| MOQ: | 1PCS |
| Price: | 2.99USD/pcs |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
2-Layer RO4533 PCB | 20mil Core | Immersion Gold Finish
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RO4533™ antenna-grade high-frequency laminate. Specifically engineered for mobile infrastructure and base station antenna applications, this ceramic-filled, glass-reinforced hydrocarbon-based material delivers controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response.
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The board measures 123.5mm x 46mm (single piece) with a finished thickness of 0.6mm (including 20mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are an impressive 4/5 mils, with a minimum finished hole size of 0.25mm. No blind vias are used in this construction.
This design features a green top solder mask for circuit protection and component isolation, along with white top silkscreen for clear component identification. The bottom side has no solder mask, optimizing performance where needed. The Immersion Gold surface finish provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | Rogers RO4533™ (Ceramic-filled, glass-reinforced hydrocarbon) |
| Board Dimensions | 123.5mm x 46mm (1 PCB) ±0.15mm |
| Finished Thickness | 0.6mm |
| Core Thickness | 20mil (0.508mm) ±0.0015" |
| Min. Trace / Space | 4 / 5 mils |
| Min. Hole Size | 0.25mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 36 / 28 / 17 / 2 |
Material Advantages: RO4533™
The RO4533™ laminate from Rogers Corporation is a cost-performance material specifically engineered and manufactured to meet the demanding requirements of the antenna market. As part of the RO4500™ Series, this ceramic-filled, glass-reinforced hydrocarbon-based material set extends the capabilities of the successful RO4000® product series into antenna applications.
![]()
Key material highlights:
Fully compatible with conventional FR-4 and high-temperature lead-free solder processing – no special treatment needed for plated through-hole preparation, unlike traditional PTFE-based laminates
Affordable alternative to more conventional PTFE antenna technologies, allowing designers to optimize price and performance
Halogen-free available to meet the most stringent "green" standards
Excellent PIM performance – typical values better than -157 dBc using two 43 dBm swept tones at 1900 MHz
The resin system is designed to provide ideal antenna performance. The CTE in both X and Y directions closely matches that of copper, reducing stresses in the PCB antenna. With a Tg exceeding 280°C, the low Z-axis CTE ensures excellent plated through-hole reliability. These properties, combined with dimensional stability of less than 0.05% (0.2 mm/m), make RO4533 an excellent candidate for printed circuit antenna applications. The material also provides increased thermal conductivity (0.6 W/m·K) over equivalent PTFE/woven glass materials, enabling antenna designs with increased power handling capability.
RO4533™ Material Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (εr) | 10 GHz / 23°C | 3.3 ±0.08 | Controlled, stable Dk for antenna design |
| Dielectric Constant (εr) | 2.5 GHz / 23°C | 3.3 ±0.08 | Consistent performance across bands |
| Dissipation Factor (tan δ) | 2.5 GHz / 23°C | 0.002 | Ultra-low loss for high gain |
| Dissipation Factor (tan δ) | 10 GHz / 23°C | 0.0025 | Maintains low loss at higher frequencies |
| PIM (Typical) | Reflected 43 dBm swept tones | ≤-157 dBc | Excellent for base station antennas |
| Dielectric Strength | 0.51 mm thickness | >500 V/mil | Robust voltage withstand |
| Dimensional Stability | After etch | <0.2 mm/m (<0.2 mils/inch) | Higher yield on large panels |
| CTE (X-axis) | -55°C to +288°C | 13 ppm/°C | Matched to copper, reduced stress |
| CTE (Y-axis) | -55°C to +288°C | 11 ppm/°C | Matched to copper, reduced stress |
| CTE (Z-axis) | -55°C to +288°C | 37 ppm/°C | Reliable PTH reliability |
| Thermal Conductivity | 80°C | 0.6 W/(m·K) | Improved power handling |
| Moisture Absorption | D48/50 | 0.02% | Excellent for outdoor antennas |
| Tg (TMA) | – | >280°C | Withstands lead-free processing |
| Density | – | 1.8 g/cm³ | Lightweight |
| Copper Peel Strength | 1 oz EDC, post solder float | 1.2 N/mm (6.9 lbs/in) | Reliable copper adhesion |
| Flammability | UL 94 | Non-FR | Application-specific |
| Lead-Free Process Compatible | – | Yes | Ready for modern assembly |
PCB Stackup & Construction
The board features a robust 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper
Dielectric Core: Rogers RO4533™ – 20mil (0.508mm)
Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper
Total Finished Thickness: 0.6mm
Minimum trace and space are 4/5 mils, with a minimum finished hole size of 0.25mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 36 components, 28 total pads (18 thru-hole, 10 top SMT), 17 vias, and 2 nets.
The green top solder mask provides circuit protection and insulation, while the white silkscreen enables clear component identification. The bottom side remains unmasked, which may be beneficial for specific antenna grounding or thermal requirements.
