| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
The Ideal Foundation for High-Frequency Circuit Design: DiClad 527 Laminates and Their PCB Application
In today's rapidly evolving landscape of wireless communications, radar systems, and high-speed digital networks, the performance of high-frequency printed circuit boards (PCBs) directly determines the success or failure of the entire system. For circuits operating at high frequencies, signal integrity, low transmission loss, and stable electrical performance are the core objectives that designers pursue. To achieve these goals, beyond sophisticated circuit design, selecting the appropriate substrate material is the first and most critical step.
Rogers DiClad 527 high-performance laminates represent a proven material solution engineered precisely for these demanding high-frequency applications. This article explores the material characteristics of DiClad 527 and examines a specific 2-layer PCB design example to demonstrate its practical value in real-world applications.
![]()
DiClad 527: Material Properties and Technical Advantages
DiClad 527 belongs to Rogers' DiClad series and is a woven fiberglass-reinforced PTFE (polytetrafluoroethylene) composite material. Compared to non-woven fiberglass-reinforced PTFE laminates, its unique woven structure delivers significant performance advantages. The woven fiberglass reinforcement provides greater dimensional stability than non-woven alternatives with similar dielectric constants, while the consistent PTFE coating process ensures excellent dielectric constant uniformity across the material.
The electrical performance of DiClad 527 is validated through rigorous testing at both 1 MHz and 10 GHz. The table below summarizes all key electrical characteristics:
Electrical Properties of DiClad 527
| Property | Typical Value | Units | Test Conditions | Test Method |
| Dielectric Constant (Dk) | 2.40 – 2.60 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (Dk) | 2.40 – 2.60 | – | 23°C @ 50% RH, 1 MHz | IPC TM-650 2.5.5.3 |
| Dissipation Factor (Df) | 0.0017 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.001 | – | 23°C @ 50% RH, 1 MHz | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Dk | -153 | ppm/°C | -10 to 140°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 × 10⁹ | MΩ-cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.5 × 10⁷ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | seconds | – | ASTM D-495 |
| Water Absorption | 20±2°C, 24 hours | ≤0.01% | ||
| Long-Term Operating Temperature | — | -100°C to +150°C | ||
| Density | — | 1.89 g/cm³ | ||
| Thermal Conductivity | — | 0.44 W/(M·K) | ||
| Material Composition | — | PPO, Ceramic, ED copper foil |
Thermal and Mechanical Properties
| Property | Typical Value | Units | Test Conditions | Test Method |
| CTE – X Axis | 14 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE – Y Axis | 21 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE – Z Axis | 173 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.26 | W/(m·K) | – | ASTM E1461 |
| Copper Peel Strength | 14 | lbs/in | 10s @ 288°C, 35 μm foil | IPC TM-650 2.4.8 |
| Young's Modulus | 517 / 706 | kpsi | 23°C @ 50% RH | ASTM D-638 |
| Tensile Strength (MD, CMD) | 19.0 / 15.0 | kpsi | 23°C @ 50% RH | ASTM D-882 |
| Compressive Modulus | 359 | kpsi | 23°C @ 50% RH | ASTM D-695 |
| Flex Modulus | 537 | kpsi | 23°C @ 50% RH | ASTM D-3039 |
Physical and Environmental Properties of DiClad 527
| Property | Typical Value | Units | Test Conditions | Test Method |
| Flammability | V-0 | – | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.03 | % | E1/105+D24/23 | IPC TM-650 2.6.2.2 |
| Density | 2.31 | g/cm³ | C24/23/50, Method A | ASTM D792 |
| NASA Outgassing – Total Mass Lost | 0.02 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| NASA Outgassing – Collected Volatiles | 0 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| NASA Outgassing – Water Vapor Recovered | 0.01 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
Performance Highlights: Stability Across Frequency
DiClad laminates demonstrate exceptional stability of both dielectric constant and dissipation factor across a wide frequency range. This inherent robustness simplifies the design process when working across the electromagnetic spectrum, ensuring:
Stable Dk across frequency – Enables easy design transition and scalability of designs
Stable Df across frequency – Provides a stable platform for high-frequency applications where signal integrity is critical to overall performance
These characteristics make DiClad 527 particularly valuable in filter, coupler, and low-noise amplifier applications, where dielectric constant uniformity is critical, as well as in power dividers and combiners, where low loss is essential.
