F4BME217 material both laryer 1oz Copper Clad Laminate using in RF antenna microwave app

F4BME217 Ultra-Low Loss Copper Clad Laminate Description

The F4BME217 is a premium, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate engineered for the most demanding microwave and millimeter-wave applications where minimal signal attenuation and superior electrical stability are paramount. As the foundation of the "E" series from Taizhou Wangling Insulation Material Factory, this material delivers the lowest dielectric constant and loss in the product family, combined with industry-leading Passive Intermodulation (PIM) performance, making it an ideal choice for high-sensitivity RF systems and a direct replacement for imported high-frequency substrates.

Core Technology and Composition
This laminate is manufactured using a precision formulation of high-quality woven glass fiber cloth and PTFE resin, optimized to achieve an exceptionally low dielectric constant. The defining characteristic of the F4BME series is its lamination with reverse-treated foil (RTF) copper. This specialized foil is crucial for the F4BME217's performance, enabling excellent PIM characteristics (≤-159 dBc), providing superior etching definition for ultra-fine line circuits, and minimizing conductor loss—a critical factor at high frequencies where skin effect is pronounced.

F4BME217 Data Sheet

Key Electrical Specifications

Dielectric Constant (Dk): An ultra-low nominal value of 2.17 at 10 GHz, with an exceptionally tight tolerance of ±0.04. This facilitates designs with low signal dispersion and minimal phase distortion.

Dissipation Factor (Df): Features an ultra-low loss tangent of 0.001 at 10 GHz and 0.0014 at 20 GHz, ensuring maximum signal integrity and efficiency in high-frequency transmission.

Dielectric Constant Temperature Coefficient (TcDk): -150 ppm/°C over the range of -55°C to +150°C, providing predictable performance across extreme temperature environments.

Standard Product Specifications

Copper Foil: Standard configuration uses 1 oz (0.035mm) Reverse Treated Foil (RTF). A 0.5 oz (0.018mm) RTF option is available for millimeter-wave and high-density interconnect applications.

Standard Thickness: Offered in a comprehensive range of total or dielectric-only thicknesses. For the F4BME217 (Dk ≤ 2.65), the minimum achievable dielectric core thickness is an impressive 0.1mm. Standard thicknesses include 0.127mm, 0.254mm, 0.508mm, and 0.762mm, each with precise manufacturing tolerances (e.g., 0.254mm ±0.02mm).

Standard Panel Sizes: Includes industry-standard sizes such as 460mm x 610mm, 500mm x 600mm, and 914mm x 1220mm for optimal manufacturing yield. Custom panel sizes are available upon request.

Mechanical and Thermal Characteristics:

Peel Strength: >1.6 N/mm (with 1 oz RTF copper), ensuring reliable bond integrity.

Coefficient of Thermal Expansion (CTE): XY-direction: 25-34 ppm/°C; Z-direction: 240 ppm/°C (-55°C to 288°C).

Thermal Conductivity (Z-direction): 0.24 W/(m·K).

Operating Temperature Range: -55°C to +260°C.

Flammability Rating: UL 94 V-0.

Additional Critical Properties:

Insulation Resistance: Volume resistivity ≥6x10⁶ MΩ·cm; surface resistivity ≥1x10⁶ MΩ.

Moisture Absorption: ≤0.08%, ensuring performance stability.

Process Reliability: Passes stringent thermal stress testing (260°C solder dip, 10 seconds, 3 cycles) without delamination.

Electrical Strength: >23 kV/mm (Z-direction) and >30 kV breakdown voltage (XY-direction).

Primary Application Areas

Low-Noise Amplifiers (LNAs) and High-Frequency Receivers

Millimeter-Wave Radar and Communication Systems (e.g., 5G/6G, automotive radar)

Satellite Communication Payloads and Phased Array Antennas

Precision Test & Measurement Equipment

Any application requiring ultra-low loss and stable phase response

Summary
In summary, the F4BME217 copper clad laminate represents the pinnacle of low-loss PTFE-based materials. It provides an ultra-low and stable dielectric constant of 2.17, unmatched loss characteristics, and guaranteed ultra-low PIM performance. Its ability to be produced in extremely thin dielectric layers makes it indispensable for next-generation high-frequency and millimeter-wave designs across aerospace, defense, telecommunications, and advanced research sectors.