Typical Applications
Thanks to its low loss, controlled Dk, and excellent PIM response, this PCB is ideally suited for:
Cellular infrastructure base station antennas
WiMAX antenna networks
Mobile infrastructure microstrip antenna applications
Passive intermodulation-sensitive designs
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
| MOQ: | 1PCS |
| Price: | 2.99USD/pcs |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
2-Layer RO4533 PCB | 20mil Core | Immersion Gold Finish
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RO4533™ antenna-grade high-frequency laminate. Specifically engineered for mobile infrastructure and base station antenna applications, this ceramic-filled, glass-reinforced hydrocarbon-based material delivers controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response.
![]()
The board measures 123.5mm x 46mm (single piece) with a finished thickness of 0.6mm (including 20mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are an impressive 4/5 mils, with a minimum finished hole size of 0.25mm. No blind vias are used in this construction.
This design features a green top solder mask for circuit protection and component isolation, along with white top silkscreen for clear component identification. The bottom side has no solder mask, optimizing performance where needed. The Immersion Gold surface finish provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | Rogers RO4533™ (Ceramic-filled, glass-reinforced hydrocarbon) |
| Board Dimensions | 123.5mm x 46mm (1 PCB) ±0.15mm |
| Finished Thickness | 0.6mm |
| Core Thickness | 20mil (0.508mm) ±0.0015" |
| Min. Trace / Space | 4 / 5 mils |
| Min. Hole Size | 0.25mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 36 / 28 / 17 / 2 |
Material Advantages: RO4533™
The RO4533™ laminate from Rogers Corporation is a cost-performance material specifically engineered and manufactured to meet the demanding requirements of the antenna market. As part of the RO4500™ Series, this ceramic-filled, glass-reinforced hydrocarbon-based material set extends the capabilities of the successful RO4000® product series into antenna applications.
![]()
Key material highlights:
Fully compatible with conventional FR-4 and high-temperature lead-free solder processing – no special treatment needed for plated through-hole preparation, unlike traditional PTFE-based laminates
Affordable alternative to more conventional PTFE antenna technologies, allowing designers to optimize price and performance
Halogen-free available to meet the most stringent "green" standards
Excellent PIM performance – typical values better than -157 dBc using two 43 dBm swept tones at 1900 MHz
The resin system is designed to provide ideal antenna performance. The CTE in both X and Y directions closely matches that of copper, reducing stresses in the PCB antenna. With a Tg exceeding 280°C, the low Z-axis CTE ensures excellent plated through-hole reliability. These properties, combined with dimensional stability of less than 0.05% (0.2 mm/m), make RO4533 an excellent candidate for printed circuit antenna applications. The material also provides increased thermal conductivity (0.6 W/m·K) over equivalent PTFE/woven glass materials, enabling antenna designs with increased power handling capability.
RO4533™ Material Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (εr) | 10 GHz / 23°C | 3.3 ±0.08 | Controlled, stable Dk for antenna design |
| Dielectric Constant (εr) | 2.5 GHz / 23°C | 3.3 ±0.08 | Consistent performance across bands |
| Dissipation Factor (tan δ) | 2.5 GHz / 23°C | 0.002 | Ultra-low loss for high gain |
| Dissipation Factor (tan δ) | 10 GHz / 23°C | 0.0025 | Maintains low loss at higher frequencies |
| PIM (Typical) | Reflected 43 dBm swept tones | ≤-157 dBc | Excellent for base station antennas |
| Dielectric Strength | 0.51 mm thickness | >500 V/mil | Robust voltage withstand |
| Dimensional Stability | After etch | <0.2 mm/m (<0.2 mils/inch) | Higher yield on large panels |
| CTE (X-axis) | -55°C to +288°C | 13 ppm/°C | Matched to copper, reduced stress |
| CTE (Y-axis) | -55°C to +288°C | 11 ppm/°C | Matched to copper, reduced stress |
| CTE (Z-axis) | -55°C to +288°C | 37 ppm/°C | Reliable PTH reliability |
| Thermal Conductivity | 80°C | 0.6 W/(m·K) | Improved power handling |
| Moisture Absorption | D48/50 | 0.02% | Excellent for outdoor antennas |
| Tg (TMA) | – | >280°C | Withstands lead-free processing |
| Density | – | 1.8 g/cm³ | Lightweight |
| Copper Peel Strength | 1 oz EDC, post solder float | 1.2 N/mm (6.9 lbs/in) | Reliable copper adhesion |
| Flammability | UL 94 | Non-FR | Application-specific |
| Lead-Free Process Compatible | – | Yes | Ready for modern assembly |
PCB Stackup & Construction
The board features a robust 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper
Dielectric Core: Rogers RO4533™ – 20mil (0.508mm)
Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper
Total Finished Thickness: 0.6mm
Minimum trace and space are 4/5 mils, with a minimum finished hole size of 0.25mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 36 components, 28 total pads (18 thru-hole, 10 top SMT), 17 vias, and 2 nets.
The green top solder mask provides circuit protection and insulation, while the white silkscreen enables clear component identification. The bottom side remains unmasked, which may be beneficial for specific antenna grounding or thermal requirements.
Typical Applications
Thanks to its low loss, controlled Dk, and excellent PIM response, this PCB is ideally suited for:
Cellular infrastructure base station antennas
WiMAX antenna networks
Mobile infrastructure microstrip antenna applications
Passive intermodulation-sensitive designs
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.