Standard Offerings for DiClad 527 Laminate
DiClad 527 is available in a range of standard thicknesses, panel sizes, and copper cladding options to accommodate various design requirements.
| Standard Thicknesses | Standard Panel Sizes | Standard Claddings |
| 0.020" (0.508 mm) ± 0.0020" | 12" × 18" (305 × 457 mm) | Electrodeposited Copper Foil: |
| 0.030" (0.762 mm) ± 0.0020" | 18" × 12" (457 × 305 mm) | • ½ oz. (18 μm) |
| 0.060" (1.524 mm) ± 0.0020" | 18" × 24" (457 × 610 mm) | • 1 oz. (35 μm) |
| 24" × 18" (610 × 457 mm) |
2-Layer PCB Design Example Using DiClad 527
To illustrate the practical application of DiClad 527, consider the following 2-layer rigid PCB design case. This design leverages the material's key properties to achieve reliable high-frequency performance.
![]()
PCB Design Specifications
| Parameter | Specification |
| Base Material | DiClad 527 |
| Layer Count | 2-layer rigid |
| Board Dimensions | 49.63 mm × 91.54 mm per panel, ±0.15 mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3 mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (35 μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | Black |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
The relatively simple structure with 2 nets suggests this design is likely used for dedicated functional modules such as antenna feed networks, filters, or other RF building blocks. The absence of solder mask layers on both top and bottom sides is a deliberate choice for applications requiring extremely low loss or specific dielectric environments where solder mask material could introduce unwanted parasitic effects.
Manufacturing Process Highlights
Fine Trace/Spacing (4/6 mils): Allows higher-density circuit layouts while maintaining controlled impedance.
ENIG Surface Finish: Provides excellent solderability, surface flatness, and oxidation resistance—critical for precision RF connections.
Reliable Vias: All 19 vias receive 20 μm copper plating, ensuring robust interconnections.
100% Electrical Testing: Guarantees functional integrity of every board before shipment.
IPC-Class-2 Compliance: Ensures long-term reliability for commercial and industrial applications.
Key Benefits Summary
| Benefit | Description |
| Extremely Low Loss Tangent | Minimizes signal attenuation at high frequencies |
| Excellent Dimensional Stability | Maintains pattern registration across temperature changes |
| Product Performance Uniformity | Consistent electrical and mechanical properties |
| Stable Dk Across Frequency | Simplifies design and enables frequency scalability |
| Consistent Mechanical Performance | Reliable under various processing and operating conditions |
| Excellent Chemical Resistance | Withstands harsh chemical processing environments |
| Negligible Humidity Drift | Performance remains stable in high-moisture environments |
| Low Circuit Losses | Ideal for high-frequency signal transmission |
Typical Applications
Communications Infrastructure – Low-loss base station antennas, digital radio antennas
Microwave Components – Filters, couplers, low-noise amplifiers (LNAs)
Guidance Systems – Navigation and missile guidance electronics
Power Distribution – Power dividers and combiners where low loss is critical
Conclusion
DiClad 527 laminates successfully strike an ideal balance between high-performance PTFE materials and conventional substrates, offering controlled dielectric constant (2.40–2.60), ultra-low loss (Df as low as 0.0010), excellent dimensional stability (CTE of 14/21 ppm/°C in X/Y axes), and outstanding environmental reliability with only 0.03% moisture absorption.
Whether used in designing complex radar networks or simple RF modules, DiClad 527 provides a solid and dependable performance foundation for high-frequency circuits. The PCB case study presented here demonstrates how material properties translate into tangible product advantages through carefully engineered design and manufacturing processes, highlighting the value of choosing the right substrate for demanding high-frequency applications. Its compliance with IPC-Class-2 standards, combined with 100% electrical testing, ensures that designs can be reliably manufactured worldwide using standard Gerber RS-274-X artwork formats.
| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
The Ideal Foundation for High-Frequency Circuit Design: DiClad 527 Laminates and Their PCB Application
In today's rapidly evolving landscape of wireless communications, radar systems, and high-speed digital networks, the performance of high-frequency printed circuit boards (PCBs) directly determines the success or failure of the entire system. For circuits operating at high frequencies, signal integrity, low transmission loss, and stable electrical performance are the core objectives that designers pursue. To achieve these goals, beyond sophisticated circuit design, selecting the appropriate substrate material is the first and most critical step.
