| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
IsoClad 917 (εr=2.17) High-Frequency Laminate: Engineered for Conformal and Precision RF Circuits
As your trusted supplier for advanced PCB materials, we present the IsoClad 917 laminate, a premier PTFE-based composite reinforced with non-woven fiberglass. This material is specifically engineered for radio frequency (RF) and microwave applications where ultra-low signal loss, exceptional dimensional stability, and mechanical conformity are paramount.
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Electrical Performance
The IsoClad 917 is distinguished by its outstanding electrical properties, central to high-frequency performance. It features a low dielectric constant (Dk) of 2.17 and an extremely low dissipation factor (Df) of 0.0013 at 10 GHz. This ultra-low loss tangent is critical for minimizing signal attenuation in sensitive RF chains, ensuring maximum power transfer and signal integrity in demanding applications. The non-woven fiberglass reinforcement provides highly isotropic properties in the X, Y, and Z directions, leading to consistent electrical behavior regardless of signal orientation or circuit layout, which is a significant advantage over traditional woven-glass materials.
Mechanical Properties
Beyond its electrical excellence, IsoClad 917 offers a unique mechanical profile. The non-woven fiberglass/PTFE matrix creates a laminate that is less rigid than its woven-glass counterparts, providing superior conformability. This makes it an ideal substrate for conformal antennas that must adhere to curved surfaces in aerospace or vehicle-mounted systems. Despite this flexibility, it maintains robust mechanical strength with a high tensile modulus (133 kpsi) and excellent peel strength (10 lbs/in), ensuring reliable copper adhesion and durability through assembly and thermal cycles.
The laminate exhibits excellent dimensional stability and a low, predictable coefficient of thermal expansion (CTE), with values of 46 ppm/°C in the X-axis and 47 ppm/°C in the Y-axis. This thermal stability is crucial for maintaining circuit alignment and plated through-hole integrity in environments with wide temperature fluctuations, such as in missile guidance or radar systems.
Typical Properties: IsoClad 917
| Property | IsoClad 917 | Condition | Test Method |
| Dielectric Constant @ 10 GHz | 2.17, 2.20 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Er (ppm/°C) | -157 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength (lbs.per inch) | 10 | After Thermal | IPC TM-650 2.4.8 |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 10 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 1.0 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance (seconds) | >180 | D48/50 | ASTM D-495 |
| Tensile Modulus (kpsi) | 133, 120 | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 4.3, 3.8 | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 182 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 213 | A, 23°C | ASTM D-790 |
| Dielectric Breakdown (kv) | >45 | D48/50 | ASTM D-149 |
| Density (g/cm3) | 2.23 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.04 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Coefficient of Thermal | 0°C to 100°C | IPC TM-650 2.4.24 | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | 46 | Thermomechanical | |
| Y Axis | 47 | Analyzer | |
| Z Axis | 236 | ||
| Thermal Conductivity (W/mK) | 0.263 | 100°C | ASTM E-1225 |
| Outgassing | 125°C, ≤10-6 torr | ||
| Total Mass Loss (%) | 0.02 | Maximum 1.00% | |
| Collected Volatile | 0.00 | Maximum 0.10% | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.02 | ||
| Visible Condensate (±) | NO | ||
| Flammability | Meets requirements of UL94-V0 |
C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
Key Features and Benefits for PCB Fabricators and Designers:
Extremely Low Loss: Df of 0.0013 enables high-efficiency circuits for critical signal paths.
High Isotropy: Uniform electrical and mechanical properties in all directions simplify design and predict performance.
Conformable Nature: Enables the fabrication of antennas and circuits on non-planar surfaces.
Proven Reliability: Meets UL94 V-0 flammability standards and exhibits low outgassing, suitable for aerospace and vacuum environments.
Low Water Absorption: At 0.04%, it ensures stable performance in humid conditions.
Typical Applications:
Conformal and Phased Array Antennas
Stripline and Microstrip Circuits for Radar & Electronic Warfare (EW)
Missile Guidance Systems
High-Frequency Test & Measurement Probes
For your most challenging RF and microwave PCB projects that demand minimal loss and reliable performance in dynamic physical environments, the IsoClad 917 (217) laminate is the superior choice.
