F4BM245 Copper Clad Laminate: High-Performance PTFE Composite for RF Applications

F4BM245 Copper Clad Laminate: High-Performance PTFE Composite for RF Applications

Taizhou Wangling presents the F4BM245, a premium PTFE glass fabric reinforced copper clad laminate engineered for high-frequency circuit applications. As part of our F4BM series, this material delivers exceptional electrical performance, dimensional stability, and cost-effectiveness—making it an ideal choice for demanding RF and microwave designs.

Electrical Performance

The F4BM245 features a dielectric constant (Dk) of 2.45 ±0.05 at 10 GHz, providing a balanced combination of low loss and stable signal propagation. With a typical dissipation factor (Df) of 0.0012 at 10 GHz and 0.0017 at 20 GHz, this material ensures minimal signal attenuation across a wide frequency range—critical for applications such as satellite communications, base station antennas, and phased array radar systems.

The material's thermal coefficient of dielectric constant is -120 ppm/°C, ensuring stable electrical performance across operating temperatures from -55°C to +260°C. Volume resistivity exceeds 6×10⁶ MΩ·cm, while surface resistivity is ≥1×10⁶ MΩ, providing excellent insulation properties. The Z-direction electrical strength exceeds 25 KV/mm, and XY-direction breakdown voltage exceeds 32 KV, ensuring robust performance under high-voltage conditions.

F4BM245 Data Sheet

Thermal and Mechanical Stability

F4BM245 exhibits outstanding thermal and mechanical characteristics. The coefficient of thermal expansion (CTE) is 20-25 ppm/°C in the XY direction and 187 ppm/°C in the Z direction, enabling reliable plated through-hole integrity during thermal cycling. With a thermal conductivity of 0.30 W/(M·K), the material efficiently dissipates heat from active components.

The material withstands thermal stress testing at 260°C for 10 seconds over three cycles without delamination, confirming its suitability for lead-free soldering processes. Moisture absorption is ≤0.08%, ensuring consistent performance in humid environments. The laminate achieves UL 94 V-0 flammability rating and is compatible with long-term operating temperatures up to 260°C.

F4BM245 vs. F4BME245: Copper Foil Options

F4BM245: Features standard electrodeposited (ED) copper foil, ideal for applications without passive intermodulation (PIM) requirements. Peel strength exceeds 1.8 N/mm for 1 oz copper.

F4BME245: Features reverse treated (RTF) copper foil, delivering excellent PIM performance (≤ -159 dBc), more precise circuit line control, and lower conductor loss—perfect for high-sensitivity RF systems.

Manufacturing : Processing and Production

As a leading manufacturer of PTFE-based circuit materials, we leverage advanced production capabilities to ensure consistent quality. Our manufacturing process employs precision-controlled resin impregnation, lamination, and curing technologies. The glass fabric reinforcement combined with PTFE resin undergoes rigorous quality control at every stage.

Processing Advantages:

F4BM245 can be fabricated using standard PCB processing techniques

• Compatible with mechanical drilling, routing, and shearing
• Resistant to all common etching solvents and reagents
• Supports both through-hole and surface-mount assembly processes

Production Capacity and Supply Chain

With state-of-the-art manufacturing facilities, we maintain significant production capacity to meet both prototype and high-volume demands. Our flexible production lines can accommodate:

Standard panel sizes: 460×610mm, 500×600mm, 850×1200mm, 914×1220mm, and 1000×1200mm

Custom dimensions available upon request (special sizes such as 300×250mm, 500×500mm, etc.)

Thickness options from 0.1mm to 12.0mm (specify whether total thickness or dielectric thickness)

Multiple copper foil weights: 0.5 oz, 1 oz, 1.5 oz, and 2 oz for F4BM; 0.5 oz and 1 oz for F4BME

Storage and Transportation Guidelines

To ensure product integrity and performance, we adhere to strict storage and handling protocols:

Storage:

Store in a clean, dry environment with temperatures between 10°C and 35°C

Maintain relative humidity below 70%

Keep materials in original packaging until ready for use

Avoid exposure to direct sunlight and corrosive atmospheres

Recommended shelf life is 12 months under proper storage conditions

Transportation:

Laminates are packaged with protective interleaving and moisture-resistant materials

Secure packaging prevents edge damage and warpage during transit

Multiple packaging options available for domestic and international shipping

Compliance with international shipping regulations for electronic materials

Customization and Support

We offer extensive customization options to meet your specific design requirements. Whether you need special dimensions, non-standard thicknesses, or metal-backed configurations (aluminum or copper base for enhanced heat dissipation or shielding), our engineering team is ready to assist.

The F4BM series also supports metal-backed configurations:

F4BM245-AL: Aluminum-backed for lightweight thermal management

F4BM245-CU: Copper-backed for superior heat dissipation

Why Choose F4BM245?

With its combination of stable electrical properties, excellent thermal performance, and cost-effective manufacturability, F4BM245 represents an outstanding value for high-frequency circuit applications. Our commitment to quality, flexible production capacity, and reliable supply chain ensure that you receive consistent, high-performance materials when you need them.

Contact Bicheng today to discuss your application requirements and discover how F4BM245 can optimize your next RF design.