Rogers DiClad 527 high-performance laminates represent a proven material solution engineered precisely for these demanding high-frequency applications. This article explores the material characteristics of DiClad 527 and examines a specific 2-layer PCB design example to demonstrate its practical value in real-world applications.
![]()
DiClad 527: Material Properties and Technical Advantages
DiClad 527 belongs to Rogers' DiClad series and is a woven fiberglass-reinforced PTFE (polytetrafluoroethylene) composite material. Compared to non-woven fiberglass-reinforced PTFE laminates, its unique woven structure delivers significant performance advantages. The woven fiberglass reinforcement provides greater dimensional stability than non-woven alternatives with similar dielectric constants, while the consistent PTFE coating process ensures excellent dielectric constant uniformity across the material.
The electrical performance of DiClad 527 is validated through rigorous testing at both 1 MHz and 10 GHz. The table below summarizes all key electrical characteristics:
Electrical Properties of DiClad 527
| Property | Typical Value | Units | Test Conditions | Test Method |
| Dielectric Constant (Dk) | 2.40 – 2.60 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (Dk) | 2.40 – 2.60 | – | 23°C @ 50% RH, 1 MHz | IPC TM-650 2.5.5.3 |
| Dissipation Factor (Df) | 0.0017 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.001 | – | 23°C @ 50% RH, 1 MHz | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Dk | -153 | ppm/°C | -10 to 140°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 × 10⁹ | MΩ-cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.5 × 10⁷ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | seconds | – | ASTM D-495 |
| Water Absorption | 20±2°C, 24 hours | ≤0.01% | ||
| Long-Term Operating Temperature | — | -100°C to +150°C | ||
| Density | — | 1.89 g/cm³ | ||
| Thermal Conductivity | — | 0.44 W/(M·K) | ||
| Material Composition | — | PPO, Ceramic, ED copper foil |
Thermal and Mechanical Properties
| Property | Typical Value | Units | Test Conditions | Test Method |
| CTE – X Axis | 14 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE – Y Axis | 21 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.41 |
| CTE – Z Axis | 173 | ppm/°C | 50°C to 150°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.26 | W/(m·K) | – | ASTM E1461 |
| Copper Peel Strength | 14 | lbs/in | 10s @ 288°C, 35 μm foil | IPC TM-650 2.4.8 |
| Young's Modulus | 517 / 706 | kpsi | 23°C @ 50% RH | ASTM D-638 |
| Tensile Strength (MD, CMD) | 19.0 / 15.0 | kpsi | 23°C @ 50% RH | ASTM D-882 |
| Compressive Modulus | 359 | kpsi | 23°C @ 50% RH | ASTM D-695 |
| Flex Modulus | 537 | kpsi | 23°C @ 50% RH | ASTM D-3039 |
Physical and Environmental Properties of DiClad 527
| Property | Typical Value | Units | Test Conditions | Test Method |
| Flammability | V-0 | – | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.03 | % | E1/105+D24/23 | IPC TM-650 2.6.2.2 |
| Density | 2.31 | g/cm³ | C24/23/50, Method A | ASTM D792 |
| NASA Outgassing – Total Mass Lost | 0.02 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| NASA Outgassing – Collected Volatiles | 0 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
| NASA Outgassing – Water Vapor Recovered | 0.01 | % | 125°C, ≤10⁻⁶ torr | NASA SP-R-0022A |
Performance Highlights: Stability Across Frequency
DiClad laminates demonstrate exceptional stability of both dielectric constant and dissipation factor across a wide frequency range. This inherent robustness simplifies the design process when working across the electromagnetic spectrum, ensuring:
Stable Dk across frequency – Enables easy design transition and scalability of designs
Stable Df across frequency – Provides a stable platform for high-frequency applications where signal integrity is critical to overall performance
These characteristics make DiClad 527 particularly valuable in filter, coupler, and low-noise amplifier applications, where dielectric constant uniformity is critical, as well as in power dividers and combiners, where low loss is essential.