Contact our technical sales team to discuss your specific application needs, request material samples, or get a quote. We are here to support your fabrication process with the right high-performance material solutions.
| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
IsoClad 917 (εr=2.17) High-Frequency Laminate: Engineered for Conformal and Precision RF Circuits
As your trusted supplier for advanced PCB materials, we present the IsoClad 917 laminate, a premier PTFE-based composite reinforced with non-woven fiberglass. This material is specifically engineered for radio frequency (RF) and microwave applications where ultra-low signal loss, exceptional dimensional stability, and mechanical conformity are paramount.
![]()
Electrical Performance
The IsoClad 917 is distinguished by its outstanding electrical properties, central to high-frequency performance. It features a low dielectric constant (Dk) of 2.17 and an extremely low dissipation factor (Df) of 0.0013 at 10 GHz. This ultra-low loss tangent is critical for minimizing signal attenuation in sensitive RF chains, ensuring maximum power transfer and signal integrity in demanding applications. The non-woven fiberglass reinforcement provides highly isotropic properties in the X, Y, and Z directions, leading to consistent electrical behavior regardless of signal orientation or circuit layout, which is a significant advantage over traditional woven-glass materials.
Mechanical Properties
Beyond its electrical excellence, IsoClad 917 offers a unique mechanical profile. The non-woven fiberglass/PTFE matrix creates a laminate that is less rigid than its woven-glass counterparts, providing superior conformability. This makes it an ideal substrate for conformal antennas that must adhere to curved surfaces in aerospace or vehicle-mounted systems. Despite this flexibility, it maintains robust mechanical strength with a high tensile modulus (133 kpsi) and excellent peel strength (10 lbs/in), ensuring reliable copper adhesion and durability through assembly and thermal cycles.
The laminate exhibits excellent dimensional stability and a low, predictable coefficient of thermal expansion (CTE), with values of 46 ppm/°C in the X-axis and 47 ppm/°C in the Y-axis. This thermal stability is crucial for maintaining circuit alignment and plated through-hole integrity in environments with wide temperature fluctuations, such as in missile guidance or radar systems.
Typical Properties: IsoClad 917
| Property | IsoClad 917 | Condition | Test Method |
| Dielectric Constant @ 10 GHz | 2.17, 2.20 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Er (ppm/°C) | -157 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength (lbs.per inch) | 10 | After Thermal | IPC TM-650 2.4.8 |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 10 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 1.0 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance (seconds) | >180 | D48/50 | ASTM D-495 |
| Tensile Modulus (kpsi) | 133, 120 | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 4.3, 3.8 | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 182 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 213 | A, 23°C | ASTM D-790 |
| Dielectric Breakdown (kv) | >45 | D48/50 | ASTM D-149 |
| Density (g/cm3) | 2.23 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.04 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Coefficient of Thermal | 0°C to 100°C | IPC TM-650 2.4.24 | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | 46 | Thermomechanical | |
| Y Axis | 47 | Analyzer | |
| Z Axis | 236 | ||
| Thermal Conductivity (W/mK) | 0.263 | 100°C | ASTM E-1225 |
| Outgassing | 125°C, ≤10-6 torr | ||
| Total Mass Loss (%) | 0.02 | Maximum 1.00% | |
| Collected Volatile | 0.00 | Maximum 0.10% | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.02 | ||
| Visible Condensate (±) | NO | ||
| Flammability | Meets requirements of UL94-V0 |
C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
Key Features and Benefits for PCB Fabricators and Designers:
Extremely Low Loss: Df of 0.0013 enables high-efficiency circuits for critical signal paths.
High Isotropy: Uniform electrical and mechanical properties in all directions simplify design and predict performance.
Conformable Nature: Enables the fabrication of antennas and circuits on non-planar surfaces.
Proven Reliability: Meets UL94 V-0 flammability standards and exhibits low outgassing, suitable for aerospace and vacuum environments.
Low Water Absorption: At 0.04%, it ensures stable performance in humid conditions.
Typical Applications:
Conformal and Phased Array Antennas
Stripline and Microstrip Circuits for Radar & Electronic Warfare (EW)
Missile Guidance Systems
High-Frequency Test & Measurement Probes
For your most challenging RF and microwave PCB projects that demand minimal loss and reliable performance in dynamic physical environments, the IsoClad 917 (217) laminate is the superior choice.
Contact our technical sales team to discuss your specific application needs, request material samples, or get a quote. We are here to support your fabrication process with the right high-performance material solutions.