0.010" 0.252 mm ± 0.0007"
0.020" 0.508 mm ± 0.0015"
0.031" 0.787 mm ± 0.0020"
0.062" 1.575 mm ± 0.0030"

 

 

Standard Panel Sizes & Claddings

Parameter Options
Standard Panel Sizes 18" × 12" (457 × 305 mm)
  18" × 24" (457 × 610 mm)
  Additional panel sizes available
Electrodeposited Copper (EDC) ½ oz. (18 μm) HH/HH
  1 oz. (35 μm) *H1/H1*
Rolled Copper Foil ½ oz. (18 μm) *5R/5R*
  1 oz. (35 μm) *1R/1R*
Additional Claddings Heavy metal, resistive foil, unclad, aluminum, copper, or brass plate available

 

 

2-Layer PCB Design Example Using RT/duroid 5880

To demonstrate the practical application of RT/duroid 5880, the following is a complete 2-layer rigid PCB design case.

 

How Does RT/duroid 5880 Compare to Woven Fiberglass PTFE Laminates? 1

 

PCB Design Specifications

Parameter Specification
Base Material Rogers RT/duroid 5880
Layer Count 2-layer rigid
Board Dimensions 102.00 mm × 65.00 mm per panel, ±0.15 mm
Minimum Trace/Space 4 / 6 mils
Minimum Hole Size 0.35 mm
Blind/Buried Vias None
Finished Cu Weight 1 oz (35 μm) all layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold (ENIG)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% prior to shipment
Artwork Format Gerber RS-274-X
Accepted Standard IPC-Class-2
Service Area Worldwide

 

Design Observations

This larger board (102 mm × 65 mm) features a relatively high component count (46 components) and a significant number of vias (29 vias) despite having only 2 nets.

 

Key observations include:

 

High via density – Frequent grounding or shielding vias, typical of sensitive microwave designs operating at millimeter-wave frequencies

 

No solder mask – Preserves the ultra-low-loss characteristics of RT/duroid 5880; solder mask would introduce additional dielectric loss

 

No silkscreen – Maintains a clean RF surface; avoids contamination

 

ENIG surface finish – Provides excellent solderability and flatness; suitable for fine-pitch SMT components

 

RT/duroid 5880's ultra-low loss (Df ≈ 0.0009) – Critical for maintaining signal integrity at Ku-band and millimeter-wave frequencies

 

IPC-Class-2 compliance – Ensures reliability for commercial aerospace and defense applications

 

 

Manufacturing Process Highlights

 

Easily machined – RT/duroid 5880 laminates can be cut, sheared, drilled, and milled using standard PTFE processing techniques

 

Excellent chemical resistance – Resistant to all solvents and reagents used in etching circuits or plating edges and holes

 

Fine-pitch capability – 4/6 mil trace/spacing supports high-density millimeter-wave circuit layouts

 

100% electrical testing – Guarantees functional integrity of every board

 

 

Typical Applications

•Commercial Airline Broadband Antennas

• Microstrip and Stripline Circuits

• Millimeter Wave Applications

• Radar Systems

• Missile Guidance Systems

• Point to Point Digital Radio Antennas

 

 

Conclusion

Rogers RT/duroid 5880 laminates represent the pinnacle of ultra-low-loss PTFE-based materials for high-frequency and millimeter-wave applications. With a dielectric constant of 2.20 ± 0.02 and a dissipation factor as low as 0.0009 at 10 GHz, RT/duroid 5880 delivers the lowest electrical loss of any reinforced PTFE material available today.

 

 

Key advantages include:

 

Ultra-low loss (Df = 0.0004 – 0.0009) – Enables operation at Ku-band and millimeter-wave frequencies

 

Exceptional Dk uniformity (2.20 ± 0.02) – Predictable impedance control; consistent performance

 

Isotropic properties – Random microfiber reinforcement eliminates Dk anisotropy

 

Stable performance across frequency – Constant Dk from low frequencies to >40 GHz

 

Low moisture absorption (0.02%) – Negligible performance drift in humid environments

 

NASA low-outgassing – Suitable for aerospace and space applications

 

V-0 flammability – UL 94 compliant for safety-critical systems

 

Easy machinability – Can be cut, sheared, drilled, and milled using standard methods

 

Whether used in radar systems, satellite communications, millimeter-wave backhaul, or high-performance test equipment, RT/duroid 5880 provides the ultimate low-loss foundation for demanding high-frequency circuit designs.

 

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