Standard Offerings for DiClad 527 Laminate
DiClad 527 is available in a range of standard thicknesses, panel sizes, and copper cladding options to accommodate various design requirements.
| Standard Thicknesses | Standard Panel Sizes | Standard Claddings |
| 0.020" (0.508 mm) ± 0.0020" | 12" × 18" (305 × 457 mm) | Electrodeposited Copper Foil: |
| 0.030" (0.762 mm) ± 0.0020" | 18" × 12" (457 × 305 mm) | • ½ oz. (18 μm) |
| 0.060" (1.524 mm) ± 0.0020" | 18" × 24" (457 × 610 mm) | • 1 oz. (35 μm) |
| 24" × 18" (610 × 457 mm) |
2-Layer PCB Design Example Using DiClad 527
To illustrate the practical application of DiClad 527, consider the following 2-layer rigid PCB design case. This design leverages the material's key properties to achieve reliable high-frequency performance.
![]()
PCB Design Specifications
| Parameter | Specification |
| Base Material | DiClad 527 |
| Layer Count | 2-layer rigid |
| Board Dimensions | 49.63 mm × 91.54 mm per panel, ±0.15 mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3 mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (35 μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | Black |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
The relatively simple structure with 2 nets suggests this design is likely used for dedicated functional modules such as antenna feed networks, filters, or other RF building blocks. The absence of solder mask layers on both top and bottom sides is a deliberate choice for applications requiring extremely low loss or specific dielectric environments where solder mask material could introduce unwanted parasitic effects.
Manufacturing Process Highlights
Fine Trace/Spacing (4/6 mils): Allows higher-density circuit layouts while maintaining controlled impedance.
ENIG Surface Finish: Provides excellent solderability, surface flatness, and oxidation resistance—critical for precision RF connections.
Reliable Vias: All 19 vias receive 20 μm copper plating, ensuring robust interconnections.
100% Electrical Testing: Guarantees functional integrity of every board before shipment.
IPC-Class-2 Compliance: Ensures long-term reliability for commercial and industrial applications.
Key Benefits Summary
| Benefit | Description |
| Extremely Low Loss Tangent | Minimizes signal attenuation at high frequencies |
| Excellent Dimensional Stability | Maintains pattern registration across temperature changes |
| Product Performance Uniformity | Consistent electrical and mechanical properties |
| Stable Dk Across Frequency | Simplifies design and enables frequency scalability |
| Consistent Mechanical Performance | Reliable under various processing and operating conditions |
| Excellent Chemical Resistance | Withstands harsh chemical processing environments |
| Negligible Humidity Drift | Performance remains stable in high-moisture environments |
| Low Circuit Losses | Ideal for high-frequency signal transmission |
Typical Applications
Communications Infrastructure – Low-loss base station antennas, digital radio antennas
Microwave Components – Filters, couplers, low-noise amplifiers (LNAs)
Guidance Systems – Navigation and missile guidance electronics
Power Distribution – Power dividers and combiners where low loss is critical
Conclusion
DiClad 527 laminates successfully strike an ideal balance between high-performance PTFE materials and conventional substrates, offering controlled dielectric constant (2.40–2.60), ultra-low loss (Df as low as 0.0010), excellent dimensional stability (CTE of 14/21 ppm/°C in X/Y axes), and outstanding environmental reliability with only 0.03% moisture absorption.
Whether used in designing complex radar networks or simple RF modules, DiClad 527 provides a solid and dependable performance foundation for high-frequency circuits. The PCB case study presented here demonstrates how material properties translate into tangible product advantages through carefully engineered design and manufacturing processes, highlighting the value of choosing the right substrate for demanding high-frequency applications. Its compliance with IPC-Class-2 standards, combined with 100% electrical testing, ensures that designs can be reliably manufactured worldwide using standard Gerber RS-274-X artwork formats.